型号
- 型号
- 关键词
Dual PLLs for 46/49 MHz Cordless Telephones
厂商名称：Motorola ( NXP )
厂商官网：https://www.nxp.com
下载文档| 型号 | MC145169DW | MC145169P | MC145168P |
|---|---|---|---|
| 描述 | Dual PLLs for 46/49 MHz Cordless Telephones | Dual PLLs for 46/49 MHz Cordless Telephones | Dual PLLs for 46/49 MHz Cordless Telephones |
| 厂商名称 | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
| 零件包装代码 | SOIC | DIP | DIP |
| 包装说明 | SOP, SOP16,.4 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| 针数 | 16 | 16 | 16 |
| Reach Compliance Code | unknow | unknow | unknow |
| 模拟集成电路 - 其他类型 | PLL FREQUENCY SYNTHESIZER | PLL FREQUENCY SYNTHESIZER | PLL FREQUENCY SYNTHESIZER |
| JESD-30 代码 | R-PDSO-G16 | R-PDIP-T16 | R-PDIP-T16 |
| JESD-609代码 | e0 | e0 | e0 |
| 长度 | 10.3 mm | 19.175 mm | 19.175 mm |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 |
| 最高工作温度 | 75 °C | 75 °C | 75 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | DIP | DIP |
| 封装等效代码 | SOP16,.4 | DIP16,.3 | DIP16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | IN-LINE |
| 电源 | 3/5 V | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.65 mm | 4.44 mm | 4.44 mm |
| 最大供电电流 (Isup) | 6.2 mA | 6.2 mA | 6.2 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | OTHER | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL |
| 宽度 | 7.5 mm | 7.62 mm | 7.62 mm |