#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
** The formulas given are for the typical characteristics only at 25
_
C.
†To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in
µA
(per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.002.
PIN ASSIGNMENTS
MC14555B
EA
AA
BA
Q0A
Q1A
Q2A
Q3A
VSS
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
VDD
EB
AB
BB
Q0B
Q1B
Q2B
Q3B
EA
AA
BA
Q0A
Q1A
Q2A
Q3A
VSS
MC14556B
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
VDD
EB
AB
BB
Q0B
Q1B
Q2B
Q3B
MC14555B MC14556B
2
MOTOROLA CMOS LOGIC DATA
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
SWITCHING CHARACTERISTICS*
(CL = 50 pF, TA = 25
_
C)
Characteristic
Output Rise and Fall Time
tTLH, tTHL = (1.5 ns/pF) CL + 25 ns
tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns
tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns
Propagation Delay Time — A, B to Output
tPLH, tPHL = (1.7 ns/pF) CL + 135 ns
tPLH, tPHL = (0.66 ns/pF) CL + 62 ns
tPLH, tPHL = (0.5 ns/pF) CL + 45 ns
Propagation Delay Time — E to Output
tPLH, tPHL = (1.7 ns/pF) CL + 115 ns
tPLH, tPHL = (0.66 ns/pF) CL + 52 ns
tPLH, tPHL = (0.5 ns/pF) CL + 40 ns
Symbol
tTLH,
tTHL
VDD
5.0
10
15
5.0
10
15
5.0
10
15
Min
—
—
—
—
—
—
—
—
—
Typ #
100
50
40
220
95
70
200
85
65
Max
200
100
80
440
190
140
ns
400
170
130
Unit
ns
tPLH,
tPHL
ns
tPLH,
tPHL
* The formulas given are for the typical characteristics only at 25
_
C.
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
INPUT E LOW
20 ns
20 ns
90%
50%
10%
VDD
VSS
VDD
VSS
VOH
VOL
20 ns
INPUT B
tPHL
OUTPUT Q3
MC14556B
tTHL
tPLH
OUTPUT Q3
MC14555B
tTLH
90%
50%
10%
INPUT A HIGH, INPUT E LOW
20 ns
90%
50%
10%
tPLH
VDD
VSS
VOH
A INPUTS
(50% DUTY CYCLE)
1
2f
B INPUTS
(50% DUTY CYCLE)
OUTPUT Q1
All 8 outputs connect to respective CL loads.
f in respect to a system clock.
90%
50%
10%
V
tTLH OL
tPHL
VOH
VOL
tTHL
Figure 1. Dynamic Power Dissipation Signal Waveforms
Figure 2. Dynamic Signal Waveforms
LOGIC DIAGRAM
(1/2 of Dual)
*
A
*
B
*
E
*
* Eliminated for MC14555B
Q3
Q2
Q1
Q0
MOTOROLA CMOS LOGIC DATA
MC14555B MC14556B
3
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
–A–
16
9
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
DIM
A
B
C
D
E
F
G
H
K
L
M
N
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
–––
0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0
_
15
_
0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
–––
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0
_
15
_
0.51
1.01
–B–
1
8
C
L
–T–
SEATING
PLANE
N
E
F
D
G
16 PL
K
M
J
16 PL
0.25 (0.010)
M
M
T B
S
0.25 (0.010)
T A
S
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
–A–
16
9
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0
_
10
_
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0
_
10
_
0.51
1.01
B
1
8
F
S
C
L
–T–
H
G
D
16 PL
SEATING
PLANE
K
J
T A
M
M
0.25 (0.010)
M
MC14555B MC14556B
4
MOTOROLA CMOS LOGIC DATA
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0
_
7
_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0
_
7
_
0.229
0.244
0.010
0.019
16
9
–B–
1
8
P
8 PL
0.25 (0.010)
M
B
S
G
F
K
C
–T–
SEATING
PLANE
R
X 45
_
M
D
16 PL
M
J
0.25 (0.010)
T B
S
A
S
DIM
A
B
C
D
F
G
J
K
M
P
R
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,
and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided
in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters,
including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent
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Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
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