型号
- 型号
- 关键词
| 型号 | MC4318F | MC4019F | MC4317L |
|---|---|---|---|
| 描述 | IC,COUNTER,UP,4-BIT BINARY,TTL,FP,16PIN,CERAMIC | IC,COUNTER,UP,2-BIT BINARY,TTL,FP,16PIN,CERAMIC | IC,COUNTER,UP,BI-QUINARY,TTL,DIP,16PIN,CERAMIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 包装说明 | DFP, FL16,.3 | DFP, FL16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown |
| 计数方向 | UP | UP | UP |
| JESD-30 代码 | R-XDFP-F16 | R-XDFP-F16 | R-XDIP-T16 |
| JESD-609代码 | e0 | e0 | e0 |
| 负载/预设输入 | YES | YES | YES |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 功能数量 | 1 | 2 | 1 |
| 端子数量 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 70 °C | 125 °C |
| 最低工作温度 | -55 °C | - | -55 °C |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DFP | DFP | DIP |
| 封装等效代码 | FL16,.3 | FL16,.3 | DIP16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | FLATPACK | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | YES | YES | NO |
| 技术 | TTL | TTL | TTL |
| 温度等级 | MILITARY | COMMERCIAL | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT | FLAT | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 |
| 逻辑集成电路类型 | BINARY COUNTER | BINARY COUNTER | - |
RF/无线
RF/无线
Microchip MCU
电源技术
嵌入式系统
工控电子
