型号
- 型号
- 关键词
IC,USART,MOS,DIP,28PIN,CERAMIC
器件类别：微控制器和处理器
厂商名称：NXP(恩智浦)
厂商官网：https://www.nxp.com
下载文档| 型号 | MC68661CLDS | MC68661CL | MC68661CP | MC68661CLD |
|---|---|---|---|---|
| 描述 | IC,USART,MOS,DIP,28PIN,CERAMIC | IC,USART,MOS,DIP,28PIN,CERAMIC | IC,USART,MOS,DIP,28PIN,PLASTIC | IC,USART,MOS,DIP,28PIN,CERAMIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 包装说明 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-XDIP-T28 | R-XDIP-T28 | R-PDIP-T28 | R-XDIP-T28 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 端子数量 | 28 | 28 | 28 | 28 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC |
| 封装代码 | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | 5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO |
| 技术 | MOS | MOS | MOS | MOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
| Base Number Matches | 1 | 1 | 1 | 1 |