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MC7447AVU733NB

32-BIT, 733MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-360

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:Rochester Electronics

厂商官网:https://www.rocelec.com/

器件标准:

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器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
符合
厂商名称
Rochester Electronics
零件包装代码
BGA
包装说明
25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-360
针数
360
Reach Compliance Code
unknown
其他特性
ALSO REQUIRES 1.8V OR 2.5V SUPPLY
地址总线宽度
36
位大小
32
边界扫描
YES
最大时钟频率
167 MHz
外部数据总线宽度
64
格式
FLOATING POINT
集成缓存
YES
JESD-30 代码
S-CBGA-B360
JESD-609代码
e2
长度
25 mm
低功率模式
YES
湿度敏感等级
1
端子数量
360
封装主体材料
CERAMIC, METAL-SEALED COFIRED
封装代码
BGA
封装形状
SQUARE
封装形式
GRID ARRAY
峰值回流温度(摄氏度)
260
认证状态
COMMERCIAL
座面最大高度
2.8 mm
速度
733 MHz
最大供电电压
1.35 V
最小供电电压
1.25 V
标称供电电压
1.3 V
表面贴装
YES
技术
CMOS
端子面层
TIN COPPER/TIN SILVER
端子形式
BALL
端子节距
1.27 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
40
宽度
25 mm
uPs/uCs/外围集成电路类型
MICROPROCESSOR, RISC
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Freescale Semiconductor
Technical Data
MPC7447AEC
Rev. 5, 01/2006
MPC7447A
RISC Microprocessor
Hardware Specifications
This document is primarily concerned with the PowerPC™
MPC7447A; however, unless otherwise noted, all
information here also applies to the MPC7447. The
MPC7447A is an implementation of the PowerPC
microprocessor family of reduced instruction set computer
(RISC) microprocessors. This document describes pertinent
electrical and physical characteristics of the MPC7447A. For
functional characteristics of the processor, refer to the
MPC7450 RISC Microprocessor Family Reference Manual.
To locate any published updates for this document, refer to
the Freescale website located at
http://www.freescale.com.
Contents
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Comparison with the MPC7447, MPC7445, and
MPC7441 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Electrical and Thermal Characteristics . . . . . . . . . . . . 9
Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Pinout Listings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Package Description . . . . . . . . . . . . . . . . . . . . . . . . . 27
System Design Information . . . . . . . . . . . . . . . . . . . 34
Document Revision History . . . . . . . . . . . . . . . . . . . 52
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 52
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
1
Overview
The MPC7447A is the fifth implementation of the
fourth-generation (G4) microprocessors from Freescale. The
MPC7447A implements the full PowerPC 32-bit
architecture and is targeted at networking and computing
systems applications. The MPC7447A consists of a
processor core and a 512-Kbyte L2.
Figure 1
shows a block diagram of the MPC7447A. The core
is a high-performance superscalar design supporting a
double-precision floating-point unit and a SIMD multimedia
unit. The memory storage subsystem supports the MPX bus
protocol and a subset of the 60x bus protocol to main
memory and other system resources.
© Freescale Semiconductor, Inc., 2006. All rights reserved.
2
Instruction Unit
Branch Processing Unit
Fetcher
Tags
IBAT Array
BHT (2048-Entry)
Dispatch
Unit
Data MMU
SRs
(Original)
VR Issue
(4-Entry/2-Issue)
DBAT Array
GPR Issue
(6-Entry/3-Issue)
FPR Issue
(2-Entry/1-Issue)
128-Entry
DTLB
Tags
LR
BTIC (128-Entry)
CTR
Instruction Queue
(12-Word)
SRs
(Shadow)
128-Entry
ITLB
Instruction MMU
128-Bit (4 Instructions)
32-Kbyte
I Cache
32-Kbyte
D Cache
Reservation
Stations (2-Entry)
EA
Load/Store Unit
Vector Touch Engine
+ (EA Calculation)
Finished
Stores
L1 Castout
PA
FPR File
16 Rename
Buffers
Reservation
Stations (2)
Completes up
to three
instructions
per clock
VR File
16 Rename
Buffers
Integer
Unit 2
Vector
FPU
32-Bit
128-Bit
128-Bit
+++
32-Bit
32-Bit
Integer
Integer
Integer
Unit 122
Unit
Unit
(3)
16 Rename
Buffers
Reservation
Stations (2)
GPR File
Reservation
Reservation
Reservation
Station
Station
Station
Vector
Touch
Queue
Floating-
Point Unit
L1 Push
Completed
Stores
+ x÷
FPSCR
Load Miss
64-Bit
64-Bit
Vector
Integer
Unit 1
512-Kbyte Unified L2 Cache Controller
System Bus Interface
Load
Queue (11)
Overview
Additional Features
• Time Base Counter/Decrementer
• Clock Multiplier
• JTAG/COP Interface
• Thermal/Power Management
• Performance Monitor
• Dynamic Frequency Switching (DFS)
• Temperature Diode
Completion Unit
96-Bit (3 Instructions)
Completion Queue
(16-Entry)
Reservation Reservation Reservation Reservation
Station
Station
Station
Station
Figure 1. MPC7447A Block Diagram
L1 Service
Queues
Line
Block 0 (32-Byte)
Block 1 (32-Byte)
Tags Status
Status
L1 Castouts
(4)
L2 Store Queue (L2SQ)
Snoop Push/
Interventions
Vector
Permute
Unit
Vector
Integer
Unit 2
Memory Subsystem
L1 Store Queue
(LSQ)
MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5
L1 Load Queue (LLQ)
L1 Load Miss (5)
Bus Store Queue
Castout
Queue (5) /
Push
Queue (6)
1
Bus Accumulator
L2 Prefetch (3)
Instruction Fetch (2)
Cacheable Store Miss (1)
36-Bit
Address Bus
64-Bit
Data Bus
Freescale Semiconductor
Notes:
The Castout Queue and Push Queue share resources such that they have a combined total of 6 entries.
The Castout Queue itself is limited to 9 entries, ensuring 1 entry will be available for a push.
Features
NOTE
The MPC7447A is a footprint-compatible, drop-in replacement in an
MPC7447 application if the core power supply is 1.3 V.
2
Features
This section summarizes features of the MPC7447A implementation of the PowerPC architecture.
Major features of the MPC7447A are as follows:
High-performance, superscalar microprocessor
— Up to four instructions can be fetched from the instruction cache at a time.
— Up to 12 instructions can be in the instruction queue (IQ).
— Up to 16 instructions can be at some stage of execution simultaneously.
— Single-cycle execution for most instructions
— One instruction per clock cycle throughput for most instructions
— Seven-stage pipeline control
Eleven independent execution units and three register files
— Branch processing unit (BPU) features static and dynamic branch prediction
– 128-entry (32-set, four-way set-associative) branch target instruction cache (BTIC), a cache
of branch instructions that have been encountered in branch/loop code sequences. If a target
instruction is in the BTIC, it is fetched into the instruction queue a cycle sooner than it can
be made available from the instruction cache. Typically, a fetch that hits the BTIC provides
the first four instructions in the target stream.
– 2048-entry branch history table (BHT) with 2 bits per entry for four levels of
prediction—not taken, strongly not taken, taken, and strongly taken
– Up to three outstanding speculative branches
– Branch instructions that do not update the count register (CTR) or link register (LR) are
often removed from the instruction stream.
– Eight-entry link register stack to predict the target address of Branch Conditional to Link
Register (bclr) instructions
— Four integer units (IUs) that share 32 GPRs for integer operands
– Three identical IUs (IU1a, IU1b, and IU1c) can execute all integer instructions except
multiply, divide, and move to/from special-purpose register instructions.
– IU2 executes miscellaneous instructions including the CR logical operations, integer
multiplication and division instructions, and move to/from special-purpose register
instructions.
— Five-stage FPU and a 32-entry FPR file
– Fully IEEE 754-1985–compliant FPU for both single- and double-precision operations
– Supports non-IEEE mode for time-critical operations
– Hardware support for denormalized numbers
– Thirty-two 64-bit FPRs for single- or double-precision operands
MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5
Freescale Semiconductor
3
Features
— Four vector units and 32-entry vector register file (VRs)
– Vector permute unit (VPU)
– Vector integer unit 1 (VIU1) handles short-latency AltiVec™ integer instructions, such as
vector add instructions (for example,
vaddsbs, vaddshs,
and
vaddsws).
– Vector integer unit 2 (VIU2) handles longer-latency AltiVec integer instructions, such as
vector multiply add instructions (for example,
vmhaddshs, vmhraddshs,
and
vmladduhm).
– Vector floating-point unit (VFPU)
— Three-stage load/store unit (LSU)
– Supports integer, floating-point, and vector instruction load/store traffic
– Four-entry vector touch queue (VTQ) supports all four architected AltiVec data stream
operations
– 3-cycle GPR and AltiVec load latency (byte, half word, word, vector) with 1-cycle
throughput
– 4-cycle FPR load latency (single, double) with 1-cycle throughput
– No additional delay for misaligned access within double-word boundary
– Dedicated adder calculates effective addresses (EAs)
– Supports store gathering
– Performs alignment, normalization, and precision conversion for floating-point data
– Executes cache control and TLB instructions
– Performs alignment, zero padding, and sign extension for integer data
– Supports hits under misses (multiple outstanding misses)
– Supports both big- and little-endian modes, including misaligned little-endian accesses
Three issue queues, FIQ, VIQ, and GIQ, can accept as many as one, two, and three instructions,
respectively, in a cycle. Instruction dispatch requires the following:
— Instructions can only be dispatched from the three lowest IQ entries—IQ0, IQ1, and IQ2.
— A maximum of three instructions can be dispatched to the issue queues per clock cycle.
— Space must be available in the CQ for an instruction to dispatch. (This includes instructions that
are assigned a space in the CQ but not in an issue queue.)
Rename buffers
— 16 GPR rename buffers
— 16 FPR rename buffers
— 16 VR rename buffers
Dispatch unit
— Decode/dispatch stage fully decodes each instruction
Completion unit
— The completion unit retires an instruction from the 16-entry completion queue (CQ) when all
instructions ahead of it have been completed, the instruction has finished execution, and no
exceptions are pending.
MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5
4
Freescale Semiconductor
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参数对比
与MC7447AVU733NB相近的元器件有:MC7447AVS1000NB、MC7447ATHX1167NB、MC7447AVS1333LB、MC7447AVS1000LB、MC7447AVS733NB。描述及对比如下:
型号 MC7447AVU733NB MC7447AVS1000NB MC7447ATHX1167NB MC7447AVS1333LB MC7447AVS1000LB MC7447AVS733NB
描述 32-BIT, 733MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-360 32-BIT, 1000MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, LGA-360 32-BIT, 1167MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 32-BIT, 1333MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, LGA-360 32-BIT, 1000MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, LGA-360 32-BIT, 733MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, LGA-360
是否无铅 含铅 含铅 含铅 含铅 含铅 含铅
是否Rohs认证 符合 符合 不符合 符合 符合 符合
零件包装代码 BGA LGA BGA LGA LGA LGA
包装说明 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-360 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, LGA-360 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, LGA-360 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, LGA-360 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, LGA-360
针数 360 360 360 360 360 360
Reach Compliance Code unknown unknown unknown unknown unknown unknown
其他特性 ALSO REQUIRES 1.8V OR 2.5V SUPPLY ALSO REQUIRES 1.8V OR 2.5V SUPPLY ALSO REQUIRES 1.8V OR 2.5V SUPPLY ALSO REQUIRES 1.8V OR 2.5V SUPPLY ALSO REQUIRES 1.8V OR 2.5V SUPPLY ALSO REQUIRES 1.8V OR 2.5V SUPPLY
地址总线宽度 36 36 36 36 36 36
位大小 32 32 32 32 32 32
边界扫描 YES YES YES YES YES YES
最大时钟频率 167 MHz 167 MHz 167 MHz 167 MHz 167 MHz 167 MHz
外部数据总线宽度 64 64 64 64 64 64
格式 FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT
集成缓存 YES YES YES YES YES YES
JESD-30 代码 S-CBGA-B360 S-CBGA-X360 S-CBGA-B360 S-CBGA-X360 S-CBGA-X360 S-CBGA-X360
长度 25 mm 25 mm 25 mm 25 mm 25 mm 25 mm
低功率模式 YES YES YES YES YES YES
湿度敏感等级 1 1 1 1 1 1
端子数量 360 360 360 360 360 360
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装代码 BGA CGA BGA CGA CGA CGA
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
峰值回流温度(摄氏度) 260 260 260 260 260 260
认证状态 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
座面最大高度 2.8 mm 2.2 mm 3.24 mm 2.2 mm 2.2 mm 2.2 mm
速度 733 MHz 1000 MHz 1167 MHz 1333 MHz 1000 MHz 733 MHz
最大供电电压 1.35 V 1.35 V 1.35 V 1.35 V 1.35 V 1.35 V
最小供电电压 1.25 V 1.25 V 1.25 V 1.25 V 1.25 V 1.25 V
标称供电电压 1.3 V 1.3 V 1.3 V 1.3 V 1.3 V 1.3 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
端子面层 TIN COPPER/TIN SILVER NOT SPECIFIED TIN LEAD NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
端子形式 BALL UNSPECIFIED BALL UNSPECIFIED UNSPECIFIED UNSPECIFIED
端子节距 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 40 40 40 40 40 40
宽度 25 mm 25 mm 25 mm 25 mm 25 mm 25 mm
uPs/uCs/外围集成电路类型 MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
厂商名称 Rochester Electronics - Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics
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