F/FAST SERIES, QUAD 2-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14
厂商名称:Motorola ( NXP )
厂商官网:https://www.nxp.com
下载文档型号 | MC74F00JD | MC74F00DDR2 | MC74F00DD | MC54F00JD |
---|---|---|---|---|
描述 | F/FAST SERIES, QUAD 2-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14 | NAND Gate, F/FAST Series, 4-Func, 2-Input, TTL, PDSO14, PLASTIC, SOIC-14 | NAND Gate, F/FAST Series, 4-Func, 2-Input, TTL, PDSO14, PLASTIC, SOIC-14 | F/FAST SERIES, QUAD 2-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14 |
包装说明 | DIP, DIP14,.3 | PLASTIC, SOIC-14 | SOP, | DIP, |
Reach Compliance Code | unknown | unknown | unknown | unknown |
系列 | F/FAST | F/FAST | F/FAST | F/FAST |
JESD-30 代码 | R-GDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | R-GDIP-T14 |
长度 | 19.495 mm | 8.65 mm | 8.65 mm | 19.495 mm |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
功能数量 | 4 | 4 | 4 | 4 |
输入次数 | 2 | 2 | 2 | 2 |
端子数量 | 14 | 14 | 14 | 14 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 125 °C |
封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
封装代码 | DIP | SOP | SOP | DIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
最大电源电流(ICC) | 10.2 mA | 10.2 mA | 10.2 mA | 10.2 mA |
传播延迟(tpd) | 5.3 ns | 5.3 ns | 5.3 ns | 6.5 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.08 mm | 1.75 mm | 1.75 mm | 5.08 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | YES | NO |
技术 | TTL | TTL | TTL | TTL |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY |
端子形式 | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
宽度 | 7.62 mm | 3.9 mm | 3.9 mm | 7.62 mm |
Base Number Matches | 1 | 1 | 1 | 1 |