* Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/
_
C from 65
_
to 125
_
C
SOIC Package: – 7 mW/
_
C from 65
_
to 125
_
C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
Min
4.5
0
Max
5.5
Unit
V
V
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage
(Referenced to GND)
Vin, Vout
TA
VCC
Operating Temperature, All Package Types
Input Rise and Fall Time (Figure 1)
– 55
0
+ 125
500
_
C
ns
tr, tf
DC ELECTRICAL CHARACTERISTICS
(Voltages Referenced to GND)
Guaranteed Limit
Symbol
S b l
VIH
VIL
Parameter
P
Test C di i
T
Conditions
VCC
V
4.5
5.5
4.5
5.5
4.5
5.5
4.5
4.5
5.5
4.5
5.5
5.5
– 55 to
25
_
C
2.0
2.0
0.8
0.8
44
5.4
v
85
_
C
v
125
_
C
2.0
2.0
0.8
0.8
4.4
5.4
2.0
2.0
0.8
0.8
4.4
5.4
3.7
0.1
0.1
0.4
Unit
U i
V
V
V
Minimum High–Level Input
Voltage
Vout = 0.1 V or VCC – 0.1 V
|Iout|
20
µA
v
v
v
v
v
v
Maximum Low–Level Input
Voltage
Vout 0.1 V or VCC – 0.1 V
|Iout|
20 mA
Vin = VIH or VIL
|Iout|
20 mA
Vin = VIH or VIL
|Iout|
4.0 mA
Vin = VIH or VIL
|Iout|
20
µA
Vin = VIH or VIL
|Iout|
4.0 mA
VOH
Minimum High–Level Output
Voltage
3.98
0.1
0.1
3.84
0.1
0.1
VOL
Maximum Low–Level Output
Voltage
V
0.26
0.33
Iin
Maximum Input Leakage Current
Maximum Quiescent Supply
Current (per Package)
Vin = VCC or GND
Vin = VCC or GND
Iout = 0
µA
±
0.1
4.0
±
1.0
40
±
1.0
160
µA
µA
ICC
∆I
CC
Additional Quiescent Supply
Current
Vin = 2.4 V, Any One Input
Vin = VCC or GND, Other Inputs
lout = 0
µA
≥
– 55
_
C
2.9
25
_
C to 125
_
C
2.4
5.5
55
mA
A
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
MOTOROLA
2
High–Speed CMOS Logic Data
DL129 — Rev 6
MC74HCT157A
AC ELECTRICAL CHARACTERISTICS
(VCC = 5.0 V
±
10%, CL = 50 pF, Input tr = tf = 6.0 ns)
Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î Î Î
Î Î Î Î
Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î Î Î
Î
ÎÎÎ Î Î Î
Î Î Î Î
Î Î Î Î
Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î
Î Î Î Î Î
Î Î Î Î
Î
Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î Î Î
Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î Î Î
Î Î Î Î
Î Î Î
Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎ Î Î Î
Î
Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î Î Î
ÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î
Guaranteed Limit
Symbol
S b l
tPLH,
tPHL
tPLH,
tPHL
tPLH,
tPHL
tTLH,
tTHL
tr, tf
Parameter
P
– 55 to
25
_
C
27
37
30
15
v
85
_
C
34
46
38
19
v
125
_
C
41
56
45
22
Unit
U i
ns
ns
ns
ns
ns
Maximum Propagation Delay, Input A or B to Output Y
(Figures 1 and 4)
Maximum Propagation Delay, Select to Output Y
(Figures 2 and 4)
Maximum Propagation Delay, Output Enable to Output Y
(Figures 3 and 4)
Maximum Output Transition Time, Any Output
(Figures 1 and 4)
Maximum Input Rise and Fall Time
500
500
500
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the Motorola High–
Speed CMOS Data Book (DL129/D).
Typical @ 25°C, VCC = 5.0 V
64
CPD
Power Di i i C
P
Dissipation Capacitance (P T
i
(Per Transceiver Ch
i
Channel)*
l)*
pF
F
* Used to determine the no–load dynamic power consumption: P D = C PD V CC 2 f + I CC V CC . For load considerations, see Chapter 2 of the
Motorola High–Speed CMOS Data Book (DL129/D).
PIN DESCRIPTIONS
INPUTS
A0, A1, A2, A3 (Pins 2, 5, 11, 14)
Nibble A inputs. The data present on these pins is trans-
ferred to the outputs when the Select input is at a low level
and the Output Enable input is at a low level. The data is
presented to the outputs in noninverted form.
B0, B1, B2, B3 (Pins 3, 6, 10, 13)
Nibble B inputs. The data present on these pins is trans-
ferred to the outputs when the Select input is at a high level
and the Output Enable input is at a low level. The data is
presented to the outputs in noninverted form.
OUTPUTS
Y0, Y1, Y2, Y3 (Pins 4, 7, 9, 12)
Data outputs. The selected input Nibble is presented at
these outputs when the Output Enable input is at a low level.
The data is presented to the outputs in noninverted form. For
the Output Enable input at a high level, the outputs are at a
low level.
CONTROL INPUTS
Select (Pin 1)
Nibble select. This input determines the data word to be
transferred to the outputs. A low level on this input selects
the A inputs and a high level selects the B inputs.
Output Enable (Pin 15)
Output Enable input. A low level on this input allows the
selected input data to be presented at the outputs. A high
level on this input sets all outputs to a low level.
High–Speed CMOS Logic Data
DL129 — Rev 6
3
MOTOROLA
MC74HCT157A
EXPANDED LOGIC DIAGRAM
A0
B0
A1
B1
NIBBLE
INPUTS
A2
B2
A3
B3
OUTPUT ENABLE
SELECT
2
3
5
6
11
10
14
13
12 Y3
9
Y2
7
Y1
DATA
OUTPUTS
4
Y0
SWITCHING WAVEFORMS
tr
INPUT A OR B
tPLH
OUTPUT Y
tTLH
90%
1.3 V
10%
tTHL
2.7 V
1.3 V
0.3 V
tPHL
tf
tr
3V
SELECT
GND
tPLH
OUTPUT Y
90%
1.3 V
10%
tTLH
tTHL
2.7 V
1.3 V
0.3 V
tPHL
tf
3V
GND
Figure 1.
Figure 2.
TEST POINT
tr
OUTPUT ENABLE
tPHL
OUTPUT Y
tTHL
90%
1.3 V
10%
tTLH
* Includes all probe and jig capacitance
2.7 V
1.3 V
0.3 V
tPLH
tf
VCC
GND
OUTPUT
DEVICE
UNDER
TEST
CL*
Figure 3.
Figure 4. Test Circuit
MOTOROLA
4
High–Speed CMOS Logic Data
DL129 — Rev 6
MC74HCT157A
OUTLINE DIMENSIONS
N SUFFIX
PLASTIC PACKAGE
CASE 648–08
ISSUE R
B
1
8
–A
–
16
9
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MILLIMETERS
MIN
MAX
MIN
MAX
0.740 0.770 18.80 19.55
6.35
0.250 0.270
6.85
3.69
0.145 0.175
4.44
0.39
0.015 0.021
0.53
1.02
0.040 0.070
1.77
0.100 BSC
2.54 BSC
0.050 BSC
1.27 BSC
0.21
0.008 0.015
0.38
2.80
0.110 0.130
3.30
7.50
0.295 0.305
7.74
0°
0°
10°
10°
0.020 0.040
0.51
1.01
F
S
C
L
–T
–
H
G
D
16 PL
0.25 (0.010)
M
SEATING
PLANE
K
J
T A
M
M
–A
–
16
9
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
–B
–
1
8
P
8 PL
0.25 (0.010)
M
B
M
G
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80 10.00
4.00
3.80
1.75
1.35
0.49
0.35
1.25
0.40
1.27 BSC
0.25
0.19
0.25
0.10
7°
0°
6.20
5.80
0.50
0.25
INCHES
MIN
MAX
0.386 0.393
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
0.008 0.009
0.004 0.009
7°
0°
0.229 0.244
0.010 0.019
K
C
–T
SEATING
–
PLANE
R
X 45°
M
D
16 PL
0.25 (0.010)
M
J
T
B
S
A
S
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
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