Buffers & Line Drivers 1.65-5.5V Single Non-Inverting TTL
厂商官网:http://www.onsemi.cn
器件标准:
下载文档型号 | MC74VHC1GT50DF2G | MC74VHC1GT50DFT1 | MC74VHC1GT50DTT1 | MC74VHC1GT50DT1G | NL17VHC1GT50DFT1 | MC74VHC1GT50DF1G |
---|---|---|---|---|---|---|
描述 | Buffers & Line Drivers 1.65-5.5V Single Non-Inverting TTL | Buffers & Line Drivers 1.65-5.5V Single | Buffers & Line Drivers 1.65-5.5V Single | Buffers & Line Drivers 1.65-5.5V Single Non-Inverting TTL | Buffers & Line Drivers 1.65-5.5V Single | Buffers & Line Drivers 1.65-5.5V Single Non-Inverting TTL |
是否Rohs认证 | 符合 | 不符合 | 不符合 | 符合 | - | 符合 |
厂商名称 | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | - | ON Semiconductor(安森美) |
包装说明 | LEAD FREE, SC-70, SC-88A, SOT-353, 5 PIN | SC-70, SC-88A, SOT-353, 5 PIN | SC-59, SOT-23, TSOP-5 | LEAD FREE, SC-59, SOT-23, TSOP-5 | - | LEAD FREE, SC-70, SC-88A, SOT-353, 5 PIN |
Reach Compliance Code | compliant | not_compliant | not_compliant | unknown | - | compliant |
Factory Lead Time | 1 week | 1 week | 1 week | 1 week | - | 1 week |
系列 | AHC/VHC/H/U/V | AHC/VHC | AHC/VHC | AHC/VHC/H/U/V | - | AHC/VHC/H/U/V |
JESD-30 代码 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | - | R-PDSO-G5 |
JESD-609代码 | e3 | e0 | e0 | e3 | - | e3 |
长度 | 2 mm | 2 mm | 3 mm | 3 mm | - | 2 mm |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | - | 50 pF |
逻辑集成电路类型 | BUFFER | BUFFER | BUFFER | BUFFER | - | BUFFER |
最大I(ol) | 0.008 A | 0.008 A | 0.008 A | 0.008 A | - | 0.008 A |
湿度敏感等级 | 1 | 1 | 1 | 1 | - | 1 |
功能数量 | 1 | 1 | 1 | 1 | - | 1 |
输入次数 | 1 | 1 | 1 | 1 | - | 1 |
端子数量 | 5 | 5 | 5 | 5 | - | 5 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | - | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | - | -55 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
封装代码 | TSSOP | TSSOP | TSSOP | TSSOP | - | TSSOP |
封装等效代码 | TSSOP5/6,.08 | TSSOP5/6,.08 | TSOP5/6,.11,37 | TSSOP6,.08 | - | TSSOP5/6,.08 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
包装方法 | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | - | TAPE AND REEL |
电源 | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | - | 3.3/5 V |
Prop。Delay @ Nom-Sup | 9.5 ns | 9.5 ns | 9.5 ns | 9.5 ns | - | 9.5 ns |
传播延迟(tpd) | 25.5 ns | 25.5 ns | 25.5 ns | 25.5 ns | - | 25.5 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
施密特触发器 | NO | NO | NO | NO | - | NO |
座面最大高度 | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | - | 1.1 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V |
最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V | - | 1.65 V |
标称供电电压 (Vsup) | 5 V | 1.8 V | 1.8 V | 5 V | - | 5 V |
表面贴装 | YES | YES | YES | YES | - | YES |
技术 | CMOS | CMOS | CMOS | CMOS | - | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | - | MILITARY |
端子面层 | Tin (Sn) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin (Sn) | - | Tin (Sn) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | - | GULL WING |
端子节距 | 0.65 mm | 0.65 mm | 0.95 mm | 0.95 mm | - | 0.65 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | - | DUAL |
宽度 | 1.25 mm | 1.25 mm | 1.5 mm | 2 mm | - | 1.25 mm |