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MCP603-I/SN

OP-AMP, 3000 uV OFFSET-MAX, 2.8 MHz BAND WIDTH, PDSO8

器件类别:模拟混合信号IC    放大器电路   

厂商名称:Microchip(微芯科技)

厂商官网:https://www.microchip.com

器件标准:

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
Microchip(微芯科技)
零件包装代码
SOIC
包装说明
SOP, SOP8,.25
针数
8
Reach Compliance Code
compli
ECCN代码
EAR99
Factory Lead Time
8 weeks
Samacsys Descripti
IC, Op Amp, single, 2.7V, c/w CS, I temp, MCP603-I/SN
放大器类型
OPERATIONAL AMPLIFIER
架构
VOLTAGE-FEEDBACK
最大平均偏置电流 (IIB)
0.00006 µA
标称共模抑制比
90 dB
频率补偿
YES
最大输入失调电压
3000 µV
JESD-30 代码
R-PDSO-G8
JESD-609代码
e3
长度
4.9 mm
低-偏置
YES
低-失调
NO
微功率
YES
湿度敏感等级
3
功能数量
1
端子数量
8
最高工作温度
85 °C
最低工作温度
-40 °C
封装主体材料
PLASTIC/EPOXY
封装代码
SOP
封装等效代码
SOP8,.25
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
峰值回流温度(摄氏度)
260
功率
NO
电源
3/5 V
可编程功率
NO
认证状态
Not Qualified
座面最大高度
1.75 mm
标称压摆率
2.3 V/us
最大压摆率
0.325 mA
供电电压上限
7 V
标称供电电压 (Vsup)
5 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
Matte Tin (Sn)
端子形式
GULL WING
端子节距
1.27 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
40
标称均一增益带宽
2800 kHz
最小电压增益
56200
宽带
NO
宽度
3.91 mm
文档预览
MCP601/1R/2/3/4
2.7V to 6.0V Single Supply CMOS Op Amps
Features
Single-Supply: 2.7V to 6.0V
Rail-to-Rail Output
Input Range Includes Ground
Gain Bandwidth Product: 2.8 MHz (typical)
Unity-Gain Stable
Low Quiescent Current: 230 µA/amplifier (typical)
Chip Select (CS):
MCP603 only
Temperature Ranges:
- Industrial: -40°C to +85°C
- Extended: -40°C to +125°C
• Available in Single, Dual, and Quad
Description
The Microchip Technology Inc. MCP601/1R/2/3/4
family of low-power operational amplifiers (op amps)
are offered in single (MCP601), single with Chip Select
(CS) (MCP603), dual (MCP602), and quad (MCP604)
configurations. These op amps utilize an advanced
CMOS technology that provides low bias current, high-
speed operation, high open-loop gain, and rail-to-rail
output swing. This product offering operates with a
single supply voltage that can be as low as 2.7V, while
drawing 230 µA (typical) of quiescent current per
amplifier. In addition, the common mode input voltage
range goes 0.3V below ground, making these
amplifiers ideal for single-supply operation.
These devices are appropriate for low power, battery
operated circuits due to the low quiescent current, for
A/D convert driver amplifiers because of their wide
bandwidth or for anti-aliasing filters by virtue of their low
input bias current.
The MCP601, MCP602, and MCP603 are available in
standard 8-lead PDIP, SOIC, and TSSOP packages.
The MCP601 and MCP601R are also available in a
standard 5-lead SOT-23 package, while the MCP603 is
available in a standard 6-lead SOT-23 package. The
MCP604 is offered in standard 14-lead PDIP, SOIC,
and TSSOP packages.
The MCP601/1R/2/3/4 family is available in the
Industrial and Extended temperature ranges and has a
power supply range of 2.7V to 6.0V.
Typical Applications
Portable Equipment
A/D Converter Driver
Photo Diode Pre-amp
Analog Filters
Data Acquisition
Notebooks and PDAs
Sensor Interface
Available Tools
SPICE Macro Models
FilterLab
®
Software
Mindi™ Simulation Tool
MAPS (Microchip Advanced Part Selector)
Analog Demonstration and Evaluation Boards
Application Notes
Package Types
MCP601
PDIP, SOIC, TSSOP
NC 1
V
IN
– 2
V
IN
+ 3
V
SS
4
8 NC
7 V
DD
6 V
OUT
5 NC
MCP602
PDIP, SOIC, TSSOP
V
OUTA
1
V
INA
– 2
V
INA
+ 3
V
SS
4
8 V
DD
7 V
OUTB
6 V
INB
5 V
INB
+
MCP603
PDIP, SOIC, TSSOP
NC 1
V
IN
– 2
V
IN
+ 3
V
SS
4
8 CS
7 V
DD
6 V
OUT
5 NC
MCP604
PDIP, SOIC, TSSOP
V
OUTA
1
V
INA
– 2
V
INA
+ 3
V
DD
4
V
INB
+ 5
V
INB
– 6
V
OUTB
7
14 V
OUTD
13 V
IND
12 V
IND
+
11 V
SS
10 V
INC
+
9 V
INC
8 V
OUTC
MCP601
SOT23-5
V
OUT
1
V
SS
2
V
IN
+ 3
4 V
IN
5 V
DD
V
OUT
1
V
DD
2
V
IN
+ 3
MCP601R
SOT23-5
5 V
SS
4 V
IN
V
OUT
1
V
SS
2
V
IN
+ 3
MCP603
SOT23-6
6 V
DD
5 CS
4 V
IN
©
2007 Microchip Technology Inc.
DS21314G-page 1
MCP601/1R/2/3/4
1.0
ELECTRICAL
CHARACTERISTICS
† Notice:
Stresses above those listed under “Absolute
Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational listings of this specification is not
implied. Exposure to maximum rating conditions for extended
periods may affect device reliability.
††
See
Section 4.1.2 “Input Voltage and Current Limits”.
Absolute Maximum Ratings †
V
DD
– V
SS
........................................................................7.0V
Current at Input Pins .....................................................±2 mA
Analog Inputs (V
IN
+, V
IN
–)
††
........ V
SS
– 1.0V to V
DD
+ 1.0V
All Other Inputs and Outputs ......... V
SS
– 0.3V to V
DD
+ 0.3V
Difference Input Voltage ...................................... |V
DD
– V
SS
|
Output Short Circuit Current .................................Continuous
Current at Output and Supply Pins ............................±30 mA
Storage Temperature....................................–65°C to +150°C
Maximum Junction Temperature (T
J
) ......................... .+150°C
ESD Protection On All Pins (HBM; MM)
.............. ≥
3 kV; 200V
DC CHARACTERISTICS
Electrical Specifications:
Unless otherwise specified, T
A
= +25°C, V
DD
= +2.7V to +5.5V, V
SS
= GND, V
CM
= V
DD
/2,
V
OUT
V
DD
/2, V
L
= V
DD
/2, and R
L
= 100 kΩ to V
L
, and CS is tied low. (Refer to
Figure 1-2
and
Figure 1-3).
Parameters
Input Offset
Input Offset Voltage
Industrial Temperature
Extended Temperature
Input Offset Temperature Drift
Power Supply Rejection
Input Current and Impedance
Input Bias Current
Industrial Temperature
Extended Temperature
Input Offset Current
Common Mode Input Impedance
Differential Input Impedance
Common Mode
Common Mode Input Range
Common Mode Rejection Ratio
Open-loop Gain
DC Open-loop Gain (large signal)
Sym
V
OS
V
OS
V
OS
ΔV
OS
/ΔT
A
PSRR
I
B
I
B
I
B
I
OS
Z
CM
Z
DIFF
V
CMR
CMRR
A
OL
A
OL
Output
Maximum Output Voltage Swing
Linear Output Voltage Swing
Output Short Circuit Current
Min
-2
-3
-4.5
80
V
SS
– 0.3
75
100
95
Typ
±0.7
±1
±1
±2.5
88
1
20
450
±1
10
13
||6
10
13
||3
90
115
110
Max
+2
+3
+4.5
60
5000
V
DD
– 1.2
Units
mV
mV
mV
µV/°C
dB
Conditions
T
A
= -40°C to +85°C
(Note 1)
T
A
= -40°C to +125°C
(Note 1)
T
A
= -40°C to +125°C
V
DD
= 2.7V to 5.5V
pA
pA T
A
= +85°C
(Note 1)
pA T
A
= +125°C
(Note 1)
pA
Ω||pF
Ω||pF
V
dB
dB
dB
V
DD
= 5.0V, V
CM
= -0.3V to 3.8V
R
L
= 25 kΩ to V
L
,
V
OUT
= 0.1V to V
DD
– 0.1V
R
L
= 5 kΩ to V
L
,
V
OUT
= 0.1V to V
DD
– 0.1V
R
L
= 25 kΩ to V
L
, Output overdrive = 0.5V
R
L
= 5 kΩ to V
L
, Output overdrive = 0.5V
R
L
= 25 kΩ to V
L
, A
OL
100 dB
R
L
= 5 kΩ to V
L
, A
OL
95 dB
V
DD
= 5.5V
V
DD
= 2.7V
V
OL
, V
OH
V
SS
+ 15
V
OL
, V
OH
V
SS
+ 45
V
SS
+ 100
V
OUT
V
OUT
V
SS
+ 100
I
SC
I
SC
±22
±12
V
DD
– 20
V
DD
– 60
V
DD
– 100
V
DD
– 100
mV
mV
mV
mV
mA
mA
Power Supply
Supply Voltage
V
DD
2.7
6.0
V
(Note 2)
230
325
µA I
O
= 0
Quiescent Current per Amplifier
I
Q
Note 1:
These specifications are not tested in either the SOT-23 or TSSOP packages with date codes older than YYWW = 0408.
In these cases, the minimum and maximum values are by design and characterization only.
2:
All parts with date codes November 2007 and later have been screened to ensure operation at V
DD
=6.0V. However, the
other minimum and maximum specifications are measured at 1.4V and/or 5.5V.
DS21314G-page 2
©
2007 Microchip Technology Inc.
MCP601/1R/2/3/4
AC CHARACTERISTICS
Electrical Specifications:
Unless otherwise indicated, T
A
= +25°C, V
DD
= +2.7V to +5.5V, V
SS
= GND, V
CM
= V
DD
/2,
V
OUT
V
DD
/2, V
L
= V
DD
/2, and R
L
= 100 kΩ to V
L
, C
L
= 50 pF, and CS is tied low. (Refer to
Figure 1-2
and
Figure 1-3).
Parameters
Frequency Response
Gain Bandwidth Product
Phase Margin
Step Response
Slew Rate
Settling Time (0.01%)
Noise
Input Noise Voltage
Input Noise Voltage Density
Input Noise Current Density
E
ni
e
ni
e
ni
i
ni
7
29
21
0.6
µV
P-P
f = 0.1 Hz to 10 Hz
nV/√Hz f = 1 kHz
nV/√Hz f = 10 kHz
fA/√Hz f = 1 kHz
SR
t
settle
2.3
4.5
V/µs
µs
G = +1 V/V
G = +1 V/V, 3.8V step
GBWP
PM
2.8
50
MHz
°
G = +1 V/V
Sym
Min
Typ
Max
Units
Conditions
MCP603 CHIP SELECT (CS) CHARACTERISTICS
Electrical Specifications:
Unless otherwise indicated, T
A
= +25°C, V
DD
= +2.7V to +5.5V, V
SS
= GND, V
CM
= V
DD
/2,
V
OUT
V
DD
/2, V
L
= V
DD
/2, and R
L
= 100 kΩ to V
L
, C
L
= 50 pF, and CS is tied low. (Refer to
Figure 1-2
and
Figure 1-3).
Parameters
CS Low Specifications
CS Logic Threshold, Low
CS Input Current, Low
CS High Specifications
CS Logic Threshold, High
CS Input Current, High
Shutdown V
SS
current
Amplifier Output Leakage in Shutdown
Timing
CS Low to Amplifier Output Turn-on Time
CS High to Amplifier Output High-Z Time
Hysteresis
t
ON
t
OFF
V
HYST
3.1
100
0.4
10
µs
ns
V
CS
0.2V
DD
, G = +1 V/V
CS
0.8V
DD
, G = +1 V/V, No load.
V
DD
= 5.0V
V
IH
I
CSH
I
Q_SHDN
I
O_SHDN
0.8 V
DD
-2.0
0.7
-0.7
1
V
DD
2.0
V
µA
µA
nA
CS = V
DD
CS = V
DD
V
IL
I
CSL
V
SS
-1.0
0.2 V
DD
V
µA
CS = 0.2V
DD
Sym
Min
Typ
Max
Units
Conditions
CS
t
ON
V
OUT
I
DD
Hi-Z
2 nA
(typical)
t
OFF
Output Active
Hi-Z
230 µA
(typical)
-230 µA
(typical)
2 nA
(typical)
I
SS
-700 nA
(typical)
700 nA
(typical)
CS
Current
FIGURE 1-1:
Timing Diagram.
MCP603 Chip Select (CS)
©
2007 Microchip Technology Inc.
DS21314G-page 3
MCP601/1R/2/3/4
TEMPERATURE CHARACTERISTICS
Electrical Specifications:
Unless otherwise indicated, V
DD
= +2.7V to +5.5V and V
SS
= GND.
Parameters
Temperature Ranges
Specified Temperature Range
Operating Temperature Range
Storage Temperature Range
Thermal Package Resistances
Thermal Resistance, 5L-SOT23
Thermal Resistance, 6L-SOT23
Thermal Resistance, 8L-PDIP
Thermal Resistance, 8L-SOIC
Thermal Resistance, 8L-TSSOP
Thermal Resistance, 14L-PDIP
Thermal Resistance, 14L-SOIC
Thermal Resistance, 14L-TSSOP
Note:
θ
JA
θ
JA
θ
JA
θ
JA
θ
JA
θ
JA
θ
JA
θ
JA
256
230
85
163
124
70
120
100
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
T
A
T
A
T
A
T
A
-40
-40
-40
-65
+85
+125
+125
+150
°C
°C
°C
°C
Industrial temperature parts
Extended temperature parts
Note
Sym
Min
Typ
Max
Units
Conditions
The Industrial temperature parts operate over this extended range, but with reduced performance. The
Extended temperature specs do not apply to Industrial temperature parts. In any case, the internal Junction
temperature (T
J
) must not exceed the absolute maximum specification of 150°C.
1.1
Test Circuits
The test circuits used for the DC and AC tests are
shown in
Figure 1-2
and
Figure 1-2.
The bypass
capacitors are laid out according to the rules discussed
in
Section 4.5 “Supply Bypass”.
V
DD
R
N
0.1 µF 1 µF
V
OUT
C
L
V
DD
/2 R
G
R
F
V
L
R
L
V
IN
MCP60X
FIGURE 1-2:
AC and DC Test Circuit for
Most Non-Inverting Gain Conditions.
V
DD
R
N
0.1 µF 1 µF
V
OUT
C
L
V
IN
R
G
R
F
V
L
R
L
V
DD
/2
MCP60X
FIGURE 1-3:
AC and DC Test Circuit for
Most Inverting Gain Conditions.
DS21314G-page 4
©
2007 Microchip Technology Inc.
MCP601/1R/2/3/4
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note:
Unless otherwise indicated, T
A
= +25°C, V
DD
= +2.7V to +5.5V, V
SS
= GND, V
CM
= V
DD
/2, V
OUT
V
DD
/2,
V
L
= V
DD
/2, R
L
= 100 kΩ to V
L
, C
L
= 50 pF and CS is tied low.
120
Open-Loop Gain (dB)
100
80
60
40
20
0
-20
Gain
Phase
0
Open-Loop Phase (°)
-30
-60
-90
-120
-150
-180
-210
Quiescent Current
per Amplifier (µA)
300
250
200
150
100
50
0
I
O
= 0
T
A
= -40°C
T
A
= +25°C
T
A
= +85°C
T
A
= +125°C
-40
-240
0.1 1
10 100 1k 10k
1.E+
1M
1.E+
1.E- 1.E+ 1.E+ 1.E+ 1.E+ 1.E+
100k
1.E+
10M
01 00 01
Frequency (Hz)
05 06 07
02 03 04
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Supply Voltage (V)
FIGURE 2-1:
Frequency.
3.5
3.0
Open-Loop Gain, Phase vs.
FIGURE 2-4:
Supply Voltage.
300
Quiescent Current
per Amplifier (µA)
250
200
150
100
50
0
Quiescent Current vs.
V
DD
= 5.0V
Falling Edge
I
O
= 0
V
DD
= 5.5V
Slew Rate (V/µs)
2.5
2.0
1.5
1.0
0.5
0.0
-50
-25
Rising Edge
V
DD
= 2.7V
0
25
50
75
Ambient Temperature (°C)
100
125
-50
-25
0
25
50
75
100
Ambient Temperature (°C)
125
FIGURE 2-2:
Slew Rate vs. Temperature.
FIGURE 2-5:
Temperature.
1.E+04
10µ
Quiescent Current vs.
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-50
GBWP
PM, G = +1
-25
0
25
50
75 100
Ambient Temperature (°C)
110
100
90
80
70
60
50
40
30
20
10
0
125
FIGURE 2-3:
Gain Bandwidth Product,
Phase Margin vs. Temperature.
FIGURE 2-6:
vs. Frequency.
Input Noise Voltage Density
(V/
Hz)
Gain Bandwidth Product
(MHz)
Phase Margin, G = +1 (°)
1.E+03
100n
1.E+02
10n
1.E+01
0.1
1
10
100
1k
10k 100k 1M
1.E- 1.E+0 1.E+0 1.E+0 1.E+0 1.E+0 1.E+0 1.E+0
01
0
1
Frequency (Hz)
4
2
3
5
6
Input Noise Voltage Density
©
2007 Microchip Technology Inc.
DS21314G-page 5
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参数对比
与MCP603-I/SN相近的元器件有:MCP601RT-E/OT、MCP601RT-I/OT、MCP603T-E/ST、MCP603T-I/SN、MCP604-E/SL、MCP604-I/P、MCP604T-E/ST、MCP604T-I。描述及对比如下:
型号 MCP603-I/SN MCP601RT-E/OT MCP601RT-I/OT MCP603T-E/ST MCP603T-I/SN MCP604-E/SL MCP604-I/P MCP604T-E/ST MCP604T-I
描述 OP-AMP, 3000 uV OFFSET-MAX, 2.8 MHz BAND WIDTH, PDSO8 OP-AMP, 4500 uV OFFSET-MAX, 2.8 MHz BAND WIDTH, PDSO5 OP-AMP, 3000 uV OFFSET-MAX, 2.8 MHz BAND WIDTH, PDSO5 OP-AMP, 4500 uV OFFSET-MAX, 2.8 MHz BAND WIDTH, PDSO8 OP-AMP, 3000 uV OFFSET-MAX, 2.8 MHz BAND WIDTH, PDSO8 QUAD OP-AMP, 4500 uV OFFSET-MAX, 2.8 MHz BAND WIDTH, PDSO14 QUAD OP-AMP, 2000 uV OFFSET-MAX, 2.8 MHz BAND WIDTH, PDIP14 QUAD OP-AMP, 4500 uV OFFSET-MAX, 2.8 MHz BAND WIDTH, PDSO14 OP-AMP, 4500 uV OFFSET-MAX, 2.8 MHz BAND WIDTH, PDSO5
是否无铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 -
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合 符合 -
厂商名称 Microchip(微芯科技) - - Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) -
零件包装代码 SOIC SOIC SOIC TSSOP SOIC SOIC DIP TSSOP -
包装说明 SOP, SOP8,.25 PLASTIC, MO-178, SOT-23, 5 PIN PLASTIC, MO-178, SOT-23, 5 PIN TSSOP, TSSOP8,.25 SOP, SOP8,.25 SOP, SOP14,.25 0.300 INCH, PLASTIC, MS-001, DIP-14 TSSOP, TSSOP14,.25 -
针数 8 5 5 8 8 14 14 14 -
Reach Compliance Code compli compli compli compli compli compli compli compli -
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 -
Factory Lead Time 8 weeks 17 weeks - 8 weeks 8 weeks 12 weeks 12 weeks 12 weeks -
放大器类型 OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER -
架构 VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK -
最大平均偏置电流 (IIB) 0.00006 µA 0.005 µA 0.00006 µA 0.005 µA 0.00006 µA 0.005 µA 0.00006 µA 0.005 µA -
标称共模抑制比 90 dB 90 dB 90 dB 90 dB 90 dB 90 dB 90 dB 90 dB -
频率补偿 YES YES YES YES YES YES YES YES -
最大输入失调电压 3000 µV 4500 µV 3000 µV 4500 µV 3000 µV 4500 µV 3000 µV 4500 µV -
JESD-30 代码 R-PDSO-G8 R-PDSO-G5 R-PDSO-G5 R-PDSO-G8 R-PDSO-G8 R-PDSO-G14 R-PDIP-T14 R-PDSO-G14 -
JESD-609代码 e3 e3 e3 e3 e3 e3 e3 e3 -
长度 4.9 mm 2.95 mm 2.95 mm 4.4 mm 4.9 mm 8.69 mm 19.05 mm 5 mm -
低-偏置 YES YES YES YES YES YES YES YES -
低-失调 NO NO NO NO NO NO NO NO -
微功率 YES YES YES YES YES YES YES YES -
湿度敏感等级 3 1 1 1 3 1 - 1 -
功能数量 1 1 1 1 1 4 4 4 -
端子数量 8 5 5 8 8 14 14 14 -
最高工作温度 85 °C 125 °C 85 °C 125 °C 85 °C 125 °C 85 °C 125 °C -
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
封装代码 SOP LSSOP LSSOP TSSOP SOP SOP DIP TSSOP -
封装等效代码 SOP8,.25 TSOP5/6,.11,37 TSOP5/6,.11,37 TSSOP8,.25 SOP8,.25 SOP14,.25 DIP14,.3 TSSOP14,.25 -
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR -
封装形式 SMALL OUTLINE SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH -
峰值回流温度(摄氏度) 260 260 260 260 260 260 NOT APPLICABLE 260 -
功率 NO NO NO NO NO - - - -
电源 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V 3/5 V -
可编程功率 NO NO NO NO NO - - - -
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified -
座面最大高度 1.75 mm 1.45 mm 1.45 mm 1.1 mm 1.75 mm 1.75 mm 4.32 mm 1.2 mm -
标称压摆率 2.3 V/us 2.3 V/us 2.3 V/us 2.3 V/us 2.3 V/us 2.3 V/us 2.3 V/us 2.3 V/us -
最大压摆率 0.325 mA 0.325 mA 0.325 mA 0.325 mA 0.325 mA 1.3 mA 1.3 mA 1.3 mA -
供电电压上限 7 V 7 V 7 V 7 V 7 V 7 V 7 V 7 V -
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V -
表面贴装 YES YES YES YES YES YES NO YES -
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS -
温度等级 INDUSTRIAL AUTOMOTIVE INDUSTRIAL AUTOMOTIVE INDUSTRIAL AUTOMOTIVE INDUSTRIAL AUTOMOTIVE -
端子面层 Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) -
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING THROUGH-HOLE GULL WING -
端子节距 1.27 mm 0.95 mm 0.95 mm 0.65 mm 1.27 mm 1.27 mm 2.54 mm 0.65 mm -
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL -
处于峰值回流温度下的最长时间 40 40 40 40 40 40 NOT APPLICABLE 40 -
标称均一增益带宽 2800 kHz 2800 kHz 2800 kHz 2800 kHz 2800 kHz 2800 kHz 2800 kHz 2800 kHz -
最小电压增益 56200 56200 56200 56200 56200 56200 56200 56200 -
宽带 NO NO NO NO NO - - - -
宽度 3.91 mm 1.63 mm 1.63 mm 3 mm 3.91 mm 3.9 mm 7.62 mm 4.4 mm -
包装方法 - TAPE AND REEL TAPE AND REEL TAPE AND REEL TAPE AND REEL - - TAPE AND REEL -
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