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MCP6S21T-I/MS

special purpose amplifiers 1-chan. 12 mhz spi

器件类别:模拟混合信号IC    信号电路   

厂商名称:Microchip(微芯科技)

厂商官网:https://www.microchip.com

器件标准:

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
Microchip(微芯科技)
零件包装代码
MSOP
包装说明
PLASTIC, MSOP-8
针数
8
Reach Compliance Code
compli
ECCN代码
EAR99
Factory Lead Time
9 weeks
Samacsys Descripti
Special Purpose Amplifiers 1-Chan. 12 MHz SPI
模拟集成电路 - 其他类型
ANALOG CIRCUIT
JESD-30 代码
S-PDSO-G8
JESD-609代码
e3
长度
3 mm
湿度敏感等级
1
功能数量
1
端子数量
8
最高工作温度
85 °C
最低工作温度
-40 °C
封装主体材料
PLASTIC/EPOXY
封装代码
TSSOP
封装等效代码
TSSOP8,.19
封装形状
SQUARE
封装形式
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度)
260
电源
3/5 V
认证状态
Not Qualified
座面最大高度
1.18 mm
最大供电电流 (Isup)
1.35 mA
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
2.5 V
标称供电电压 (Vsup)
4 V
表面贴装
YES
温度等级
INDUSTRIAL
端子面层
Matte Tin (Sn)
端子形式
GULL WING
端子节距
0.65 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
40
宽度
3 mm
文档预览
M
Features
• Multiplexed Inputs: 1, 2, 6 or 8 channels
• 8 Gain Selections:
- +1, +2, +4, +5, +8, +10, +16 or +32 V/V
• Serial Peripheral Interface (SPI™)
• Rail-to-Rail Input and Output
• Low Gain Error: ±1% (max)
• Low Offset: ±275 µV (max)
• High Bandwidth: 2 to 12 MHz (typ)
• Low Noise: 10 nV/√Hz @ 10 kHz (typ)
• Low Supply Current: 1.0 mA (typ)
• Single Supply: 2.5V to 5.5V
MCP6S21/2/6/8
Description
The Microchip Technology Inc. MCP6S21/2/6/8 are
analog Programmable Gain Amplifiers (PGA). They
can be configured for gains from +1 V/V to +32 V/V and
the input multiplexer can select one of up to eight chan-
nels through an SPI port. The serial interface can also
put the PGA into shutdown to conserve power. These
PGAs are optimized for high speed, low offset voltage
and single-supply operation with rail-to-rail input and
output capability. These specifications support single
supply applications needing flexible performance or
multiple inputs.
The one channel MCP6S21 and the two channel
MCP6S22 are available in 8-pin PDIP, SOIC and
MSOP packages. The six channel MCP6S26 is avail-
able in 14-pin PDIP, SOIC and TSSOP packages. The
eight channel MCP6S28 is available in 16-pin PDIP
and SOIC packages. All parts are fully specified from
-40°C to +85°C.
Single-Ended, Rail-to-Rail I/O, Low Gain PGA
Typical Applications
A/D Converter Driver
Multiplexed Analog Applications
Data Acquisition
Industrial Instrumentation
Test Equipment
Medical Instrumentation
Block Diagram
V
DD
CH0
CH1
CH2
CH3
CH4
CH5
CH6
CH7
CS
SI
SO
SCK
+
-
MUX
R
F
8
Gain
Switches
SPI™
Logic
POR
V
SS
V
REF
R
G
Resistor Ladder (R
LAD
)
Package Types
MCP6S21
PDIP, SOIC, MSOP
V
OUT
1
CH0 2
V
REF
3
V
SS
4
8 V
DD
7 SCK
6 SI
5 CS
V
OUT
MCP6S22
PDIP, SOIC, MSOP
V
OUT
1
CH0 2
CH1 3
V
SS
4
8 V
DD
7 SCK
6 SI
5 CS
MCP6S26
PDIP, SOIC, TSSOP
V
OUT
1
CH0 2
CH1 3
CH2 4
CH3 5
CH4 6
CH5 7
14 V
DD
13 SCK
12 SO
11 SI
10 CS
9 V
SS
8 V
REF
MCP6S28
PDIP, SOIC
V
OUT
1
CH0 2
CH1 3
CH2 4
CH3 5
CH4 6
CH5 7
CH6 8
16 V
DD
15 SCK
14 SO
13 SI
12 CS
11 V
SS
10 V
REF
9 CH7
2003 Microchip Technology Inc.
DS21117A-page 1
MCP6S21/2/6/8
1.0
ELECTRICAL
CHARACTERISTICS
PIN FUNCTION TABLE
Name
Function
Absolute Maximum Ratings †
V
DD
- V
SS
.........................................................................7.0V
All inputs and outputs....................... V
SS
- 0.3V to V
DD
+0.3V
Difference Input voltage ........................................ |V
DD
- V
SS
|
Output Short Circuit Current...................................continuous
Current at Input Pin
.............................................................±2
mA
Current at Output and Supply Pins
................................ ±30
mA
Storage temperature .....................................-65°C to +150°C
Junction temperature .................................................. +150°C
ESD protection on all pins (HBM;MM)..................
2 kV; 200V
† Notice:
Stresses above those listed under "Maximum
Ratings" may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operation listings of this specification is not implied. Exposure
to maximum rating conditions for extended periods may affect
device reliability.
V
OUT
CH0-CH7
V
SS
V
DD
SCK
SI
SO
CS
V
REF
Analog Output
Analog Inputs
Negative Power Supply
Positive Power Supply
SPI Clock Input
SPI Serial Data Input
SPI Serial Data Output
SPI Chip Select
External Reference Pin
DC CHARACTERISTICS
Electrical Specifications:
Unless otherwise indicated, T
A
= +25°C, V
DD
= +2.5V to +5.5V, V
SS
= GND, V
REF
= V
SS
, G = +1 V/V,
Input = CH0 = (0.3V)/G, CH1 to CH7 = 0.3V, R
L
= 10 kΩ to V
DD
/2, SI and SCK are tied low and CS is tied high.
Parameters
Amplifier Input
Input Offset Voltage
Input Offset Voltage Drift
Power Supply Rejection Ratio
Input Bias Current
Input Bias Current over
Temperature
Input Impedance
Input Voltage Range
Amplifier Gain
Nominal Gains
DC Gain Error
DC Gain Drift
Internal Resistance
Internal Resistance over
Temperature
Amplifier Output
DC Output Non-linearity G = +1
G
+2
Maximum Output Voltage Swing
V
ONL
V
ONL
V
OH
, V
OL
V
SS
+20
V
SS
+60
Short-Circuit Current
I
O(SC)
±0.003
±0.001
±30
V
DD
-100
V
DD
-60
mA
% of FSR V
OUT
= 0.3V to V
DD
0.3V, V
DD
= 5.0V
% of FSR V
OUT
= 0.3V to V
DD
0.3V, V
DD
= 5.0V
mV
G
+2; 0.5V output overdrive
G
+2; 0.5V output overdrive,
V
REF
= V
DD
/2
G = +1
G
+2
G = +1
G
+2
G
g
E
g
E
∆G/∆T
A
∆G/∆T
A
R
LAD
∆R
LAD
/∆T
A
-0.1
-1.0
3.4
1 to 32
±0.0002
±0.0004
4.9
+0.028
+0.1
+1.0
6.4
V/V
%
%
%/°C
%/°C
kΩ
%/°C
+1, +2, +4, +5, +8, +10, +16 or +32
V
OUT
0.3V to V
DD
0.3V
V
OUT
0.3V to V
DD
0.3V
T
A
= -40 to +85°C
T
A
= -40 to +85°C
(Note 1)
(Note 1)
T
A
= -40 to +85°C
V
OS
∆V
OS
/∆T
A
PSRR
I
B
I
B
Z
IN
V
IVR
-275
70
V
SS
−0.3
±4
85
±1
10
13
||15
+275
250
V
DD
+0.3
µV
µV/°C
dB
pA
pA
Ω||pF
V
G = +1, V
DD
= 4.0V
T
A
= -40 to +85°C
G = +1
(Note 1)
CHx = V
DD
/2
T
A
= -40 to +85°C,
CHx = V
DD
/2
Sym
Min
Typ
Max
Units
Conditions
Note 1:
R
LAD
(R
F
+ R
G
in Figure 4-1) connects V
REF
, V
OUT
and the inverting input of the internal amplifier. The MCP6S22 has
V
REF
tied internally to V
SS
, so V
SS
is coupled to the internal amplifier and the PSRR spec describes PSRR+ only. We
recommend the MCP6S22’s V
SS
pin be tied directly to ground to avoid noise problems.
2:
I
Q
includes current in R
LAD
(typically 60 µA at V
OUT
= 0.3V). Both I
Q
and I
Q_SHDN
exclude digital switching currents.
3:
The output goes Hi-Z and the registers reset to their defaults; see Section 5.4, “Power-On Reset”.
DS21117A-page 2
2003 Microchip Technology Inc.
MCP6S21/2/6/8
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications:
Unless otherwise indicated, T
A
= +25°C, V
DD
= +2.5V to +5.5V, V
SS
= GND, V
REF
= V
SS
, G = +1 V/V,
Input = CH0 = (0.3V)/G, CH1 to CH7 = 0.3V, R
L
= 10 kΩ to V
DD
/2, SI and SCK are tied low and CS is tied high.
Parameters
Power Supply
Supply Voltage
Quiescent Current
Quiescent Current, Shutdown
mode
Power-On Reset
POR Trip Voltage
POR Trip Voltage Drift
V
POR
∆V
POR
/∆T
1.2
1.7
-3.0
2.2
V
mV/°C
(Note 3)
T
A
= -40°C to+85°C
V
DD
I
Q
I
Q_SHDN
2.5
0.5
1.0
0.5
5.5
1.35
1.0
V
mA
µA
I
O
= 0
(Note 2)
I
O
= 0
(Note 2)
Sym
Min
Typ
Max
Units
Conditions
Note 1:
R
LAD
(R
F
+ R
G
in Figure 4-1) connects V
REF
, V
OUT
and the inverting input of the internal amplifier. The MCP6S22 has
V
REF
tied internally to V
SS
, so V
SS
is coupled to the internal amplifier and the PSRR spec describes PSRR+ only. We
recommend the MCP6S22’s V
SS
pin be tied directly to ground to avoid noise problems.
2:
I
Q
includes current in R
LAD
(typically 60 µA at V
OUT
= 0.3V). Both I
Q
and I
Q_SHDN
exclude digital switching currents.
3:
The output goes Hi-Z and the registers reset to their defaults; see Section 5.4, “Power-On Reset”.
AC CHARACTERISTICS
Electrical Specifications:
Unless otherwise indicated, T
A
= +25°C, V
DD
= +2.5V to +5.5V, V
SS
= GND, V
REF
= V
SS
, G = +1 V/V,
Input = CH0 =(0.3V)/G, CH1 to CH7=0.3V, R
L
= 10 kΩ to V
DD
/2, C
L
= 60 pF, SI and SCK are tied low, and CS is tied high.
Parameters
Frequency Response
-3 dB Bandwidth
Gain Peaking
Total Harmonic Distortion plus Noise
f = 1 kHz, G = +1 V/V
f = 1 kHz, G = +4 V/V
f = 1 kHz, G = +16 V/V
f = 20 kHz, G = +1 V/V
f = 20 kHz, G = +4 V/V
f = 20 kHz, G = +16 V/V
Step Response
Slew Rate
SR
Noise
Input Noise Voltage
Input Noise Voltage Density
Input Noise Current Density
E
ni
e
ni
i
ni
3.2
26
10
4
µV
P-P
f = 0.1 Hz to 10 kHz
(Note 2)
f = 0.1 Hz to 200 kHz
(Note 2)
nV/√Hz f = 10 kHz
(Note 2)
fA/√Hz f = 10 kHz
4.0
11
22
V/µs
V/µs
V/µs
G = 1, 2
G = 4, 5, 8, 10
G = 16, 32
THD+N
THD+N
THD+N
THD+N
THD+N
THD+N
0.0015
0.0058
0.023
0.0035
0.0093
0.036
%
%
%
%
%
%
V
OUT
= 1.5V ± 1.0V
PK
, V
DD
= 5.0V,
BW = 22 kHz
V
OUT
= 1.5V ± 1.0V
PK
, V
DD
= 5.0V,
BW = 22 kHz
V
OUT
= 1.5V ± 1.0V
PK
, V
DD
= 5.0V,
BW = 22 kHz
V
OUT
= 1.5V ± 1.0V
PK
, V
DD
= 5.0V,
BW = 80 kHz
V
OUT
= 1.5V ± 1.0V
PK
, V
DD
= 5.0V,
BW = 80 kHz
V
OUT
= 1.5V ± 1.0V
PK
, V
DD
= 5.0V,
BW = 80 kHz
BW
GPK
2 to 12
0
MHz
dB
All gains; V
OUT
< 100 mV
P-P
(Note 1)
All gains; V
OUT
< 100 mV
P-P
Sym
Min
Typ
Max
Units
Conditions
Note 1:
See Table 4-1 for a list of typical numbers.
2:
E
ni
and e
ni
include ladder resistance noise. See Figure 2-33 for e
ni
vs. G data.
2003 Microchip Technology Inc.
DS21117A-page 3
MCP6S21/2/6/8
DIGITAL CHARACTERISTICS
Electrical Specifications:
Unless otherwise indicated, T
A
= +25°C, V
DD
= +2.5V to +5.5V, V
SS
= GND, V
REF
= V
SS
, G = +1 V/V,
Input = CH0 = (0.3V)/G, CH1 to CH7 = 0.3V, R
L
= 10 kΩ to V
DD
/2, C
L
= 60 pF, SI and SCK are tied low, and CS is tied high.
Parameters
SPI Inputs (CS, SI, SCK)
Logic Threshold, Low
Input Leakage Current
Logic Threshold, High
Amplifier Output Leakage Current
Logic Threshold, Low
Logic Threshold, High
SPI Timing
Pin Capacitance
Input Rise/Fall Times (CS, SI, SCK)
Output Rise/Fall Times (SO)
CS high time
SCK edge to CS fall setup time
CS fall to first SCK edge setup time
SCK Frequency
SCK high time
SCK low time
SCK last edge to CS rise setup time
CS rise to SCK edge setup time
SI set-up time
SI hold time
SCK to SO valid propagation delay
CS rise to SO forced to zero
Channel and Gain Select Timing
Channel Select Time
t
CH
1.5
µs
CHx = 0.6V, CHy =0.3V, G = 1,
CHx to CHy select
CS
= 0.7V
DD
to
V
OUT
90% point
CHx = 0.3V, G = 5 to G = 1 select,
CS
= 0.7V
DD
to
V
OUT
90% point
CS = 0.7V
DD
to V
OUT
90% point
C
PIN
t
RFI
t
RFO
t
CSH
t
CS0
t
CSSC
f
SCK
t
HI
t
LO
t
SCCS
t
CS1
t
SU
t
HD
t
DO
t
SOZ
40
10
40
40
40
30
100
40
10
10
5
2
10
80
80
pF
µs
ns
ns
ns
ns
MHz
ns
ns
ns
ns
ns
ns
ns
ns
MCP6S26 and MCP6S28
MCP6S26 and MCP6S28
SCK edge when CS is high
V
DD
= 5V
(Note 2)
SCK edge when CS is high
All digital I/O pins
Note 1
MCP6S26 and MCP6S28
V
IL
I
IL
V
IH
V
OL
V
OH
0
-1.0
0.7V
DD
-1.0
V
SS
V
DD
-0.5
0.3V
DD
+1.0
V
DD
+1.0
V
SS
+0.4
V
DD
V
µA
V
µA
V
V
In Shutdown mode
I
OL
= 2.1 mA, V
DD
= 5V
I
OH
= -400 µA
Sym
Min
Typ
Max
Units
Conditions
SPI Output (SO, for MCP6S26 and MCP6S28)
Gain Select Time
Shutdown Mode Timing
Out of Shutdown mode (CS goes
high) to Amplifier Output Turn-on
Time
Into Shutdown mode (CS goes high)
to Amplifier Output High-Z Turn-off
Time
POR Timing
Power-On Reset power-up time
Power-On Reset power-down time
t
G
1
µs
t
ON
3.5
10
µs
t
OFF
1.5
µs
CS = 0.7V
DD
to V
OUT
90% point
t
RPU
t
RPD
30
10
µs
µs
V
DD
= V
POR
- 0.1V to V
POR
+ 0.1V,
50% V
DD
to 90% V
OUT
point
V
DD
= V
POR
+ 0.1V to V
POR
- 0.1V,
50% V
DD
to 90% V
OUT
point
Note 1:
Not tested in production. Set by design and characterization.
2:
When using the device in the daisy chain configuration, maximum clock frequency is determined by a combination of
propagation delay time (t
DO
80 ns), data input setup time (t
SU
40 ns), SCK high time (t
HI
40 ns), and SCK rise and
fall times of 5 ns. Maximum f
SCK
is, therefore,
5.8 MHz.
DS21117A-page 4
2003 Microchip Technology Inc.
MCP6S21/2/6/8
TEMPERATURE CHARACTERISTICS
Electrical Specifications:
Unless otherwise indicated, V
DD
= +2.5V to +5.5V, V
SS
= GND.
Parameters
Temperature Ranges
Specified Temperature Range
Operating Temperature Range
Storage Temperature Range
Thermal Package Resistances
Thermal Resistance, 8L-PDIP
Thermal Resistance, 8L-SOIC
Thermal Resistance, 8L-MSOP
Thermal Resistance, 14L-PDIP
Thermal Resistance, 14L-SOIC
Thermal Resistance, 14L-TSSOP
Thermal Resistance, 16L-PDIP
Thermal Resistance, 16L-SOIC
θ
JA
θ
JA
θ
JA
θ
JA
θ
JA
θ
JA
θ
JA
θ
JA
85
163
206
70
120
100
70
90
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
T
A
T
A
T
A
-40
-40
-65
+85
+125
+150
°C
°C
°C
(Note Note:)
Sym
Min
Typ
Max
Units
Conditions
Note 1:
The MCP6S21/2/6/8 family of PGAs operates over this extended temperature range, but with reduced
performance. Operation in this range must not cause T
J
to exceed the Maximum Junction Temperature
(150°C).
CS
t
CH
CS
t
G
V
OUT
0.6V
0.3V
V
OUT
1.5V
0.3V
FIGURE 1-1:
Diagram.
Channel Select Timing
FIGURE 1-3:
Diagram.
Gain Select Timing
CS
t
ON
t
OFF
V
DD
V
POR
- 0.1V
V
POR
+ 0.1V
t
RPU
V
POR
- 0.1V
t
RPD
V
OUT
Hi-Z
0.3V
Hi-Z
V
OUT
Hi-Z
0.3V
1.0 mA (typ)
500 nA (typ)
Hi-Z
I
SS
500 nA (typ)
1.0 mA (typ)
I
SS
FIGURE 1-2:
PGA Shutdown timing
diagram (must enter correct commands before
CS goes high).
FIGURE 1-4:
POR power-up and power-
down timing diagram.
2003 Microchip Technology Inc.
DS21117A-page 5
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参数对比
与MCP6S21T-I/MS相近的元器件有:MCP6S22T-I/SN、MCP6S22T-I/MS、MCP6S21T-I/SN。描述及对比如下:
型号 MCP6S21T-I/MS MCP6S22T-I/SN MCP6S22T-I/MS MCP6S21T-I/SN
描述 special purpose amplifiers 1-chan. 12 mhz spi special purpose amplifiers 2-chan. 12 mhz spi special purpose amplifiers 2-chan. 12 mhz spi special purpose amplifiers 1-chan. 12 mhz spi
是否无铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合
厂商名称 Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技)
零件包装代码 MSOP SOIC MSOP SOIC
包装说明 PLASTIC, MSOP-8 0.150 INCH, PLASTIC, SOIC-8 PLASTIC, MSOP-8 SOP, SOP8,.25
针数 8 8 8 8
Reach Compliance Code compli compli compli compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99
Factory Lead Time 9 weeks 9 weeks 9 weeks 9 weeks
模拟集成电路 - 其他类型 ANALOG CIRCUIT ANALOG CIRCUIT ANALOG CIRCUIT ANALOG CIRCUIT
JESD-30 代码 S-PDSO-G8 R-PDSO-G8 S-PDSO-G8 R-PDSO-G8
JESD-609代码 e3 e3 e3 e3
长度 3 mm 4.9 mm 3 mm 4.9 mm
湿度敏感等级 1 3 1 3
功能数量 1 1 1 1
端子数量 8 8 8 8
最高工作温度 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP SOP TSSOP SOP
封装等效代码 TSSOP8,.19 SOP8,.25 TSSOP8,.19 SOP8,.25
封装形状 SQUARE RECTANGULAR SQUARE RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
峰值回流温度(摄氏度) 260 260 260 260
电源 3/5 V 3/5 V 3/5 V 3/5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.18 mm 1.75 mm 1.18 mm 1.75 mm
最大供电电流 (Isup) 1.35 mA 1.35 mA 1.35 mA 1.35 mA
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V
标称供电电压 (Vsup) 4 V 4 V 4 V 4 V
表面贴装 YES YES YES YES
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn)
端子形式 GULL WING GULL WING GULL WING GULL WING
端子节距 0.65 mm 1.27 mm 0.65 mm 1.27 mm
端子位置 DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 40 40 40 40
宽度 3 mm 3.91 mm 3 mm 3.91 mm
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