型号
- 型号
- 关键词
Fast Page DRAM, 4MX16, 50ns, CMOS, PDSO50, 0.400 INCH, 0.80 MM PITCH, PLASTIC, TSOP2-50
厂商名称：LAPIS Semiconductor Co Ltd
下载文档| 型号 | MD51V65165-50TA | MD51V65165-60TA | MD51V65165-60JA | MD51V65165-50JA |
|---|---|---|---|---|
| 描述 | Fast Page DRAM, 4MX16, 50ns, CMOS, PDSO50, 0.400 INCH, 0.80 MM PITCH, PLASTIC, TSOP2-50 | Fast Page DRAM, 4MX16, 60ns, CMOS, PDSO50, 0.400 INCH, 0.80 MM PITCH, PLASTIC, TSOP2-50 | Fast Page DRAM, 4MX16, 60ns, CMOS, PDSO50, 0.400 INCH, 0.80 MM PITCH, PLASTIC, SOJ-50 | Fast Page DRAM, 4MX16, 50ns, CMOS, PDSO50, 0.400 INCH, 0.80 MM PITCH, PLASTIC, SOJ-50 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd |
| 零件包装代码 | TSOP2 | TSOP2 | SOJ | SOJ |
| 包装说明 | TSOP2, TSOP50,.46,32 | TSOP2, TSOP50,.46,32 | SOJ, SOJ50,.44,32 | SOJ, SOJ50,.44,32 |
| 针数 | 50 | 50 | 50 | 50 |
| Reach Compliance Code | unknown | unknown | unknown | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO |
| 最长访问时间 | 50 ns | 60 ns | 60 ns | 50 ns |
| 其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PDSO-G50 | R-PDSO-G50 | R-PDSO-J50 | R-PDSO-J50 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 长度 | 20.95 mm | 20.95 mm | 20.95 mm | 20.95 mm |
| 内存密度 | 67108864 bit | 67108864 bit | 67108864 bit | 67108864 bi |
| 内存集成电路类型 | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM |
| 内存宽度 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 50 | 50 | 50 | 50 |
| 字数 | 4194304 words | 4194304 words | 4194304 words | 4194304 words |
| 字数代码 | 4000000 | 4000000 | 4000000 | 4000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 4MX16 | 4MX16 | 4MX16 | 4MX16 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSOP2 | TSOP2 | SOJ | SOJ |
| 封装等效代码 | TSOP50,.46,32 | TSOP50,.46,32 | SOJ50,.44,32 | SOJ50,.44,32 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 4096 | 4096 | 4096 | 4096 |
| 座面最大高度 | 1.2 mm | 1.2 mm | 3.85 mm | 3.85 mm |
| 自我刷新 | NO | NO | NO | NO |
| 最大待机电流 | 0.0005 A | 0.0005 A | 0.0005 A | 0.0005 A |
| 最大压摆率 | 0.14 mA | 0.12 mA | 0.12 mA | 0.14 mA |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | J BEND | J BEND |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm |