MD74SC238AC,MD74SC238AC pdf中文资料,MD74SC238AC引脚图,MD74SC238AC电路-Datasheet-电子工程世界

器件参数

参数名称

属性值

是否Rohs认证

不符合

厂商名称

Microsemi

包装说明

DIP, DIP16,.3

Reach Compliance Code

unknow

ECCN代码

EAR99

JESD-30 代码

R-XDIP-T16

JESD-609代码

逻辑集成电路类型

OTHER DECODER/DRIVER

最大I（ol）

0.008 A

功能数量

端子数量

最高工作温度

70 °C

最低工作温度

封装主体材料

CERAMIC

封装代码

DIP

封装等效代码

DIP16,.3

封装形状

RECTANGULAR

封装形式

IN-LINE

认证状态

Not Qualified

表面贴装

技术

CMOS

温度等级

COMMERCIAL

端子面层

Tin/Lead (Sn/Pb)

端子形式

THROUGH-HOLE

端子节距

2.54 mm

端子位置

DUAL

参数对比

与MD74SC238AC相近的元器件有：MD54SC237AC、MD54SC238AC、MD54SC239AC、MD74SC237AC、MD74SC237AE、MD74SC238AE、MD74SC239AC、MD74SC239AE。描述及对比如下：

型号	MD74SC238AC	MD54SC237AC	MD54SC238AC	MD54SC239AC	MD74SC237AC	MD74SC237AE	MD74SC238AE	MD74SC239AC	MD74SC239AE
描述	IC,DECODER/DEMUX,3-TO-8-LINE,SC-CMOS,DIP,16PIN,CERAMIC	Decoder/Driver, CMOS, CDIP16,	Decoder/Driver, CMOS, CDIP16,	Decoder/Driver, CMOS, CDIP16,	IC,DECODER/DEMUX,3-TO-8-LINE,SC-CMOS,DIP,16PIN,CERAMIC	IC,DECODER/DEMUX,3-TO-8-LINE,SC-CMOS,DIP,16PIN,PLASTIC	IC,DECODER/DEMUX,3-TO-8-LINE,SC-CMOS,DIP,16PIN,PLASTIC	IC,DECODER/DEMUX,2-TO-4-LINE,SC-CMOS,DIP,16PIN,CERAMIC	IC,DECODER/DEMUX,2-TO-4-LINE,SC-CMOS,DIP,16PIN,PLASTIC
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
Reach Compliance Code	unknow	unknow	unknow	unknow	unknow	unknow	unknow	unknown	unknown
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
JESD-30 代码	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-PDIP-T16	R-PDIP-T16	R-XDIP-T16	R-PDIP-T16
逻辑集成电路类型	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER
最大I（ol）	0.008 A	0.0065 A	0.0065 A	0.0065 A	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A
功能数量	1	1	1	2	1	1	1	2	2
端子数量	16	16	16	16	16	16	16	16	16
最高工作温度	70 °C	125 °C	125 °C	125 °C	70 °C	70 °C	70 °C	70 °C	70 °C
封装主体材料	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY
封装代码	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
封装等效代码	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
表面贴装	NO	NO	NO	NO	NO	NO	NO	NO	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	TTL	TTL
温度等级	COMMERCIAL	MILITARY	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子形式	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
端子节距	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
厂商名称	Microsemi	Microsemi	Microsemi	Microsemi	Microsemi	Microsemi	Microsemi	-	-
包装说明	DIP, DIP16,.3	DIP, DIP16,.3	-	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
JESD-609代码	e0	-	-	-	e0	e0	e0	e0	e0
端子面层	Tin/Lead (Sn/Pb)	-	-	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)