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MF1S7030XDA8

SPECIALTY CONSUMER CIRCUIT, XMA4

器件类别:其他集成电路(IC)    消费电路   

厂商名称:NXP(恩智浦)

厂商官网:https://www.nxp.com

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器件参数
参数名称
属性值
厂商名称
NXP(恩智浦)
包装说明
,
Reach Compliance Code
unknown
商用集成电路类型
CONSUMER CIRCUIT
JESD-30 代码
R-XXMA-N4
功能数量
1
端子数量
4
最高工作温度
70 °C
最低工作温度
-25 °C
封装主体材料
UNSPECIFIED
封装形状
RECTANGULAR
封装形式
MICROELECTRONIC ASSEMBLY
表面贴装
YES
温度等级
OTHER
端子形式
NO LEAD
端子位置
UNSPECIFIED
文档预览
MF1S70yyX
MIFARE Classic 4K - Mainstream contactless smart card IC
for fast and easy solution development
Rev. 3.0 — 2 May 2011
196430
Product data sheet
COMPANY PUBLIC
1. General description
NXP Semiconductors has developed the MIFARE Classic MF1S70yyX to be used in a
contactless smart card according to ISO/IEC 14443 Type A.
The MIFARE Classic 4K MF1S70yyX IC is used in applications like public transport
ticketing and can also be used for various other applications.
1.1 Anticollision
An intelligent anticollision function allows to operate more than one card in the field
simultaneously. The anticollision algorithm selects each card individually and ensures that
the execution of a transaction with a selected card is performed correctly without
interference from another card in the field.
energy
MIFARE
CARD PCD
data
001aam199
Fig 1.
MIFARE card reader
1.2 Simple integration and user convenience
The MF1S70yyX is designed for simple integration and user convenience which allows
complete ticketing transactions to be handled in less than 100 ms.
1.3 Security
Manufacturer programmed 7-byte UID or 4-byte NUID identifier for each device
Random ID support
Mutual three pass authentication (ISO/IEC DIS 9798-2)
Individual set of two keys per sector to support multi-application with key hierarchy
NXP Semiconductors
MF1S70yyX
MIFARE Classic 4K - Mainstream contactless smart card IC
1.4 Delivery options
7-byte UID, 4-byte NUID
bumped die on wafer
MOA4 and MOA8 contactless module
2. Features and benefits
Contactless transmission of data and
supply energy
Operating frequency of 13.56 MHz
Data integrity of 16-bit CRC, parity, bit
coding, bit counting
Typical ticketing transaction time of
< 100 ms (including backup
management)
Operating distance up to 100 mm
depending on antenna geometry and
reader configuration
Data transfer of 106 kbit/s
Anticollision
2.1 EEPROM
4 kB, organized in 32 sectors of 4 blocks
and 8 sectors of 16 blocks (one block
consists of 16 byte)
Data retention time of 10 years
User definable access conditions for
each memory block
Write endurance 100000 cycles
3. Applications
Public transportation
Electronic toll collection
School and campus cards
Internet cafés
Access management
Car parking
Employee cards
Loyalty
4. Quick reference data
Table 1.
Symbol
C
i
f
i
t
ret
N
endu(W)
[1]
Quick reference data
Parameter
input capacitance
input frequency
retention time
write endurance
T
amb
= 22
°C
T
amb
= 22
°C
Conditions
[1]
Min
14.9
-
10
100000
Typ
16.9
13.56
-
200000
Max
19.0
-
-
-
Unit
pF
MHz
year
cycle
EEPROM characteristics
LCR meter, T
amb
= 22
°C,
f
i
= 13.56 MHz, 2 V RMS.
MF1S70YYX
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.0 — 2 May 2011
196430
2 of 40
NXP Semiconductors
MF1S70yyX
MIFARE Classic 4K - Mainstream contactless smart card IC
5. Ordering information
Table 2.
Ordering information
Package
Name
MF1S7001XDUD
MF1S7001XDUF
MF1S7000XDA4
MF1S7000XDA8
MF1S7031XDUD
MF1S7031XDUF
MF1S7030XDA4
MF1S7030XDA8
FFC Bump
FFC Bump
MOA4
MOA8
FFC Bump
FFC Bump
MOA4
MOA8
Description
8 inch wafer, 120
μm
thickness, on film frame carrier, electronic fail die
marking according to SECS-II format), Au bumps, 7-byte UID
8 inch wafer, 75
μm
thickness, on film frame carrier, electronic fail die
marking according to SECS-II format), Au bumps, 7-byte UID
plastic leadless module carrier package; 35 mm wide tape, 7-byte UID
plastic leadless module carrier package; 35 mm wide tape, 7-byte UID
8 inch wafer, 120
μm
thickness, on film frame carrier, electronic fail die
marking according to SECS-II format), Au bumps, 4-byte non-unique ID
8 inch wafer, 75
μm
thickness, on film frame carrier, electronic fail die
marking according to SECS-II format), Au bumps, 4-byte non-unique ID
plastic leadless module carrier package; 35 mm wide tape,
4-byte non-unique ID
plastic leadless module carrier package; 35 mm wide tape,
4-byte non-unique ID
Version
-
-
SOT500-2
SOT500-4
-
-
SOT500-2
SOT500-4
Type number
6. Block diagram
RF
INTERFACE
UART
ISO/IEC 14443
TYPE A
CRYPTO1
POWER ON
RESET
VOLTAGE
REGULATOR
RNG
CLOCK
INPUT FILTER
CRC
RESET
GENERATOR
LOGIC UNIT
EEPROM
001aan006
Fig 2.
Block diagram of MF1S70yyX
MF1S70YYX
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.0 — 2 May 2011
196430
3 of 40
NXP Semiconductors
MF1S70yyX
MIFARE Classic 4K - Mainstream contactless smart card IC
7. Pinning information
7.1 Pinning
The pinning for the MF1S70yyXDAx is shown as an example in
Figure 3
for the MOA4
contactless module. For the contactless module MOA8, the pinning is analogous and not
explicitly shown.
LA
top view
LB
001aan002
Fig 3.
Table 3.
Pin
LA
LB
Pin configuration for SOT500-2 (MOA4)
Pin allocation table
Symbol
LA
LB
Antenna coil connection LA
Antenna coil connection LB
MF1S70YYX
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.0 — 2 May 2011
196430
4 of 40
NXP Semiconductors
MF1S70yyX
MIFARE Classic 4K - Mainstream contactless smart card IC
8. Functional description
8.1 Block description
The MF1S70yyX chip consists of a 4 kB EEPROM, RF interface and Digital Control Unit.
Energy and data are transferred via an antenna consisting of a coil with a small number of
turns which is directly connected to the MF1S70yyX. No further external components are
necessary. Refer to the document
Ref. 1
for details on antenna design.
RF interface:
Modulator/demodulator
Rectifier
Clock regenerator
Power-On Reset (POR)
Voltage regulator
Anticollision: Multiple cards in the field may be selected and managed in sequence
Authentication: Preceding any memory operation the authentication procedure
ensures that access to a block is only possible via the two keys specified for each
block
Control and Arithmetic Logic Unit: Values are stored in a special redundant format
and can be incremented and decremented
EEPROM interface
Crypto unit: The CRYPTO1 stream cipher of the MF1S70yyX is used for
authentication and encryption of data exchange.
EEPROM: 4 kB is organized in 32 sectors of 4 blocks and 8 sectors of 16 blocks. One
block contains 16 bytes. The last block of each sector is called “trailer”, which
contains two secret keys and programmable access conditions for each block in this
sector.
8.2 Communication principle
The commands are initiated by the reader and controlled by the Digital Control Unit of the
MF1S70yyX. The command response is depending on the state of the IC and for memory
operations also on the access conditions valid for the corresponding sector.
8.2.1 Request standard / all
After Power-On Reset (POR) the card answers to a request REQA or wakeup WUPA
command with the answer to request code (see
Section 9.4,
ATQA according to ISO/IEC
14443A).
8.2.2 Anticollision loop
In the anticollision loop the identifier of a card is read. If there are several cards in the
operating field of the reader, they can be distinguished by their identifier and one can be
selected (select card) for further transactions. The unselected cards return to the idle state
and wait for a new request command. If the 7-byte UID is used for anticollision and
selection, two cascade levels need to be processes as defined in ISO/IEC 14443-3.
MF1S70YYX
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.0 — 2 May 2011
196430
5 of 40
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参数对比
与MF1S7030XDA8相近的元器件有:MF1S7000XDA4、MF1S7000XDA8、MF1S7001XDUD、MF1S7001XDUF、MF1S7030XDA4、MF1S7031XDUD、MF1S7031XDUF。描述及对比如下:
型号 MF1S7030XDA8 MF1S7000XDA4 MF1S7000XDA8 MF1S7001XDUD MF1S7001XDUF MF1S7030XDA4 MF1S7031XDUD MF1S7031XDUF
描述 SPECIALTY CONSUMER CIRCUIT, XMA4 SPECIALTY CONSUMER CIRCUIT, XMA4 SPECIALTY CONSUMER CIRCUIT, XMA4 SPECIALTY CONSUMER CIRCUIT, UUC4 SPECIALTY CONSUMER CIRCUIT, UUC4 SPECIALTY CONSUMER CIRCUIT, XMA4 SPECIALTY CONSUMER CIRCUIT, UUC4 SPECIALTY CONSUMER CIRCUIT, UUC4
厂商名称 NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
商用集成电路类型 CONSUMER CIRCUIT CONSUMER CIRCUIT CONSUMER CIRCUIT CONSUMER CIRCUIT CONSUMER CIRCUIT CONSUMER CIRCUIT CONSUMER CIRCUIT CONSUMER CIRCUIT
JESD-30 代码 R-XXMA-N4 R-XXMA-N4 R-XXMA-N4 R-XUUC-N4 R-XUUC-N4 R-XXMA-N4 R-XUUC-N4 R-XUUC-N4
功能数量 1 1 1 1 1 1 1 1
端子数量 4 4 4 4 4 4 4 4
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
最低工作温度 -25 °C -25 °C -25 °C -25 °C -25 °C -25 °C -25 °C -25 °C
封装主体材料 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY UNCASED CHIP UNCASED CHIP MICROELECTRONIC ASSEMBLY UNCASED CHIP UNCASED CHIP
表面贴装 YES YES YES YES YES YES YES YES
温度等级 OTHER OTHER OTHER OTHER OTHER OTHER OTHER OTHER
端子形式 NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
端子位置 UNSPECIFIED UNSPECIFIED UNSPECIFIED UPPER UPPER UNSPECIFIED UPPER UPPER
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