Freescale Semiconductor
Data Sheet: Product Preview
Document Number: K30P144M100SF2
Rev. 1, 11/2010
Features
• Operating Characteristics
– Voltage range: 1.71 to 3.6 V
– Flash write voltage range: 1.71 to 3.6 V
– Temperature range (ambient): -40 to 105°C
• Performance
– Up to 100 MHz ARM Cortex-M4 core with DSP
instructions delivering 1.25 Dhrystone MIPS per
MHz
• Memories and memory interfaces
– Up to 512 KB program flash memory on non-
FlexMemory devices
– Up to 256 KB program flash memory on
FlexMemory devices
– Up to 256 KB FlexNVM on FlexMemory devices
– 4 KB FlexRAM on FlexMemory devices
– Up to 128 KB RAM
– Serial programming interface (EzPort)
– FlexBus external bus interface
• Clocks
– 1 to 32 MHz crystal oscillator
– 32 kHz crystal oscillator
– Multi-purpose clock generator
• System peripherals
– 10 low-power modes to provide power optimization
based on application requirements
– Memory protection unit with multi-master
protection
– 16-channel DMA controller, supporting up to 64
request sources
– External watchdog monitor
– Software watchdog
– Low-leakage wakeup unit
This document contains information on a product under development. Freescale
reserves the right to change or discontinue this product without notice.
© 2010–2010 Freescale Semiconductor, Inc.
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Supports the following:
MK30X128VLQ100,
MK30X128VMD100,
MK30X256VLQ100,
MK30X256VMD100,
MK30N512VLQ100,
MK30N512VMD100
K30 Sub-Family Data Sheet
K30P144M100SF2
• Security and integrity modules
– Hardware CRC module to support fast cyclic
redundancy checks
– 128-bit unique identification (ID) number per chip
• Human-machine interface
– Segment LCD controller supporting up to 40
frontplanes and 8 backplanes, or 44 frontplanes and
4 backplanes
– Low-power hardware touch sensor interface (TSI)
– General-purpose input/output
• Analog modules
– 16-bit SAR ADC with PGA (x64)
– 12-bit DAC
– Analog comparator (CMP) containing a 6-bit DAC
and programmable reference input
– Voltage reference
• Timers
– Programmable delay block
– Eight-channel motor control/general purpose/PWM
timers
– Two-channel quadrature decoder/general purpose
timers
– Periodic interrupt timers
– 16-bit low-power timer
– Carrier modulator transmitter
– Real-time clock
• Communication interfaces
– Controller Area Network (CAN) module
– SPI modules
– I2C modules
– UART modules
– Secure Digital host controller (SDHC)
– I2S
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K30 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Preliminary
Freescale Semiconductor, Inc.
Table of Contents
1 Ordering parts...........................................................................5
1.1 Determining valid orderable parts......................................5
2 Part identification......................................................................5
2.1 Description.........................................................................5
2.2 Format...............................................................................5
2.3 Fields.................................................................................5
2.4 Example............................................................................6
3 Terminology and guidelines......................................................6
3.1 Definition: Operating requirement......................................6
3.2 Definition: Operating behavior...........................................7
3.3 Definition: Attribute............................................................7
6.3.3
6.1 Core modules....................................................................20
6.1.1
6.1.2
Debug trace timing specifications.........................20
JTAG electricals....................................................21
6.2 System modules................................................................24
6.3 Clock modules...................................................................24
6.3.1
6.3.2
MCG Specifications...............................................24
Oscillator Electrical Characteristics.......................26
6.3.2.1
6.3.2.2
Oscillator DC Electrical Specifications 26
Oscillator frequency specifications......27
3.4 Definition: Rating...............................................................8
3.5 Result of exceeding a rating..............................................8
3.6 Relationship between ratings and operating
requirements......................................................................8
3.7 Guidelines for ratings and operating requirements............9
3.8 Definition: Typical value.....................................................9
3.9 Typical Value Conditions...................................................10
4 Ratings......................................................................................10
4.1 Thermal handling ratings...................................................10
4.2 Moisture handling ratings..................................................11
4.3 ESD handling ratings.........................................................11
4.4 Voltage and current operating ratings...............................11
5 General.....................................................................................12
5.1 Nonswitching electrical specifications...............................12
5.1.1
5.1.2
5.1.3
5.1.4
5.1.5
Voltage and Current Operating Requirements......12
LVD and POR operating requirements.................13
Voltage and current operating behaviors..............14
Power mode transition operating behaviors..........14
Power consumption operating behaviors..............15
5.1.5.1
Diagram: Typical IDD_RUN operating
behavior...............................................17
5.1.6
5.1.7
5.1.8
EMC radiated emissions operating behaviors.......18
Designing with radiated emissions in mind...........19
Capacitance attributes..........................................19
6.6.2
6.6.3
5.2 Switching electrical specifications.....................................19
5.3 Thermal specifications.......................................................19
5.3.1
5.3.2
Thermal operating requirements...........................20
Thermal attributes.................................................20
6 Peripheral operating requirements and behaviors....................20
Freescale Semiconductor, Inc.
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6.3.3.1
6.3.3.2
6.4.1
6.4.1.1
6.4.1.2
6.4.1.3
6.4.1.4
6.4.1.5
6.4.2
6.4.3
6.6.1
6.6.1.1
6.6.1.2
6.6.1.3
6.6.1.4
6.6.3.1
6.6.3.2
6.6.4
32kHz Oscillator Electrical Characteristics............28
32kHz Oscillator DC Electrical
Specifications......................................28
32kHz Oscillator Frequency
Specifications......................................28
6.4 Memories and memory interfaces.....................................29
Flash (FTFL) Electrical Characteristics.................29
Flash Timing Parameters — Program
and Erase............................................29
Flash Timing Parameters —
Commands..........................................29
Flash (FTFL) Current and Power
Parameters..........................................31
Reliability Characteristics....................31
Write Endurance to FlexRAM for
EEPROM.............................................32
EzPort Switching Specifications............................33
Flexbus Switching Specifications..........................34
6.5 Security and integrity modules..........................................36
6.6 Analog...............................................................................36
ADC electrical specifications.................................36
16-bit ADC operating conditions..........37
16-bit ADC electrical characteristics....39
16-bit ADC with PGA operating
conditions............................................42
16-bit ADC with PGA characteristics...43
CMP and 6-bit DAC electrical specifications.........44
12-bit DAC electrical characteristics.....................45
12-bit DAC operating requirements.....45
12-bit DAC operating behaviors..........46
Voltage Reference Electrical Specifications..........48
K30 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
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3
6.7 Timers................................................................................49
6.8 Communication interfaces.................................................49
6.8.1
DSPI Switching Specifications for Low-speed
Operation..............................................................50
6.8.2
DSPI Switching Specifications (High-speed
mode)....................................................................51
6.8.3
6.8.4
SDHC Specifications.............................................53
I2S Switching Specifications.................................54
6.9.1
6.9.2
6.9.3
General Switching Specifications..........................56
TSI Electrical Specifications..................................56
LCD electrical characteristics................................57
7 Dimensions...............................................................................58
7.1 Obtaining package dimensions.........................................58
8 Pinout........................................................................................59
8.1 K30 Signal Multiplexing and Pin Assignments..................59
8.2 K30 Pinouts.......................................................................64
9 Revision History........................................................................66
6.9 Human-machine interfaces (HMI)......................................56
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K30 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Preliminary
Freescale Semiconductor, Inc.
Ordering parts
1 Ordering parts
1.1 Determining valid orderable parts
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to
www.freescale.com
and perform a part number search for
the following device numbers: PK30 and MK30.
2 Part identification
2.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
2.2 Format
Part numbers for this device have the following format:
Q K## M FFF T PP CCC N
2.3 Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field
Q
K##
M
Qualification status
Kinetis family
Flash memory type
Description
Values
• M = Fully qualified, general market flow
• P = Prequalification
• K30
• N = Program flash only
• X = Program flash and FlexMemory
Table continues on the next page...
Freescale Semiconductor, Inc.
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K30 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Preliminary
5
