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MK40X512VMD100

RISC MICROCONTROLLER, PBGA144, 13 X 13 MM, MAPBGA-144

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:NXP(恩智浦)

厂商官网:https://www.nxp.com

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器件参数
参数名称
属性值
零件包装代码
BGA
包装说明
LBGA,
针数
144
Reach Compliance Code
unknown
具有ADC
YES
地址总线宽度
位大小
32
最大时钟频率
50 MHz
DAC 通道
YES
DMA 通道
YES
外部数据总线宽度
JESD-30 代码
S-PBGA-B144
长度
13 mm
I/O 线路数量
100
端子数量
144
最高工作温度
105 °C
最低工作温度
-40 °C
PWM 通道
YES
封装主体材料
PLASTIC/EPOXY
封装代码
LBGA
封装形状
SQUARE
封装形式
GRID ARRAY, LOW PROFILE
认证状态
Not Qualified
ROM可编程性
FLASH
座面最大高度
1.7 mm
速度
100 MHz
最大供电电压
3.6 V
最小供电电压
1.71 V
标称供电电压
3.3 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子形式
BALL
端子节距
1 mm
端子位置
BOTTOM
宽度
13 mm
uPs/uCs/外围集成电路类型
MICROCONTROLLER, RISC
Base Number Matches
1
文档预览
Freescale Semiconductor
Data Sheet: Product Preview
Document Number: K40P144M100SF2
Rev. 1, 11/2010
Features
• Operating Characteristics
– Voltage range: 1.71 to 3.6 V
– Flash write voltage range: 1.71 to 3.6 V
– Temperature range (ambient): -40 to 105°C
• Performance
– Up to 100 MHz ARM Cortex-M4 core with DSP
instructions delivering 1.25 Dhrystone MIPS per
MHz
• Memories and memory interfaces
– Up to 512 KB program flash memory on non-
FlexMemory devices
– Up to 256 KB program flash memory on
FlexMemory devices
– Up to 256 KB FlexNVM on FlexMemory devices
– 4 KB FlexRAM on FlexMemory devices
– Up to 128 KB RAM
– Serial programming interface (EzPort)
– FlexBus external bus interface
• Clocks
– 1 to 32 MHz crystal oscillator
– 32 kHz crystal oscillator
– Multi-purpose clock generator
• System peripherals
– 10 low-power modes to provide power optimization
based on application requirements
– Memory protection unit with multi-master
protection
– 16-channel DMA controller, supporting up to 64
request sources
– External watchdog monitor
– Software watchdog
– Low-leakage wakeup unit
This document contains information on a product under development. Freescale
reserves the right to change or discontinue this product without notice.
© 2010–2010 Freescale Semiconductor, Inc.
Preliminary
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Supports the following:
MK40X128VLQ100,
MK40X128VMD100,
MK40X256VLQ100,
MK40X256VMD100,
MK40N512VLQ100,
MK40N512VMD100
K40 Sub-Family Data Sheet
K40P144M100SF2
• Security and integrity modules
– Hardware CRC module to support fast cyclic
redundancy checks
– 128-bit unique identification (ID) number per chip
• Human-machine interface
– Segment LCD controller supporting up to 40
frontplanes and 8 backplanes, or 44 frontplanes and
4 backplanes
– Low-power hardware touch sensor interface (TSI)
– General-purpose input/output
• Analog modules
– 16-bit SAR ADC with PGA (x64)
– 12-bit DAC
– Analog comparator (CMP) containing a 6-bit DAC
and programmable reference input
– Voltage reference
• Timers
– Programmable delay block
– Eight-channel motor control/general purpose/PWM
timers
– Two-channel quadrature decoder/general purpose
timers
– Periodic interrupt timers
– 16-bit low-power timer
– Carrier modulator transmitter
– Real-time clock
• Communication interfaces
– USB full-/low-speed On-the-Go controller with on-chip transceiver
– Controller Area Network (CAN) module
– SPI modules
– I2C modules
– UART modules
– Secure Digital host controller (SDHC)
– I2S
2
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K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Preliminary
Freescale Semiconductor, Inc.
Table of Contents
1 Ordering parts...........................................................................5
1.1 Determining valid orderable parts......................................5
2 Part identification......................................................................5
2.1 Description.........................................................................5
2.2 Format...............................................................................5
2.3 Fields.................................................................................5
2.4 Example............................................................................6
3 Terminology and guidelines......................................................6
3.1 Definition: Operating requirement......................................6
3.2 Definition: Operating behavior...........................................7
3.3 Definition: Attribute............................................................7
6 Peripheral operating requirements and behaviors....................20
6.1 Core modules....................................................................20
6.1.1
6.1.2
Debug trace timing specifications.........................20
JTAG electricals....................................................21
6.2 System modules................................................................24
6.3 Clock modules...................................................................24
6.3.1
6.3.2
MCG Specifications...............................................24
Oscillator Electrical Characteristics.......................26
6.3.2.1
6.3.2.2
Oscillator DC Electrical Specifications 26
Oscillator frequency specifications......27
3.4 Definition: Rating...............................................................8
3.5 Result of exceeding a rating..............................................8
3.6 Relationship between ratings and operating
requirements......................................................................8
3.7 Guidelines for ratings and operating requirements............9
3.8 Definition: Typical value.....................................................9
3.9 Typical Value Conditions...................................................10
4 Ratings......................................................................................10
4.1 Thermal handling ratings...................................................10
4.2 Moisture handling ratings..................................................11
4.3 ESD handling ratings.........................................................11
4.4 Voltage and current operating ratings...............................11
5 General.....................................................................................12
5.1 Nonswitching electrical specifications...............................12
5.1.1
5.1.2
5.1.3
5.1.4
5.1.5
Voltage and Current Operating Requirements......12
LVD and POR operating requirements.................13
Voltage and current operating behaviors..............14
Power mode transition operating behaviors..........14
Power consumption operating behaviors..............15
5.1.5.1
Diagram: Typical IDD_RUN operating
behavior...............................................17
5.1.6
5.1.7
5.1.8
EMC radiated emissions operating behaviors.......18
Designing with radiated emissions in mind...........19
Capacitance attributes..........................................19
5.2 Switching electrical specifications.....................................19
5.3 Thermal specifications.......................................................19
5.3.1
5.3.2
Thermal operating requirements...........................20
Thermal attributes.................................................20
6.6.2
6.6.3
Freescale Semiconductor, Inc.
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6.3.3
6.3.3.1
6.3.3.2
6.4.1
6.4.1.1
6.4.1.2
6.4.1.3
6.4.1.4
6.4.1.5
6.4.2
6.4.3
6.6.1
6.6.1.1
6.6.1.2
6.6.1.3
6.6.1.4
6.6.3.1
32kHz Oscillator Electrical Characteristics............28
32kHz Oscillator DC Electrical
Specifications......................................28
32kHz Oscillator Frequency
Specifications......................................28
6.4 Memories and memory interfaces.....................................29
Flash (FTFL) Electrical Characteristics.................29
Flash Timing Parameters — Program
and Erase............................................29
Flash Timing Parameters —
Commands..........................................29
Flash (FTFL) Current and Power
Parameters..........................................31
Reliability Characteristics....................31
Write Endurance to FlexRAM for
EEPROM.............................................32
EzPort Switching Specifications............................33
Flexbus Switching Specifications..........................34
6.5 Security and integrity modules..........................................36
6.6 Analog...............................................................................36
ADC electrical specifications.................................36
16-bit ADC operating conditions..........37
16-bit ADC electrical characteristics....39
16-bit ADC with PGA operating
conditions............................................42
16-bit ADC with PGA characteristics...43
CMP and 6-bit DAC electrical specifications.........44
12-bit DAC electrical characteristics.....................45
12-bit DAC operating requirements.....45
K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Preliminary
3
6.6.3.2
6.6.4
12-bit DAC operating behaviors..........46
6.8.7
I2S Switching Specifications.................................55
Voltage Reference Electrical Specifications..........48
6.9 Human-machine interfaces (HMI)......................................57
6.9.1
6.9.2
6.9.3
General Switching Specifications..........................57
TSI Electrical Specifications..................................58
LCD electrical characteristics................................58
6.7 Timers................................................................................49
6.8 Communication interfaces.................................................49
6.8.1
6.8.2
6.8.3
6.8.4
USB electrical specifications.................................50
USB DCD Electrical Specifications.......................50
USB Voltage Regulator Electrical Specifications. .50
DSPI Switching Specifications for Low-speed
Operation..............................................................51
6.8.5
DSPI Switching Specifications (High-speed
mode)....................................................................52
6.8.6
7 Dimensions...............................................................................59
7.1 Obtaining package dimensions.........................................60
8 Pinout........................................................................................60
8.1 K40 Signal Multiplexing and Pin Assignments..................60
8.2 K40 Pinouts.......................................................................65
9 Revision History........................................................................67
SDHC Specifications.............................................54
4
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K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Preliminary
Freescale Semiconductor, Inc.
Ordering parts
1 Ordering parts
1.1 Determining valid orderable parts
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to
www.freescale.com
and perform a part number search for
the following device numbers: PK40 and MK40.
2 Part identification
2.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
2.2 Format
Part numbers for this device have the following format:
Q K## M FFF T PP CCC N
2.3 Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field
Q
K##
M
Qualification status
Kinetis family
Flash memory type
Description
Values
• M = Fully qualified, general market flow
• P = Prequalification
• K40
• N = Program flash only
• X = Program flash and FlexMemory
Table continues on the next page...
Freescale Semiconductor, Inc.
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K40 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Preliminary
5
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参数对比
与MK40X512VMD100相近的元器件有:MK40X512VMD100R、MK40X512VLQ100R。描述及对比如下:
型号 MK40X512VMD100 MK40X512VMD100R MK40X512VLQ100R
描述 RISC MICROCONTROLLER, PBGA144, 13 X 13 MM, MAPBGA-144 RISC MICROCONTROLLER, PBGA144, 13 X 13 MM, MAPBGA-144 RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, LQFP-144
零件包装代码 BGA BGA QFP
包装说明 LBGA, LBGA, LFQFP,
针数 144 144 144
Reach Compliance Code unknown unknown unknown
具有ADC YES YES YES
位大小 32 32 32
最大时钟频率 50 MHz 50 MHz 50 MHz
DAC 通道 YES YES YES
DMA 通道 YES YES YES
JESD-30 代码 S-PBGA-B144 S-PBGA-B144 S-PQFP-G144
长度 13 mm 13 mm 20 mm
I/O 线路数量 100 100 100
端子数量 144 144 144
最高工作温度 105 °C 105 °C 105 °C
最低工作温度 -40 °C -40 °C -40 °C
PWM 通道 YES YES YES
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LBGA LBGA LFQFP
封装形状 SQUARE SQUARE SQUARE
封装形式 GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE FLATPACK, LOW PROFILE, FINE PITCH
认证状态 Not Qualified Not Qualified Not Qualified
ROM可编程性 FLASH FLASH FLASH
座面最大高度 1.7 mm 1.7 mm 1.6 mm
速度 100 MHz 100 MHz 100 MHz
最大供电电压 3.6 V 3.6 V 3.6 V
最小供电电压 1.71 V 1.71 V 1.71 V
标称供电电压 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES
技术 CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 BALL BALL GULL WING
端子节距 1 mm 1 mm 0.5 mm
端子位置 BOTTOM BOTTOM QUAD
宽度 13 mm 13 mm 20 mm
uPs/uCs/外围集成电路类型 MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 1 -
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