Freescale Semiconductor, Inc.
Data Sheet: Technical Data
KV31P100M120SF8
Rev. 7, 02/2016
Kinetis KV31F 256 KB Flash
120 MHz ARM® Cortex®-M4-Based Microcontroller with FPU
MKV31F256VLL12
MKV31F256VLH12
MKV31F256VLH12P
The KV31 MCU family is a highly scalable member of the Kinetis
V Series and provides a high-performance, cost-competitive
motor control solution. Built on the ARM
®
Cortex
®
-M4 core
running at 120 MHz, combined with floating point and DSP
capability, it delivers a highly capable platform enabling
customers to build a highly scalable solution portfolio.
Additional features include:
• Dual 16-bit ADCs sampling at up to 1.2 MS/s in 12-bit
mode
100 LQFP (LL)
64 LQFP (LH)
14 x 14 x 1.4 Pitch 0.5 10 x 10 x 1.4 Pitch 0.5
• 12 channels of highly flexible motor control timers (PWMs)
mm
mm
across 3 independent time bases
• Large RAM block enabling local execution of fast control
loops at full clock speed
• Enabled to support Kinetis Motor Suite (KMS), a bundled
hardware and software solution that enables rapid configuration of BLDC and PMSM motor drive
systems
Performance
• 120 MHz ARM Cortex-M4 core with DSP instructions
delivering 1.25 Dhrystone MIPS per MHz
Memories and memory interfaces
• 256 KB of embedded flash and 48 KB of RAM
• Preprogrammed Kinetis flashloader for one-time, in-
system factory programming
System peripherals
• 16-channel DMA controller
• Independent external and software watchdog monitor
Clocks
• One crystal oscillator, two ranges: 32-40 kHz or 3-32
MHz
• Three internal oscillators: 32 kHz, 4 MHz, and 48 MHz
• Multi-purpose clock generator with PLL and FLL
Security and integrity modules
• Hardware CRC module
• 128-bit unique identification (ID) number per chip
• Hardware random-number generator
• Flash access control to protect proprietary software
Human-machine interface
Analog modules
• Two 16-bit SAR ADCs (1.2 MS/s in 12bit mode)
• One 12-bit DAC
• Two analog comparators (CMP) with 6- bit DAC
• Accurate internal voltage reference
Communication interfaces
• Two SPI modules
• Three UART modules and one low-power UART
• Two I2C modules: Support for up to 1 Mbps
operation
Timers
• One 8-channel motor control/general purpose/ PWM
timer
• Two 2-channel motor control/general purpose timers
with quadrature decoder functionality
Operating Characteristics
• Voltage range (including flash writes): 1.71 to 3.6 V
• Temperature range (ambient): -40 to 105°C
Kinetis Motor Suite
• Supports Velocity and Position control of BLDC &
PMSM motors
© 2014–2016 Freescale Semiconductor, Inc. All rights reserved.
• Up to 70 general-purpose I/O (GPIO)
• Implements Field Orient Control (FOC) using Back
EMF to improve motor efficiency
• Utilizes SpinTAC control theory that improves
overall system performance and reliability
Ordering Information
Part Number
Flash (KB)
MKV31F256VLL12
MKV31F256VLH12
MKV31F256VLH12P
256
256
248
Memory
SRAM (KB)
48
48
48
70
46
46
Number of GPIOs
Related Resources
Type
Selector
Guide
Product Brief
Reference
Manual
Data Sheet
Chip Errata
KMS User
Guide
KMS API
Reference
Manual
Package
drawing
Description
The Freescale Solution Advisor is a web-based tool that features
interactive application wizards and a dynamic product selector
The Product Brief contains concise overview/summary information to
enable quick evaluation of a device for design suitability.
The Reference Manual contains a comprehensive description of the
structure and function (operation) of a device.
The Data Sheet is this document. It includes electrical characteristics
and signal connections.
Resource
Product Selector
KV30FKV31FPB
KV31P100M120SF8RM
KV31P100M120SF8
The chip mask set Errata provides additional or corrective information for KINETIS_xN51M
1
a particular device mask set.
The KMS User Guide provides a comprehensive description of the
features and functions of the Kinetis Motor Suite solution.
Kinetis Motor Suite User’s Guide
(KMS100UG)
2
The KMS API reference manual provides a comprehensive description of Kinetis Motor Suite API
the API of the Kinetis Motor Suite function blocks.
Reference Manual
(KMS100RM)
2
Package dimensions are provided by part number:
• MKV31F256VLL12
• MKV31F256VLH12
• MKV31F256VLH12P
Package drawing:
•
98ASS23308W
•
98ASS23234W
•
98ASS23234W
1. To find the associated resource, go to
freescale.com
and perform a search using this term with the
x
replaced by the
revision of the device you are using.
2. To find the associated resource, go to
freescale.com
and perform a search using Document ID
Figure 1
shows the functional modules in the chip.
2
Freescale Semiconductor, Inc.
Kinetis KV31F 256 KB Flash, Rev. 7, 02/2016
ARM
®
Cortex™-M4
Core
System
DMA (16ch)
Memories and Memory Interfaces
Program
flash
(256 KB)
Serial
programming
interface
(EzPort)
RAM
(48 KB)
Clocks
Phase-
locked loop
Frequency-
locked loop
Low/high
frequency
oscillators
Debug
interfaces
Interrupt
controller
DSP
Low-leakage
wakeup
Internal
and external
watchdogs
FPU
Internal
reference
clocks
and Integrity
CRC
Random-
number
generator
Flash access
control
Security
Analog
16-bit
ADC x2
Comparator
with 6-bit DAC
x2
12-bit DAC
High
performance
voltage ref
Timers
Timers
x1 (8ch)
x2 (2ch)
Programmable
Communication Interfaces
I
C
x2
SPI
x2
2
Human-Machine
Interface (HMI)
Up to
70 GPIOs
UART
x3
LPUART
x1
delay block
Periodic
interrupt
timers
16-bit
low-power
timer
Figure 1. Functional block diagram
Kinetis KV31F 256 KB Flash, Rev. 7, 02/2016
3
Freescale Semiconductor, Inc.
Table of Contents
1 Ratings.................................................................................... 5
1.1 Thermal handling ratings................................................. 5
1.2 Moisture handling ratings................................................ 5
1.3 ESD handling ratings....................................................... 5
1.4 Voltage and current operating ratings............................. 5
2 General................................................................................... 6
2.1 AC electrical characteristics.............................................6
2.2 Nonswitching electrical specifications..............................6
2.2.1 Voltage and current operating requirements....... 6
2.2.2 LVD and POR operating requirements................7
2.2.3 Voltage and current operating behaviors.............8
2.2.4 Power mode transition operating behaviors........ 9
2.2.5 Power consumption operating behaviors............ 10
2.2.6 EMC radiated emissions operating behaviors..... 16
2.2.7 Designing with radiated emissions in mind..........17
2.2.8 Capacitance attributes.........................................17
2.3 Switching specifications...................................................17
2.3.1 Device clock specifications..................................17
2.3.2 General switching specifications......................... 18
2.4 Thermal specifications..................................................... 18
2.4.1 Thermal operating requirements......................... 19
2.4.2 Thermal attributes................................................19
3 Peripheral operating requirements and behaviors.................. 20
3.1 Core modules.................................................................. 20
3.1.1 SWD electricals .................................................. 20
3.1.2 JTAG electricals.................................................. 21
3.2 System modules.............................................................. 24
3.3 Clock modules................................................................. 24
3.3.1 MCG specifications..............................................24
3.3.2 IRC48M specifications.........................................27
3.3.3 Oscillator electrical specifications........................27
3.4 Memories and memory interfaces................................... 29
3.4.1 Flash electrical specifications.............................. 29
3.4.2 EzPort switching specifications........................... 31
3.5 Security and integrity modules........................................ 32
3.6 Analog............................................................................. 32
3.6.1 ADC electrical specifications............................... 32
3.6.2
3.6.3
3.6.4
CMP and 6-bit DAC electrical specifications....... 36
12-bit DAC electrical characteristics....................39
Voltage reference electrical specifications.......... 42
4
5
6
7
3.7 Timers..............................................................................43
3.8 Communication interfaces............................................... 43
3.8.1 DSPI switching specifications (limited voltage
range).................................................................. 44
3.8.2 DSPI switching specifications (full voltage
range).................................................................. 45
3.8.3 Inter-Integrated Circuit Interface (I2C) timing...... 47
3.8.4 UART switching specifications............................ 49
3.9 Kinetis Motor Suite.......................................................... 49
Dimensions............................................................................. 49
4.1 Obtaining package dimensions....................................... 49
Pinout...................................................................................... 50
5.1 KV31F Signal Multiplexing and Pin Assignments............ 50
5.2 Recommended connection for unused analog and
digital pins........................................................................54
5.3 KV31F Pinouts.................................................................55
Part identification.....................................................................57
6.1 Description.......................................................................57
6.2 Format............................................................................. 58
6.3 Fields............................................................................... 58
6.4 Example...........................................................................59
Terminology and guidelines.................................................... 59
7.1 Definitions........................................................................ 59
7.2 Examples......................................................................... 59
7.3 Typical-value conditions.................................................. 60
7.4 Relationship between ratings and operating
requirements....................................................................60
7.5 Guidelines for ratings and operating requirements..........61
8 Revision History...................................................................... 61
4
Freescale Semiconductor, Inc.
Kinetis KV31F 256 KB Flash, Rev. 7, 02/2016
Ratings
1 Ratings
1.1 Thermal handling ratings
Symbol
T
STG
T
SDR
Description
Storage temperature
Solder temperature, lead-free
Min.
–55
—
Max.
150
260
Unit
°C
°C
Notes
1
2
1. Determined according to JEDEC Standard JESD22-A103,
High Temperature Storage Life.
2. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
1.2 Moisture handling ratings
Symbol
MSL
Description
Moisture sensitivity level
Min.
—
Max.
3
Unit
—
Notes
1
1. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
1.3 ESD handling ratings
Symbol
V
HBM
V
CDM
I
LAT
Description
Electrostatic discharge voltage, human body model
Electrostatic discharge voltage, charged-device
model
Latch-up current at ambient temperature of 105°C
Min.
-2000
-500
-100
Max.
+2000
+500
+100
Unit
V
V
mA
Notes
1
2
3
1. Determined according to JEDEC Standard JESD22-A114,
Electrostatic Discharge (ESD) Sensitivity Testing Human
Body Model (HBM).
2. Determined according to JEDEC Standard JESD22-C101,
Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components.
3. Determined according to JEDEC Standard JESD78,
IC Latch-Up Test.
1.4 Voltage and current operating ratings
Kinetis KV31F 256 KB Flash, Rev. 7, 02/2016
5
Freescale Semiconductor, Inc.
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