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ML22823-XXXMB

描述:
Consumer Circuit, PDSO30, 0.65 MM PITCH, PLASTIC, SSOP-30
分类:
文件大小:
1MB,共63页
制造商:
概述
Consumer Circuit, PDSO30, 0.65 MM PITCH, PLASTIC, SSOP-30
器件参数
参数名称
属性值
厂商名称
LAPIS Semiconductor Co Ltd
零件包装代码
SSOP
包装说明
SSOP, SSOP30,.3
针数
30
Reach Compliance Code
unknown
其他特性
ALSO OPERATES WITH 4.5V-5.5V SUPPLY
商用集成电路类型
CONSUMER CIRCUIT
JESD-30 代码
R-PDSO-G30
长度
9.7 mm
功能数量
1
端子数量
30
最高工作温度
85 °C
最低工作温度
-40 °C
封装主体材料
PLASTIC/EPOXY
封装代码
SSOP
封装等效代码
SSOP30,.3
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, SHRINK PITCH
电源
3/5 V
认证状态
Not Qualified
座面最大高度
1.85 mm
最大压摆率
25 mA
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
2.7 V
表面贴装
YES
温度等级
INDUSTRIAL
端子形式
GULL WING
端子节距
0.65 mm
端子位置
DUAL
宽度
5.6 mm
文档预览
FEDL228XX-05
Issue Date: Oct. 10, 2013
ML2282X-XXX/ML2286X-XXX
Speech Synthesis LSI with Built-in P2ROM Including 2-Channel Mixing Function
GENERAL DESCRIPTION
ML2282X(ML22825/ML22824/ML22823-XXX) and ML2286X (ML22865/ML22864/ML22863-XXX) are
voice synthesis LSIs with built-in P2ROM that stores speech data.
These LSIs include edit ROM, ADPCM2 decoder, 16-bit DA converter, low pass filter and monaural speaker
amplifier. Also, ML2282X supports the synchronous serial interface and ML22865/ML22864/ML22863
supports the I2C interface.
By integrating all the functions required for voice output into a single chip, these LSIs can be more easily
incorporated in compact portable devices.
Built-in memory capacity and maximum vocal reproduction time:
(at the case of 4-bit ADPCM2 algorithm)
Product name
ML22825-XXX/ML22865
ML22824-XXX/ML22864
ML22823-XXX/ML22863
ROM capacity
16 Mbits
8 Mbits
4 Mbits
Maximum vocal reproduction time (sec)
F
S
= 8.0 kHz
F
S
= 16 kHz
F
S
= 4.0 kHz
1,044
522
261
520
260
130
258
129
64
4-bit ADPCM2
8-bit Nonlinear PCM
8-bit PCM , 16-bit PCM
Can be specified for each phrase.
Sampling frequency(Fs):
4.0 / 5.3 / 6.4 / 8.0 / 10.6 / 12.0 / 12.8 / 16.0 / 21.3 / 24.0 / 25.6 / 32.0 /
48.0 kHz
f
s
can be specified for each phrase.
Built-in low-pass filter and 16-bit DA converter
Speaker driving amplifier:
0.7 W (when 8Ω , DV
DD
=5 V, Ta=25°C)
2ch analog input (internal: 1ch; external: 1ch)
CPU command interface:
3-wired serial clock-synchronized (ML2282X)
I2C interface (ML2286X)
Maximum number of phrases:
4,096 phrases from 000h to 3FFh (1024 phrases/bank)
Memory bank switching:
Enabled between bank 1 and bank 4 using the SEL0 and SEL1 pins
Volume control:
32 levels (OFF is included) can be set by CVOL command.
50 levels (OFF is included) can be set by AVOL command
Repeat function:
LOOP commands
2-channel mixing function:
Available except case using 32kHz as sampling frequencys
Source oscillation frequency:
4.096 MHz
Power supply voltage:
2.7 to 3.6V / 4.5 to 5.5 V
Operating temperature range:
–40 to +85°C
Package:
30-pin plastic SSOP (SSOP30-P-56-0.65-K-MC)
Product name:
ML22825-xxxMB, ML22824-xxxMB, ML22823-xxxMB
ML22865-xxxMB, ML22864-xxxMB, ML22863-xxxMB
(xxx: ROM code No.)
Voice synthesis method:
1/63
FEDL228XX-05
ML2282X-XXX/ ML2286X -XXX
The following table shows the differences among the other speech synthesis LSIs.
Parameter
CPU interface
Playback method
Maximum number
of phrases
Sampling
frequency (kHz)
ML2216
Serial
4-bit ADPCM2
8-bit nonlinear PCM
8-bit straight PCM
16-bit straight PCM
256
4.0/5.3/6.4/
8.0/10.6/12.8
16.0
4.096MHz
(with a built-in crystal
oscillator circuit)
12 bits
3rd order comb filter
Built-in 0.3W
(8Ω, DV
DD
= 5 V)
Yes
No
16 levels
Yes
20 ms to 1024 ms
(4 ms/step)
Yes
No
ML22800 series
ML22825/ML22824/
ML22823-XXX
ML22865/ML22864/
ML22863-XXX
I2C
1,024 (256/bank)
4,096 (1,024/bank)
4.0/5.3/6.4/8.0/
10.6/12.0/12.8/
16.0/21.3/24.0/
25.6/32.0/48.0
16 bits
FIR interpolation filter
Built-in 0.7W
(8Ω, DV
DD
= 5 V)
2-channel
32 levels
Clock frequency
DA converter
Low-pass filter
Speaker driving
amplifier
Edit ROM function
Simultaneous
sound production
function (mixing
function)
Volume control
Silence insertion
Repeat function
Interval at which a
seam is silent
during continuous
playback (Note)
Memory bank
switching
Power supply
voltage
Package
12 bits
3rd order comb filter
No
No
2.7 V to 5.5 V
44-pin QFP
Yes
2.7 V to 3.6 V
30-pin SSOP
2.7 to 3.6V
4.5 to 5.5 V
2.7 to 3.6V
4.5 to 5.5 V
*1: Continuous playback as shown below is possible.
1 phrase
1 phrase
No silence interval
2/63
FEDL228XX-05
ML2282X-XXX/ ML2286X -XXX
BLOCK DIAGRAMS
(ML22825/ML22824/ML22823-XXX : Synchronous serial interface)
DV
DD
DGND
V
DDL
V
DDR
Phrase Address
Latch
Address Counter
ADPCM Synthesizer
Address Controller
Multiplexer
16/8/4Mbit ROM
CSB
SCK
SI
SO
CBUSYB
DIPH
SEL0
SEL1
TESTI0,1
TESTO
RESETB
XT
XTB
PCM Synthesizer
I/O
Interface
LPF
Timing
Controller
16bit DAC
SP-AMP
OSC
PLL
SPV
DD
SPGND
SPM SPP
AIN
(ML22865/ML22864/ML22863-XXX : I2C interface)
DV
DD
DGND
V
DDL
V
DDR
Phrase Address
Latch
Address Counter
ADPCM Synthesizer
Address Controller
Multiplexer
16/8/4Mbit ROM
SDA2-0
SCL
SDA
CBUSYB
SEL0
SEL1
TESTI0,1
TESTO
RESETB
I/O
Interface
PCM Synthesizer
LPF
Timing
Controller
16bit DAC
XT
XTB
SP-AMP
OSC
PLL
SPV
DD
SPGND
SPM SPP
AIN
3/63
FEDL228XX-05
ML2282X-XXX/ ML2286X -XXX
PIN CONFIGURATIONS (TOP VIEW)
(ML22825/ML22824/ML22823-XXXMB : Synchronous serial interface)
AIN
TESTI0
RESETB
TESTO
DIPH
SEL0
SEL1
DGND
CSB
SCK
SI
SO
CBUSYB
DGND
XT
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
SPM
SPP
SPGND
SPV
DD
DGND
SG
TESTI1
V
DDR
DV
DD
V
DDL
NC
DGND
NC
DV
DD
XTB
NC: No Connection
30-Pin Plastic SSOP
(ML22865/ML22864/ML22863-XXXMB : I2C interface)
AIN
TESTI0
RESETB
TESTO
SAD0
SEL0
SEL1
DGND
SAD1
SCL
SDA
SAD2
CBUSYB
DGND
XT
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
SPM
SPP
SPGND
SPV
DD
DGND
SG
TESTI1
V
DDR
DV
DD
V
DDL
NC
DGND
NC
DV
DD
XTB
NC: No Connection
30-Pin Plastic SSOP
4/63
FEDL228XX-05
ML2282X-XXX/ ML2286X -XXX
PIN DESCRIPTION (COMMON TO ALL PRODUCTS)
Pin
1
2
Symbol
AIN
TESTI0
I/O
I
I
Initial value
Description
(*1)
0
Input pin for speaker amplifier.
Input pin for testing.
0
Fix this pin to “L” level (DGND level). This pin has a pull-down resistor
built in.
Input pin for reset.
At the “L” level, the LSI enters initial state. During reset, the entire
circuitry stops and enters power down state. Input “L” level when power is
0
supplied. After the power supply voltage is stable, drive this pin to “H”
(*2)
level. Then the entire circuitry can be powered up.
This pin has a pull-up resistor built in.
Output pins for testing.
Hi-Z
Leave these pins open.
Memory bank switching pins.
0
Fix these pins to “L” level when the memory bank function is not used.
1
Digital ground pin. Also serves as a ground pin for the internal memory.
Output pin for command processing status.
This pin outputs “L” level during command processing. Any command
should be entered when this pin is “H” level.
Connect to the crystal or ceramic resonator.
A feedback resistor around 1 MΩ is built in between this pin and the XTB
pin. Use this pin if need to use an external clock.
If the resonator is used, connect it as close to this pin as possible.
Connect to the crystal or ceramic resonator.
When to use an external clock, leave this pin open.
If the resonator is used, connect it as close to this pin as possible.
Power supply pins for logic circuitry.
Connect a capacitor of 0.1μF or more between these pins and DGND pins.
Non connected pins. Leave these pins open.
Regulator output pin for internal logic circuitry.
Connect a capacitor recommended between this pin and DGND pin.
Regulator output pin for Built-in ROM.
Connect a capacitor recommended between this pin and DGND pin.
Test pin. Fix this pin to a DGND level.
Reference voltage output pin for the speaker amplifier built-in.
Connect a capacitor recommended between this pin and DGND pin.
Power supply pin for the speaker amplifier.
Connect a bypass capacitor of 0.1μF or more between this pin and SPGND
pin.
Ground pin for the speaker amplifier.
Positive(+) output pin of the speaker amplifier built-in.
Serves as the LINE output (*3), if built-in speaker amplifier is not used.
Negative(-) output pin of the speaker amplifier built-in.
3
RESETB
I
4
6, 7
8, 14,
19, 26
13
TESTO
SEL0
SEL1
DGND
CBUSYB
O
I
O
15
XT
I
0
16
17, 22
18, 20
21
23
24
25
27
28
29
30
XTB
DV
DD
N.C
V
DDL
V
DDR
TESTI1
SG
SPV
DD
SPGND
SPP
SPM
O
O
O
1
0
0
0
0
0
Hi-Z
*1: Indicates the initial value during reset input or power down.
*2: “H” during power down.
*3: Outputs a voice signal before amplified by the speaker amplifier built-in.
5/63
参数对比
与ML22823-XXXMB相近的元器件有:ML22825-XXXMB、ML22824-XXXMB。描述及对比如下:
型号 ML22823-XXXMB ML22825-XXXMB ML22824-XXXMB
描述 Consumer Circuit, PDSO30, 0.65 MM PITCH, PLASTIC, SSOP-30 Consumer Circuit, PDSO30, 0.65 MM PITCH, PLASTIC, SSOP-30 Consumer Circuit, PDSO30, 0.65 MM PITCH, PLASTIC, SSOP-30
零件包装代码 SSOP SSOP SSOP
包装说明 SSOP, SSOP30,.3 0.65 MM PITCH, PLASTIC, SSOP-30 0.65 MM PITCH, PLASTIC, SSOP-30
针数 30 30 30
Reach Compliance Code unknown unknown unknown
其他特性 ALSO OPERATES WITH 4.5V-5.5V SUPPLY ALSO OPERATES WITH 4.5V-5.5V SUPPLY ALSO OPERATES WITH 4.5V-5.5V SUPPLY
商用集成电路类型 CONSUMER CIRCUIT CONSUMER CIRCUIT CONSUMER CIRCUIT
JESD-30 代码 R-PDSO-G30 R-PDSO-G30 R-PDSO-G30
长度 9.7 mm 9.7 mm 9.7 mm
功能数量 1 1 1
端子数量 30 30 30
最高工作温度 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SSOP SSOP SSOP
封装等效代码 SSOP30,.3 SSOP30,.3 SSOP30,.3
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
电源 3/5 V 3/5 V 3/5 V
认证状态 Not Qualified Not Qualified Not Qualified
座面最大高度 1.85 mm 1.85 mm 1.85 mm
最大压摆率 25 mA 25 mA 25 mA
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 2.7 V 2.7 V 2.7 V
表面贴装 YES YES YES
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 GULL WING GULL WING GULL WING
端子节距 0.65 mm 0.65 mm 0.65 mm
端子位置 DUAL DUAL DUAL
宽度 5.6 mm 5.6 mm 5.6 mm
Base Number Matches - 1 1
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