
这款微控制器,即ML610Q346/ML610346,具有一些特性,使其特别适合电池驱动的便携设备。以下是它的一些功耗优势:
低电压和低功耗运行:该微控制器的CPU能够在低电压下运行,其flash存储器在读模式下也实现了低功耗,这相当于掩膜ROM的功耗水平。
高效的指令执行:nX-U8/100 CPU能够在每个时钟脉冲执行一条指令,通过3级流水线架构实现并行处理,这有助于减少功耗。
电源管理功能:具备多种电源管理模式,包括HALT模式(仅停止CPU指令执行,而外设继续运行),STOP模式(停止低速和高速振荡,CPU和外设停止运行),以及通过软件改变高速系统时钟频率的时钟齿轮功能。
块控制功能:可以关闭未使用外设的电路,进一步降低功耗。
内置看门狗定时器:在首次溢出时生成非屏蔽中断,在第二次溢出时发生系统重置,这有助于在检测到错误时节省电能。
低功耗的时钟振荡器:内置的RC振荡器为低速时钟提供动力,而外部晶振或陶瓷振荡器用于高速时钟,可以根据需要选择最合适的时钟源以降低功耗。
高效率的D/A转换器:12位的逐次逼近型A/D转换器,转换时间短,每个通道在4.096 MHz时钟频率下仅需26.86微秒,有助于减少在转换期间的能耗。
集成的运算放大器:3个运算放大器通道可以组成反转放大器、反相放大器和比较器,减少了外部元件的需求,有助于降低整体功耗。
优化的I/O端口:包括输入端口、输出端口和输入/输出端口,它们可以作为次要功能复用,有助于减少外部电路的复杂性和功耗。
这些特性结合起来,使得ML610Q346/ML610346微控制器非常适合于对功耗有严格要求的电池驱动便携设备。





| 型号 | ML610Q346J-NNNTB | ML610346J-XXXTB | ML610346-XXXTB | ML610Q346-NNNTB | ML610Q346J-XXXTB | ML610Q346-XXXTB |
|---|---|---|---|---|---|---|
| 描述 | RISC Microcontroller, 8-Bit, FLASH, 4.2MHz, CMOS, PQFP64, 10 X 10 MM, 0.50 MM PITCH, PLASTIC, TQFP-64 | RISC Microcontroller, 8-Bit, MROM, 4.2MHz, CMOS, PQFP64, 10 X 10 MM, 0.50 MM PITCH, PLASTIC, TQFP-64 | RISC Microcontroller, 8-Bit, MROM, 4.2MHz, CMOS, PQFP64, 10 X 10 MM, 0.50 MM PITCH, PLASTIC, TQFP-64 | RISC Microcontroller, 8-Bit, FLASH, 4.2MHz, CMOS, PQFP64, 10 X 10 MM, 0.50 MM PITCH, PLASTIC, TQFP-64 | RISC Microcontroller, 8-Bit, FLASH, 4.2MHz, CMOS, PQFP64, 10 X 10 MM, 0.50 MM PITCH, PLASTIC, TQFP-64 | RISC Microcontroller, 8-Bit, FLASH, 4.2MHz, CMOS, PQFP64, 10 X 10 MM, 0.50 MM PITCH, PLASTIC, TQFP-64 |
| 零件包装代码 | QFP | QFP | QFP | QFP | QFP | QFP |
| 包装说明 | 10 X 10 MM, 0.50 MM PITCH, PLASTIC, TQFP-64 | 10 X 10 MM, 0.50 MM PITCH, PLASTIC, TQFP-64 | 10 X 10 MM, 0.50 MM PITCH, PLASTIC, TQFP-64 | 10 X 10 MM, 0.50 MM PITCH, PLASTIC, TQFP-64 | 10 X 10 MM, 0.50 MM PITCH, PLASTIC, TQFP-64 | 10 X 10 MM, 0.50 MM PITCH, PLASTIC, TQFP-64 |
| 针数 | 64 | 64 | 64 | 64 | 64 | 64 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 具有ADC | YES | YES | YES | YES | YES | YES |
| 其他特性 | ALSO OPERATES WITH 5 V POWER SUPPLY | ALSO OPERATES WITH 5 V POWER SUPPLY | ALSO OPERATES WITH 5 V POWER SUPPLY | ALSO OPERATES WITH 5 V POWER SUPPLY | ALSO OPERATES WITH 5 V POWER SUPPLY | ALSO OPERATES WITH 5 V POWER SUPPLY |
| 位大小 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最大时钟频率 | 4.096 MHz | 4.096 MHz | 4.096 MHz | 4.096 MHz | 4.096 MHz | 4.096 MHz |
| DAC 通道 | NO | NO | NO | NO | NO | NO |
| DMA 通道 | NO | NO | NO | NO | NO | NO |
| JESD-30 代码 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 |
| JESD-609代码 | e6 | e6 | e6 | e6 | e6 | e6 |
| 长度 | 10 mm | 10 mm | 10 mm | 10 mm | 10 mm | 10 mm |
| I/O 线路数量 | 17 | 17 | 17 | 17 | 17 | 17 |
| 端子数量 | 64 | 64 | 64 | 64 | 64 | 64 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| PWM 通道 | NO | NO | NO | NO | NO | NO |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TFQFP | TFQFP | TFQFP | TFQFP | TFQFP | TFQFP |
| 封装等效代码 | TQFP64,.47SQ | TQFP64,.47SQ | TQFP64,.47SQ | TQFP64,.47SQ | TQFP64,.47SQ | TQFP64,.47SQ |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH |
| 电源 | 2.5/5 V | 2.5/5 V | 2.5/5 V | 2.5/5 V | 2.5/5 V | 2.5/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM(字节) | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 |
| ROM(单词) | 65536 | 131072 | 131072 | 65536 | 131072 | 131072 |
| ROM可编程性 | FLASH | MROM | MROM | FLASH | FLASH | FLASH |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
| 速度 | 4.2 MHz | 4.2 MHz | 4.2 MHz | 4.2 MHz | 4.2 MHz | 4.2 MHz |
| 最大压摆率 | 12 mA | 12 mA | 12 mA | 12 mA | 12 mA | 12 mA |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 2.2 V | 2.2 V | 2.2 V | 2.2 V | 2.2 V | 2.2 V |
| 标称供电电压 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Bismuth (Sn/Bi) | TIN BISMUTH | TIN BISMUTH | Tin/Bismuth (Sn/Bi) | TIN BISMUTH | TIN BISMUTH |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 宽度 | 10 mm | 10 mm | 10 mm | 10 mm | 10 mm | 10 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
| 厂商名称 | LAPIS Semiconductor Co Ltd | - | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd |