型号
- 型号
- 关键词
Analog Circuit, 1 Func, CMOS, PDSO10, 3 X 3 MM, ROHS COMPLIANT, PLASTIC, MO-220, DFN-10
厂商名称：Melexis(迈来芯)
厂商官网：https://www.melexis.com/zh
器件标准：
| 型号 | MLX75305SXEB | MLX75305SXDA | MLX75305KXDA | MLX75305KXDB | MLX75305KXEA | MLX75305SXEA | MLX75305KXEB | MLX75305SXDB |
|---|---|---|---|---|---|---|---|---|
| 描述 | Analog Circuit, 1 Func, CMOS, PDSO10, 3 X 3 MM, ROHS COMPLIANT, PLASTIC, MO-220, DFN-10 | Analog Circuit, 1 Func, CMOS, PDSO8, ROHS COMPLIANT, PLASTIC, SOP-8 | Analog Circuit, 1 Func, CMOS, PDSO8, ROHS COMPLIANT, PLASTIC, SOP-8 | Analog Circuit, 1 Func, CMOS, PDSO8, ROHS COMPLIANT, PLASTIC, SOP-8 | Analog Circuit, 1 Func, CMOS, PDSO10, 3 X 3 MM, ROHS COMPLIANT, PLASTIC, MO-220, DFN-10 | Analog Circuit, 1 Func, CMOS, PDSO10, 3 X 3 MM, ROHS COMPLIANT, PLASTIC, MO-220, DFN-10 | Analog Circuit, 1 Func, CMOS, PDSO10, 3 X 3 MM, ROHS COMPLIANT, PLASTIC, MO-220, DFN-10 | Analog Circuit, 1 Func, CMOS, PDSO8, ROHS COMPLIANT, PLASTIC, SOP-8 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | QFN | SOIC | SOIC | SOIC | QFN | QFN | QFN | SOIC |
| 包装说明 | HVSON, | SOP, | SOP, | SOP, | HVSON, | HVSON, | HVSON, | SOP, |
| 针数 | 10 | 8 | 8 | 8 | 10 | 10 | 10 | 8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compli |
| 模拟集成电路 - 其他类型 | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT |
| JESD-30 代码 | S-PDSO-N10 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | S-PDSO-N10 | S-PDSO-N10 | S-PDSO-N10 | R-PDSO-G8 |
| 长度 | 3 mm | 4.93 mm | 4.93 mm | 4.93 mm | 3 mm | 3 mm | 3 mm | 4.93 mm |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 10 | 8 | 8 | 8 | 10 | 10 | 10 | 8 |
| 最高工作温度 | 85 °C | 85 °C | 125 °C | 125 °C | 125 °C | 85 °C | 125 °C | 85 °C |
| 最低工作温度 | -20 °C | -20 °C | -40 °C | -40 °C | -40 °C | -20 °C | -40 °C | -20 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVSON | SOP | SOP | SOP | HVSON | HVSON | HVSON | SOP |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.675 mm | 1.75 mm | 1.75 mm | 1.75 mm | 0.675 mm | 0.675 mm | 0.675 mm | 1.75 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | OTHER | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | OTHER | AUTOMOTIVE | OTHER |
| 端子形式 | NO LEAD | GULL WING | GULL WING | GULL WING | NO LEAD | NO LEAD | NO LEAD | GULL WING |
| 端子节距 | 0.5 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.5 mm | 0.5 mm | 0.5 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 3 mm | 3.94 mm | 3.94 mm | 3.94 mm | 3 mm | 3 mm | 3 mm | 3.94 mm |
| 厂商名称 | Melexis(迈来芯) | - | Melexis(迈来芯) | Melexis(迈来芯) | Melexis(迈来芯) | Melexis(迈来芯) | Melexis(迈来芯) | Melexis(迈来芯) |