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MLX90615SSG-DAG-000-TU

Board Mount Temperature Sensors Integrated Infrared Thermometer 3V, single sensor, medical accuracy, 80 field of view

器件类别:传感器    传感器/换能器   

厂商名称:Melexis(迈来芯)

厂商官网:https://www.melexis.com/zh

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
包装说明
CAN4,.1
Reach Compliance Code
compliant
主体高度
2.7 mm
主体长度或直径
5.4 mm
安装特点
THROUGH HOLE MOUNT
端子数量
4
最高工作温度
85 °C
最低工作温度
-20 °C
输出
OPEN-DRAIN
输出类型
DIGITAL VOLTAGE
封装主体材料
METAL
封装等效代码
CAN4,.1
封装形状/形式
ROUND
筛选级别
TS 16949
传感器/换能器类型
SENSOR MODULE
最大供电电压
3.4 V
最小供电电压
2.6 V
表面贴装
NO
Base Number Matches
1
文档预览
MLX90615
Infra Red Thermometer
Features and Benefits
Small size, low cost
Easy to integrate
Factory calibrated in wide temperature range:
-40…85˚C for sensor temperature and
-40…115˚C for object temperature
High accuracy of 0.5° over wide temperature
C
range (0...+50° for both T
A
and T
O
)
C
High (medical) accuracy calibration
Measurement resolution of 0.02°
C
SMBus compatible digital interface
Power saving mode
Customizable PWM output for continuous
reading
Embedded emissivity compensation
3V supply voltage
Applications Examples
High precision non-contact temperature
measurements
Hand-held thermometers
Ear thermometers
Home appliances with temperature control
Healthcare
Livestock monitoring
Multiple zone temperature control – up to 127
sensors can be read via common 2 wires
Ordering Information
Part No.
MLX90615
Temperature
Code
S (-20°
C...85°
C)
Package
Code
SG (TO-46)
- Option Code
-X X X
(1) (2) (3)
Standard Packing
part
form
-000
-TU
(3) Package options:
A – 100° FOV
G – 80° FOV
(1) Accuracy
D – medical accuracy
Example:
MLX90615SSG-DAA-000-TU
(2) Specifics:
A – straight pins for thru hole
mounting
1 Functional diagram
2 General description
The MLX90615 is an Infra Red thermometer for non
contact temperature measurements. Both the IR sensitive
thermopile detector chip and the signal conditioning chip are
integrated in the same TO-46 can package.
Thanks to its low noise amplifier, 16-bit ADC and
powerful DSP unit, a high accuracy and resolution of the
thermometer is achieved.
The thermometer is factory calibrated with the digital
SMBus compatible interface enabled. Readout resolution is
0.02°
C.
J1
SCL
SDA
Vdd
GND
MLX90615
U1
SDA
4
Vss
SCL
1
3
Vdd
2
C1
0.1uF
CON1
C1 value and type may differ
in different applications
for optimum EMC
Figure 1 Typical application schematics –
MLX90615 connection to SMBus
3901090615
Rev 005
Page 1 of 32
Data Sheet
08 November 2013
MLX90615
Infra Red Thermometer
General description (continued)
The MLX90615 is built from 2 chips, the Infra Red thermopile detector and the signal conditioning
chip MLX90325, specially designed by Melexis to process the output of IR sensor.
The device is available in an industry standard TO-46 package.
Thanks to the low noise amplifier, high resolution 16-bit ADC and powerful DSP unit of the
MLX90325, Melexis is able to deliver a high accuracy and high resolution infrared thermometer. The
calculated object and ambient temperatures are available in the RAM memory of the MLX90325 with a
resolution of 0.02˚C. The values are accessible by 2 wire serial SMBus compatible protocol with a resolution
of 0.02° or via a 10-bit PWM (Pulse Width Modulated) signal from the device.
C
The MLX90615 is factory calibrated in standard temperature ranges from: -40...85˚C for the ambient
temperature and from -40...115˚C for the object temperature.
As a standard, the MLX90615 is delivered with a programmed object emissivity of 1. It can be easily
customized by the customer for any other emissivity in the range 0.1...1.0 without the need of recalibration
with a black body.
The MLX90615 can be battery powered.
An optical filter (5.5µm …14µm long-wave pass) that cuts off the visible and near infra-red radiant
flux is integrated in the package to make the sensor insensitive to visible light.
3901090615
Rev 005
Page 2 of 32
Data Sheet
08 November 2013
MLX90615
Infra Red Thermometer
3 Table of Contents
1 Functional diagram ................................................................................................................................................................................ 1
2 General description................................................................................................................................................................................ 1
3 Table of Contents .................................................................................................................................................................................. 3
4 Glossary of Terms ................................................................................................................................................................................. 4
5 Maximum ratings ................................................................................................................................................................................... 4
6 Pin definitions and descriptions.............................................................................................................................................................. 5
7 Electrical Specification ........................................................................................................................................................................... 6
8 Detailed description ............................................................................................................................................................................... 8
8.1 Block diagram ................................................................................................................................................................................ 8
8.2 Signal processing principle ............................................................................................................................................................. 8
8.3 Block description ............................................................................................................................................................................ 8
8.3.1 Amplifier.................................................................................................................................................................................. 8
8.3.2 Power-On-Reset (POR) .......................................................................................................................................................... 9
8.3.3 EEPROM ................................................................................................................................................................................ 9
8.3.4 RAM...................................................................................................................................................................................... 10
8.4 SMBus compatible 2-wire protocol ............................................................................................................................................... 11
8.4.1 Functional description ........................................................................................................................................................... 11
8.4.2 Differences with the standard SMBus specification (reference [1]) ........................................................................................ 11
8.4.3 Detailed description............................................................................................................................................................... 11
8.4.4 Bit transfer ............................................................................................................................................................................ 13
8.4.5 Commands ........................................................................................................................................................................... 13
8.4.6 SMBus Communication examples ......................................................................................................................................... 14
8.4.7 Timing specification............................................................................................................................................................... 14
8.4.8 Sleep Mode........................................................................................................................................................................... 15
8.5 Switching between PWM and SMBus ........................................................................................................................................... 16
8.5.1 PWM to SMBus mode ........................................................................................................................................................... 16
8.5.2 SMBus to PWM mode ........................................................................................................................................................... 16
8.6 PWM ............................................................................................................................................................................................ 16
8.6.1 PWM format .......................................................................................................................................................................... 17
8.6.2 Customizing the temperature range for PWM output ............................................................................................................. 17
8.7 Principle of operation .................................................................................................................................................................... 19
8.7.1 Ambient temperature T
A
........................................................................................................................................................ 19
8.7.2 Object temperature T
O
.......................................................................................................................................................... 19
9 Performance Graphs ........................................................................................................................................................................... 20
9.1 Temperature accuracy of the MLX90615 ...................................................................................................................................... 20
9.2 Field Of View (FOV) ..................................................................................................................................................................... 21
10 Applications Information..................................................................................................................................................................... 23
10.1 Use of the MLX90615 thermometer in SMBus configuration ....................................................................................................... 23
10.2 Use of multiple MLX90615s in SMBus configuration ................................................................................................................... 23
10.3 PWM output ............................................................................................................................................................................... 24
11 Application Comments ....................................................................................................................................................................... 25
12 Standard information regarding manufacturability of Melexis products with different soldering processes .......................................... 26
13 ESD Precautions ............................................................................................................................................................................... 27
14 FAQ ................................................................................................................................................................................................... 27
15 Package Information .......................................................................................................................................................................... 29
16 Part marking ...................................................................................................................................................................................... 29
17 Table of figures .................................................................................................................................................................................. 30
18 References ........................................................................................................................................................................................ 31
19 Disclaimer.......................................................................................................................................................................................... 31
3901090615
Rev 005
Page 3 of 32
Data Sheet
08 November 2013
MLX90615
Infra Red Thermometer
4 Glossary of Terms
PTAT
POR
HFO
DSP
FIR
IIR
IR
DC
LPF
FOV
SDA, SCL
T
A
T
O
ESD
EMC
TBD
Proportional To Absolute Temperature
sensor (package temperature)
Power On Reset
High Frequency Oscillator
(RC)
Digital Signal Processing
Finite Impulse Response.
Digital filter
Infinite Impulse Response.
Digital filter
Infra-Red
Direct Current
(for settled conditions specifications)
Low Pass Filter
Field Of View
Serial DAta, Serial CLock
– SMBus compatible communication pins
Ambient Temperature
measured from the chip – (the package temperature)
Object Temperature,
‘seen’ from IR sensor
Electro-Static Discharge
Electro-Magnetic Compatibility
To Be Defined
Table 1: Glossary of Terms
5 Maximum ratings
Parameter
MLX90615
Supply Voltage, V
DD
(over voltage)
5V
Supply Voltage, V
DD
(operating)
3.6V
Reverse Voltage
0.5 V
Operating Temperature Range, T
A
-20…+85°C
Storage Temperature Range, T
S
-20…+125°
C
ESD Sensitivity (AEC Q100 002)
2kV
DC sink current, SDA pin
25 mA
DC clamp current, SDA pin
10 mA
DC clamp current, SCL pin
10 mA
Table 2: Absolute maximum ratings for MLX90615
Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute
maximum rated conditions for extended periods may affect device reliability.
3901090615
Rev 005
Page 4 of 32
Data Sheet
08 November 2013
MLX90615
Infra Red Thermometer
6 Pin definitions and descriptions
4 VSS
3 SCL
1 SDA / PWM
2 VDD
Bottom view
Figure 2: Pin description MLX90615
Pin Name
SDA / PWM
VDD
SCL
VSS
Function
Digital input / output open drain NMOS. In SMBus mode (factory default) Serial Data
I/O. In PWM mode – PWM output. Weak pull-up (300kΩ typ) is present on this pin.
External supply voltage.
Serial clock input for 2 wire communications protocol. Weak pull-up (300kΩ typ) is
present on this pin.
Ground. The metal can is also connected to this pin.
Table 3: Pin description MLX90615
Notes:
For EMC and isothermal conditions reasons, it is highly recommended not to use any electrical connection to
the metal can except by the Vss pin.
Both SCL and SDA pin have input Schmidt trigger when the thermometer is operated in the 2-wire
SMBus interface mode.
3901090615
Rev 005
Page 5 of 32
Data Sheet
08 November 2013
查看更多>
参数对比
与MLX90615SSG-DAG-000-TU相近的元器件有:MLX90615SSG-DAA-000-SP。描述及对比如下:
型号 MLX90615SSG-DAG-000-TU MLX90615SSG-DAA-000-SP
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