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MLX90641KSF-BCB-000-SP

板上安装温度传感器 16X12 thermal array sensor, 3Volt, 60deg total FOV, 125C

器件类别：传感器    温度传感器    板上安装温度传感器   

厂商名称：Melexis(迈来芯)

厂商官网：https://www.melexis.com/zh

器件标准：

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器件参数
参数名称
属性值
厂商名称
Melexis(迈来芯)
产品种类
板上安装温度传感器
电源电压-最小
3 V
电源电压-最大
3.6 V
接口类型
I2C
最小工作温度
- 40 C
最大工作温度
+ 125 C
关闭
No Shutdown
安装风格
Through Hole
封装 / 箱体
TO-39-4
产品
Temperature Sensors
封装
Bulk
工作电源电流
12 mA
工厂包装数量
20
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MLX90641 16x12 IR array
Datasheet
1. Features and Benefits
Small size, low cost 16x12 pixels IR array
Easy to integrate
Industry standard four lead TO39 package
Factory calibrated
Noise Equivalent Temperature Difference
(NETD) 0.1K @4Hz refresh rate
I
2
C compatible digital interface
Programmable refresh rate 0.5Hz…64Hz
3.3V supply voltage
Current consumption ≈ 12mA
2 FOV options – 55°x35° and 110°x75°
Operating temperature -40°C ÷ 125°C
Target temperature -40°C ÷ 300°C
Complies with RoHS regulations
2. Application Examples
High precision non-contact temperature
measurements
Microwave ovens
Intrusion / Movement detection
Temperature sensing element for
residential, commercial and industrial
building air conditioning
Thermal Comfort sensor in automotive Air
Conditioning control system
Passenger classification
Industrial temperature control of moving
parts
Visual IR thermometers
Driver SW for MCU available at:
https://github.com/melexis/mlx90641-
library.git
3. Description
The MLX90641 is a fully calibrated 16x12 pixels
thermal IR array in an industry standard 4-lead
TO39 package with digital interface.
The MLX90641 contains 192 FIR pixels. An
ambient sensor is integrated to measure the
ambient temperature of the chip and supply
sensor to measure the VDD. The outputs of all
sensors IR, Ta and VDD are stored in internal RAM
and are accessible through I
2
C.
Band gap
reference and
PTAT sensor
Vdd
Regulator for
digital part
34 MHz RC
oscillator
Vss
Array
M pixels
M amplifiers
M ADC
SDA
EEPROM
Storage RAM
I2C
SCL
Figure 1 Block diagram
MLX90641 16x12 IR array
Datasheet
Contents
1. Features and Benefits ............................................................................................................................ 1
2. Application Examples............................................................................................................................. 1
3. Description ............................................................................................................................................ 1
4. Ordering Information ............................................................................................................................ 5
5. Glossary of Terms .................................................................................................................................. 6
6. Pin Definitions and Descriptions ............................................................................................................ 7
7. Absolute Maximum Ratings ................................................................................................................... 7
8. General Electrical Specifications ............................................................................................................ 8
9. False pixel correction ............................................................................................................................. 9
10. Detailed General Description............................................................................................................... 9
10.1. Pixel position ..................................................................................................................................... 9
10.2. Communication protocol ............................................................................................................... 10
10.2.1. Low level ................................................................................................................................... 10
10.3. Measurement mode ....................................................................................................................... 11
10.4. Refresh rate..................................................................................................................................... 11
10.5. Measurement flow ......................................................................................................................... 12
10.6. Address map ................................................................................................................................... 14
10.6.1. Internal registers....................................................................................................................... 14
10.6.2. RAM ........................................................................................................................................... 16
EEPROM ................................................................................................................................................. 17
11. Calculating Object Temperature ........................................................................................................ 20
11.1. Restoring calibration data from EERPOM and calculations.......................................................... 20
11.1.1. Restoring the VDD sensor parameters and VDD calculations ................................................ 20
11.1.2. Restoring the Ta sensor parameters ....................................................................................... 21
11.1.3. Restoring the offset .................................................................................................................. 21
11.1.4. Restoring the Sensitivity
.................................................................................................. 22
11.1.5. Restoring the Kta(i,j) coefficient .............................................................................................. 23
11.1.6. Restoring the Kv(i,j) coefficient ................................................................................................ 23
11.1.7. Restoring the GAIN coefficient (common for all pixel) ........................................................... 24
11.1.8. Restoring the KsTa coefficient (common for all pixel) ............................................................ 24
11.1.9. Restoring corner temperatures (common for all pixel) .......................................................... 24
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MLX90641 16x12 IR array
Datasheet
11.1.10. Restoring the KsTo coefficient
(common for all pixel) .................................... 24
11.1.11. Restoring sensitivity correction coefficients for each temperature range ......................... 25
11.1.12. Restoring Emissivity ................................................................................................................ 25
11.1.13. Restoring the Sensitivity
............................................................................................... 26
11.1.14. Restoring the offset of the CP ................................................................................................ 26
11.1.15. Restoring the Kv CP coefficient .............................................................................................. 26
11.1.16. Restoring the Kta CP coefficient ............................................................................................ 26
11.1.17. Restoring the TGC coefficient ................................................................................................ 26
11.1.18. Restoring calibration resolution control settings ................................................................. 27
11.2. Temperature calculation ................................................................................................................ 27
11.2.1. Example input data ................................................................................................................... 27
11.2.2. Temperature calculation .......................................................................................................... 30
12. Performance graphs .......................................................................................................................... 41
12.1. Accuracy .......................................................................................................................................... 41
12.2. Startup time .................................................................................................................................... 43
12.2.1. First valid data........................................................................................................................... 43
12.2.2. Thermal behavior...................................................................................................................... 43
12.3. Noise performance and resolution ................................................................................................ 44
12.4. Field of view (FOV) .......................................................................................................................... 45
13. Application information ..................................................................................................................... 46
13.1. Electrical considerations ................................................................................................................ 46
13.2. Using the device in “image mode” ................................................................................................ 47
14. Application Comments ...................................................................................................................... 47
15. Mechanical drawings ......................................................................................................................... 49
15.1. FOV 55°............................................................................................................................................ 49
15.2. FOV 110° ......................................................................................................................................... 50
15.3. Device marking ............................................................................................................................... 51
16. Standard Information ........................................................................................................................ 52
17. ESD Precautions................................................................................................................................. 52
18. Revision History Table ....................................................................................................................... 52
19. Contact .............................................................................................................................................. 53
20. Disclaimer .......................................................................................................................................... 53
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MLX90641 16x12 IR array
Datasheet
Tables
Table 1 Ordering information .......................................................................................................................................................... 5
Table 2 Glosarry of terms ................................................................................................................................................................ 6
Table 3 Pin definition ...................................................................................................................................................................... 7
Table 4 Absolute maximum ratings ................................................................................................................................................. 7
Table 5 Electrical specification ........................................................................................................................................................ 8
Table 6 Priorities of subpage controls ............................................................................................................................................15
Table 7 Configuration parameters memory ....................................................................................................................................17
Table 8 EEPROM overview (words) .................................................................................................................................................18
Table 9 Calibration parameters memory (EEPROM - bits) ...............................................................................................................19
Table 10 Calculation example input data ........................................................................................................................................27
Table 11 Calculation example calibration data ................................................................................................................................29
Table 12 Noise performance ..........................................................................................................................................................45
Table 13 Available FOV options ......................................................................................................................................................46
Table 14 Revision history ...............................................................................................................................................................52
Figures
Figure 1 Block diagram ................................................................................................................................................................... 1
Figure 2 MLX90641 Overview and pin description ........................................................................................................................... 7
Figure 3 Pixel in the whole FOV ....................................................................................................................................................... 9
2
Figure 4 I C write command format (default SA=0x33 is used) ........................................................................................................10
2
Figure 5 I C read command format (default SA=0x33 is used) .........................................................................................................10
Figure 6 Refresh rate timing ...........................................................................................................................................................11
Figure 7 Recommended measurement flow ...................................................................................................................................12
Figure 8 TV mode reading pattern ..................................................................................................................................................13
Figure 9 MXL90641 memory map ...................................................................................................................................................14
Figure 10 Status register (0x8000) bits meaning .............................................................................................................................14
Figure 11 Control register 1 (0x800D) bits meaning ........................................................................................................................15
2
Figure 12 I C configuration register (0x800F) bits meaning .............................................................................................................16
Figure 13 RAM memory map (Interleaved mode - default) ..............................................................................................................16
Figure 14 EEPROM to registers mapping .........................................................................................................................................17
Figure 15 EEPROM Hamming and data bit meaning ........................................................................................................................20
Figure 16 To calculation flow .........................................................................................................................................................30
Figure 17 Temperature absolute accuracy - MLX90641BCA .............................................................................................................41
Figure 18 Temperature absolute accuracy - MLX90641BCB .............................................................................................................42
Figure 19 Different accuracy zones depending on device type (BCA on the left and BCB on the right) ..............................................42
Figure 20 MLX90641BCx noise vs refresh rate for different device types .........................................................................................44
Figure 21 MLX90641BCA noise vs pixel and refresh rate at 1Hz and 2Hz .........................................................................................44
Figure 22 MLX90641BCA noise vs pixel and refresh rate at 4Hz, 8Hz and 16Hz ................................................................................44
Figure 23 MLX90641BCB noise vs pixel and refresh rate at 1Hz and 2Hz..........................................................................................45
Figure 24 MLX90641BCB noise vs pixel and refresh rate at 4Hz, 8Hz and 16Hz ................................................................................45
Figure 25 Field Of View measurement ............................................................................................................................................45
Figure 26 MLX90641Bxx electrical connections...............................................................................................................................46
Figure 27 Calculation flow in thermal image mode .........................................................................................................................47
Figure 28 Mechanical drawing of 55° FOV device ............................................................................................................................49
Figure 29 Mechanical drawing of 110° FOV device ..........................................................................................................................50
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MLX90641 16x12 IR array
Datasheet
4. Ordering Information
Product
Temperature
Package
Option Code
Custom
Configuration
Packing
Form
Definition
MLX90641
MLX90641
MLX90641
MLX90641
E
E
K
K
SF
SF
SF
SF
BCA
BCB
BCA
BCB
000
000
000
000
TU
TU
TU
TU
16x12 IR array
16x12 IR array
16x12 IR array
16x12 IR array
Legend:
Temperature Code:
E: -40°C to 85°C
K: -40°C to 125°C
Package Code:
Option Code:
“SF” for TO39 package
xAx – TGC is disabled and may not be enabled
xCx – TGC is enabled
Option Code:
xxA – FOV = 110°x75°
xxB – FOV = 55°x35°
Custom configuration
Packing Form:
Ordering Example:
000 – standard product
“TU” - Tubes
“MLX90641KSF-BCA-000-TU”
Table 1 Ordering information
REVISION 1 – NOVEMBER 16, 2018
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参数对比
与MLX90641KSF-BCB-000-SP相近的元器件有：MLX90641ESF-BCB-000-SP、MLX90641ESF-BCA-000-SP、MLX90641ESF-BCB-000-TU、MLX90641ESF-BCA-000-TU、MLX90641KSF-BCB-000-TU、MLX90641KSF-BCA-000-TU、MLX90641KSF-BCA-000-SP。描述及对比如下：
型号 MLX90641KSF-BCB-000-SP MLX90641ESF-BCB-000-SP MLX90641ESF-BCA-000-SP MLX90641ESF-BCB-000-TU MLX90641ESF-BCA-000-TU MLX90641KSF-BCB-000-TU MLX90641KSF-BCA-000-TU MLX90641KSF-BCA-000-SP
描述 板上安装温度传感器 16X12 thermal array sensor, 3Volt, 60deg total FOV, 125C 板上安装温度传感器 16X12 thermal array sensor, 3Volt, 60deg total FOV 板上安装温度传感器 16X12 thermal array sensor, 3Volt, 120deg total FOV 板上安装温度传感器 16X12 thermal array sensor, 3Volt, 60deg total FOV 板上安装温度传感器 16X12 thermal array sensor, 3Volt, 120deg total FOV 板上安装温度传感器 16X12 thermal array sensor, 3Volt, 60deg total FOV, 125C 板上安装温度传感器 16X12 thermal array sensor, 3Volt, 120deg total FOV, 125C 板上安装温度传感器 16X12 thermal array sensor, 3Volt, 120deg total FOV, 125C
厂商名称 Melexis(迈来芯) Melexis(迈来芯) Melexis(迈来芯) Melexis(迈来芯) Melexis(迈来芯) Melexis(迈来芯) Melexis(迈来芯) Melexis(迈来芯)
产品种类 板上安装温度传感器 板上安装温度传感器 板上安装温度传感器 - 板上安装温度传感器 板上安装温度传感器 板上安装温度传感器 板上安装温度传感器
电源电压-最小 3 V 3 V 3 V - 3 V 3 V 3 V 3 V
电源电压-最大 3.6 V 3.6 V 3.6 V - 3.6 V 3.6 V 3.6 V 3.6 V
接口类型 I2C I2C I2C - I2C I2C I2C I2C
最小工作温度 - 40 C - 40 C - 40 C - - 40 C - 40 C - 40 C - 40 C
最大工作温度 + 125 C + 85 C + 85 C - + 85 C + 125 C + 125 C + 125 C
关闭 No Shutdown No Shutdown No Shutdown - No Shutdown No Shutdown No Shutdown No Shutdown
安装风格 Through Hole Through Hole Through Hole - Through Hole Through Hole Through Hole Through Hole
封装 / 箱体 TO-39-4 TO-39-4 TO-39-4 - TO-39-4 TO-39-4 TO-39-4 TO-39-4
产品 Temperature Sensors Temperature Sensors Temperature Sensors - Temperature Sensors Temperature Sensors Temperature Sensors Temperature Sensors
封装 Bulk Bulk Bulk - Tube Tube Tube Bulk
工作电源电流 12 mA 12 mA 12 mA - 12 mA 12 mA 12 mA 12 mA
工厂包装数量 20 20 20 - 1035 1035 1035 20
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器件捷径:
E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ
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