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MPX12GS

DIFFERENTIAL, PEIZORESISTIVE PRESSURE SENSOR, 0-1.45Psi, 20-75mV, ROUND, THROUGH HOLE MOUNT

器件类别:传感器    传感器/换能器   

厂商名称:Motorola ( NXP )

厂商官网:https://www.nxp.com

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器件参数
参数名称
属性值
厂商名称
Motorola ( NXP )
Reach Compliance Code
unknow
最大精度 (%)
5%
主体宽度
20.31 mm
主体长度或直径
17.9 mm
线性度 (%)
5 %
安装特点
THROUGH HOLE MOUNT
标称偏移
20MV
最大工作电流
6 mA
最高工作温度
125 °C
最低工作温度
-40 °C
输出范围
20-75mV
输出类型
ANALOG VOLTAGE
封装形状/形式
ROUND
端口类型
BARBED
最大压力范围
1.45 Psi
最小压力范围
压力传感模式
GAGE
响应时间
1000 µs
灵敏度(mV / V)
5.5 mV/V
传感器/换能器类型
PRESSURE SENSOR,PIEZORESISTIVE
最大供电电压
6 V
最小供电电压
3 V
表面贴装
NO
端接类型
SOLDER
文档预览
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MPX12/D
10 kPa
Uncompensated
Silicon Pressure Sensors
The MPX12 series device is a silicon piezoresistive pressure sensor providing a very
accurate and linear voltage output — directly proportional to the applied pressure. This
standard, low cost, uncompensated sensor permits manufacturers to design and add
their own external temperature compensating and signal conditioning networks.
Compensation techniques are simplified because of the predictability of Motorola’s single
element strain gauge design.
Features
Low Cost
Patented Silicon Shear Stress Strain Gauge Design
Ratiometric to Supply Voltage
Easy to Use Chip Carrier Package Options
Differential and Gauge Options
Application Examples
Air Movement Control
Environmental Control Systems
Level Indicators
Leak Detection
Medical Instrumentation
Industrial Controls
Pneumatic Control Systems
Robotics
Figure 1 shows a schematic of the internal circuitry on the stand–alone pressure
sensor chip.
PIN 3
+ VS
PIN 2
+ Vout
X–ducer
PIN 4
– Vout
PIN 1
1
2
MPX12
SERIES
0 to 10 kPa (0 – 1.45 psi)
35 mV FULL SCALE SPAN
(TYPICAL)
BASIC CHIP
CARRIER ELEMENT
CASE 344–15, STYLE 1
DIFFERENTIAL
PORT OPTION
CASE 344C–01, STYLE 1
NOTE: Pin 1 is the notched pin.
PIN NUMBER
Gnd
+Vout
3
4
VS
–Vout
Figure 1. Uncompensated Pressure Sensor Schematic
VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the X–ducer is directly proportional to the differential
pressure applied.
The output voltage of the differential or gauge sensor increases with increasing
pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly,
output voltage increases as increasing vacuum is applied to the vacuum side (P2)
relative to the pressure side (P1).
Senseon and X–ducer are trademarks of Motorola, Inc.
©
Motorola Sensor Device Data
Motorola, Inc. 1997
1
MPX12 SERIES
MAXIMUM RATINGS
Rating
Overpressure(8) (P1 > P2)
Burst Pressure(8) (P1 > P2)
Storage Temperature
Operating Temperature
Symbol
Pmax
Pburst
Tstg
TA
Value
75
100
– 40 to +125
– 40 to +125
Unit
kPa
kPa
°C
°C
OPERATING CHARACTERISTICS
(VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Differential Pressure Range(1)
Supply Voltage(2)
Supply Current
Full Scale Span(3)
Offset(4)
Sensitivity
Linearity(5)
Pressure Hysteresis(5) (0 to 10 kPa)
Temperature Hysteresis(5) (– 40°C to +125°C)
Temperature Coefficient of Full Scale Span(5)
Temperature Coefficient of Offset(5)
Temperature Coefficient of Resistance(5)
Input Impedance
Output Impedance
Response Time(6) (10% to 90%)
Warm–Up
Offset Stability(9)
Symbol
POP
VS
Io
VFSS
Voff
∆V/∆P
TCVFSS
TCVoff
TCR
Zin
Zout
tR
Min
0
45
0
–0.5
– 0.22
0.21
400
750
Typ
3.0
6.0
55
20
5.5
±
0.1
±
0.5
±15
1.0
20
±
0.5
Max
10
6.0
70
35
5.0
– 0.16
0.27
550
1250
Unit
kPa
Vdc
mAdc
mV
mV
mV/kPa
%VFSS
%VFSS
%VFSS
%VFSS/°C
µV/°C
%Zin/°C
ms
ms
%VFSS
MECHANICAL CHARACTERISTICS
Characteristic
Weight (Basic Element, Case 344–15)
Common Mode Line Pressure(7)
Symbol
Min
Typ
2.0
Max
690
Unit
Grams
kPa
NOTES:
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self–heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
Linearity:
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
TcSpan:
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative
to 25°C.
TCR:
Zin deviation with minimum rated pressure applied, over the temperature range of – 40°C to +125°C,
relative to 25°C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Common mode pressures beyond specified may result in leakage at the case–to–lead interface.
8. Exposure beyond these limits may cause permanent damage or degradation to the device.
9. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
2
Motorola Sensor Device Data
MPX12 SERIES
TEMPERATURE COMPENSATION
Figure 2 shows the typical output characteristics of the
MPX12 series over temperature.
The X–ducer piezoresistive pressure sensor element is a
semiconductor device which gives an electrical output signal
proportional to the pressure applied to the device. This de-
vice uses a unique transverse voltage diffused semiconduc-
tor strain gauge which is sensitive to stresses produced in a
thin silicon diaphragm by the applied pressure.
Because this strain gauge is an integral part of the silicon
diaphragm, there are no temperature effects due to differ-
ences in the thermal expansion of the strain gauge and the
diaphragm, as are often encountered in bonded strain gauge
pressure sensors. However, the properties of the strain
gauge itself are temperature dependent, requiring that the
device be temperature compensated if it is to be used over
an extensive temperature range.
Temperature compensation and offset calibration can be
achieved rather simply with additional resistive components,
or by designing your system using the MPX2010D series
sensor.
Several approaches to external temperature compensa-
tion over both – 40 to +125°C and 0 to + 80°C ranges are
presented in Motorola Applications Note AN840.
LINEARITY
Linearity refers to how well a transducer’s output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range (Figure 3). There are two basic methods for
calculating nonlinearity: (1) end point straight line fit or (2) a
least squares best line fit. While a least squares fit gives the
“best case” linearity error (lower numerical value), the cal-
culations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola’s
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange
pressure.
80
70
OUTPUT (mVdc)
60
50
40
30
20
10
0
PSI 0
kPa
0.3
2.0
0.6
0.9
1.2
OFFSET
(TYP)
1.5
10
VS = 3 Vdc
P1 > P2
+ 25°C
OUTPUT (mVdc)
+ 125°C
SPAN
RANGE
(TYP)
– 40°C
70
60
50
ACTUAL
40
30
20
10
0
0
PRESSURE (kPA)
THEORETICAL
OFFSET
(VOFF)
MAX
POP
SPAN
(VFSS)
LINEARITY
4.0
6.0
8.0
PRESSURE DIFFERENTIAL
Figure 2. Output versus Pressure Differential
Figure 3. Linearity Specification Comparison
SILICONE
DIE COAT
WIRE BOND
DIE
P1
STAINLESS STEEL
METAL COVER
EPOXY
CASE
LEAD FRAME
Figure 4. Cross–Sectional Diagram (not to scale)
Figure 4 illustrates the differential or gauge configuration
in the basic chip carrier (Case 344–15). A silicone gel iso-
lates the die surface and wire bonds from the environment,
while allowing the pressure signal to be transmitted to the sil-
icon diaphragm.
The MPX12 series pressure sensor operating characteris-
tics and internal reliability and qualification tests are based
on use of dry air as the pressure media. Media other than dry
air may have adverse effects on sensor performance and
long term reliability. Contact the factory for information re-
garding media compatibility in your application.
Motorola Sensor Device Data
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
P2
RTV DIE
BOND
3
MPX12 SERIES
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
isolates the die from the environment. The Motorola MPX
Part Number
MPX12D
MPX12DP
MPX12GP
MPX12GS
MPX12GSX
Case Type
344–15C
344C–01
344B–01
344E–01
344F–01
pressure sensor is designed to operate with positive differen-
tial pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the table
below:
Pressure (P1) Side Identifier
Stainless Steel Cap
Side with Part Marking
Side with Port Attached
Side with Port Attached
Side with Port Attached
ORDERING INFORMATION
MPX12 series pressure sensors are available in differential and gauge configurations. Devices are available in the basic
element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure
connections.
MPX Series
Device Type
D i T
Basic Element
Ported Elements
Options
O i
Differential
Differential
Gauge
Gauge Stove Pipe
Gauge Axial
Case Type
C
T
Case 344–15
Case 344C–01
Case 344B–01
Case 344E–01
Case 344F–01
Order Number
MPX12D
MPX12DP
MPX12GP
MPX12GS
MPX12GSX
Device Marking
MPX12D
MPX12DP
MPX12GP
MPX12D
MPX12D
4
Motorola Sensor Device Data
MPX12 SERIES
PACKAGE DIMENSIONS
C
R
M
B
–A–
N
PIN 1
1
2
3
4
NOTES:
POSITIVE
PRESSURE (P1)
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION –A– IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
DIM
A
B
C
D
F
G
J
L
M
N
R
INCHES
MIN
MAX
0.595
0.630
0.514
0.534
0.200
0.220
0.016
0.020
0.048
0.064
0.100 BSC
0.014
0.016
0.695
0.725
30
_
NOM
0.475
0.495
0.430
0.450
MILLIMETERS
MIN
MAX
15.11
16.00
13.06
13.56
5.08
5.59
0.41
0.51
1.22
1.63
2.54 BSC
0.36
0.40
17.65
18.42
30
_
NOM
12.07
12.57
10.92
11.43
L
–T–
J
SEATING
PLANE
POSITIVE
PRESSURE
(P1)
G
F
4 PL
D
0.136 (0.005)
M
T A
M
STYLE 1:
PIN 1.
2.
3.
4.
GROUND
+ OUTPUT
+ SUPPLY
– OUTPUT
CASE 344–15
ISSUE W
SEATING
PLANE
–T–
R
H
N
PORT #1
POSITIVE
PRESSURE
(P1)
–A–
U
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5, 1982.
2. CONTROLLING DIMENSION: INCH.
INCHES
MIN
MAX
1.145
1.175
0.685
0.715
0.305
0.325
0.016
0.020
0.048
0.064
0.100 BSC
0.182
0.194
0.014
0.016
0.695
0.725
0.290
0.300
0.420
0.440
0.153
0.159
0.153
0.159
0.230
0.250
0.220
0.240
0.910 BSC
MILLIMETERS
MIN
MAX
29.08
29.85
17.40
18.16
7.75
8.26
0.41
0.51
1.22
1.63
2.54 BSC
4.62
4.93
0.36
0.41
17.65
18.42
7.37
7.62
10.67
11.18
3.89
4.04
3.89
4.04
5.84
6.35
5.59
6.10
23.11 BSC
–Q–
B
1 2
3 4
PIN 1
K
S
F
G
D
4 PL
0.13 (0.005)
–P–
0.25 (0.010)
J
C
M
T Q
S
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
M
T S
S
Q
S
STYLE 1:
PIN 1.
2.
3.
4.
GROUND
+ OUTPUT
+ SUPPLY
– OUTPUT
CASE 344B–01
ISSUE B
Motorola Sensor Device Data
5
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参数对比
与MPX12GS相近的元器件有:MPX12D、MPX12DP、MPX12GP、MPX12GSX、MPX12。描述及对比如下:
型号 MPX12GS MPX12D MPX12DP MPX12GP MPX12GSX MPX12
描述 DIFFERENTIAL, PEIZORESISTIVE PRESSURE SENSOR, 0-1.45Psi, 20-75mV, ROUND, THROUGH HOLE MOUNT DIFFERENTIAL, PEIZORESISTIVE PRESSURE SENSOR, 0-1.45Psi, 20-75mV, ROUND, THROUGH HOLE MOUNT DIFFERENTIAL, PEIZORESISTIVE PRESSURE SENSOR, 0-1.45Psi, 5%, 20-75mV, THROUGH HOLE MOUNT GAGE, PEIZORESISTIVE PRESSURE SENSOR, 0-1.45Psi, 20-75mV, THROUGH HOLE MOUNT DIFFERENTIAL, PEIZORESISTIVE PRESSURE SENSOR, 0-1.45Psi, 20-75mV, ROUND, THROUGH HOLE MOUNT DIFFERENTIAL, PEIZORESISTIVE PRESSURE SENSOR, 0-1.45Psi, 20-75mV, ROUND, THROUGH HOLE MOUNT
厂商名称 Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) -
Reach Compliance Code unknow unknow unknow unknow unknow -
最大精度 (%) 5% 5% 5% 5% 5% -
主体宽度 20.31 mm 5.33 mm 10.67 mm 8 mm 16.25 mm -
主体长度或直径 17.9 mm 15.55 mm 29.46 mm 29.46 mm 27.94 mm -
线性度 (%) 5 % 5 % 5 % 5 % 5 % -
安装特点 THROUGH HOLE MOUNT THROUGH HOLE MOUNT THROUGH HOLE MOUNT THROUGH HOLE MOUNT THROUGH HOLE MOUNT -
标称偏移 20MV 20MV 20MV 20MV 20MV -
最大工作电流 6 mA 6 mA 6 mA 6 mA 6 mA -
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C -
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -
输出范围 20-75mV 20-75mV 20-75mV 20-75mV 20-75mV -
输出类型 ANALOG VOLTAGE ANALOG VOLTAGE ANALOG VOLTAGE ANALOG VOLTAGE ANALOG VOLTAGE -
端口类型 BARBED HOLE BARBED BARBED BARBED -
最大压力范围 1.45 Psi 1.45 Psi 1.45 Psi 1.45 Psi 1.45 Psi -
压力传感模式 GAGE DIFFERENTIAL DIFFERENTIAL GAGE GAGE -
响应时间 1000 µs 1000 µs 1000 µs 1000 µs 1000 µs -
灵敏度(mV / V) 5.5 mV/V 5.5 mV/V 5.5 mV/V 5.5 mV/V 5.5 mV/V -
传感器/换能器类型 PRESSURE SENSOR,PIEZORESISTIVE PRESSURE SENSOR,PIEZORESISTIVE PRESSURE SENSOR,PIEZORESISTIVE PRESSURE SENSOR,PIEZORESISTIVE PRESSURE SENSOR,PIEZORESISTIVE -
最大供电电压 6 V 6 V 6 V 6 V 6 V -
最小供电电压 3 V 3 V 3 V 3 V 3 V -
表面贴装 NO NO NO NO NO -
端接类型 SOLDER SOLDER SOLDER SOLDER SOLDER -
主体高度 - 13.31 mm 28.7 mm 28.7 mm 19.05 mm -
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