MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MPX2700/D
700 kPa
High Pressure, Temperature
Compensated & Calibrated
Silicon Pressure Sensors
The MPX2700 series device is a silicon piezoresistive pressure sensor providing a
highly accurate and linear voltage output — directly proportional to the applied pressure.
The sensor is a single monolithic silicon diaphragm with the strain gauge and a thin–film
resistor network integrated on–chip. The sensor is laser trimmed for precise span and
offset calibration and temperature compensation.
Features
•
Unique Silicon Shear Stress Strain Gauge
• ±
0.5% Linearity
•
Easy to Use Chip Carrier Package
•
Basic Element, Single and Dual Ported Devices Available
•
Available in Absolute, Differential and Gauge configurations
Application Examples
•
Pump/Motor Controllers
•
Pneumatic Control
•
Tire Pressure Gauges
•
Robotics
•
Medical Diagnostics
•
Pressure Switching
•
Hydraulics
Figure 1 shows a block diagram of the internal circuitry on the stand–alone pressure
sensor chip.
VS
3
THIN FILM
TEMPERATURE
COMPENSATION
AND
CALIBRATION
CIRCUITRY
MPX2700
SERIES
0 to 700 kPa (0 to 100 psi)
40 mV FULL SCALE SPAN
(TYPICAL)
BASIC CHIP
CARRIER ELEMENT
CASE 344–15, STYLE 1
DIFFERENTIAL
PORT OPTION
CASE 344C–01, STYLE 1
NOTE: Pin 1 is the notched pin.
X–ducer
SENSING
ELEMENT
2
4
Vout+
Vout–
PIN NUMBER
1
2
Gnd
+Vout
3
4
VS
–Vout
1
GND
Figure 1. Temperature Compensated Pressure Sensor Schematic
VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the X–ducer is directly proportional to the differential
pressure applied.
The output voltage of the differential or gauge sensor increases with increasing
pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly,
output voltage increases as increasing vacuum is applied to the vacuum side (P2)
relative to the pressure side (P1). This sensor is designed for applications where P1 is
always greater than, or equal to P2.
Senseon and X–ducer are trademarks of Motorola, Inc.
REV 2
Motorola Sensor Device Data
©
Motorola, Inc. 1997
1
MPX2700 SERIES
MAXIMUM RATINGS
v
1 Atmosphere)
Burst Pressure(8) (P2
v
1 Atmosphere)
Overpressure(8) (P2
Storage Temperature
Operating Temperature
Rating
Symbol
P1max
P1burst
Tstg
TA
Value
2800
5000
– 40 to +125
– 40 to +125
Unit
kPa
kPa
°C
°C
OPERATING CHARACTERISTICS
(VCC = 10 Vdc, TA = 25°C unless otherwise noted. P1
Characteristic
Pressure Range(1)
Supply Voltage(2)
Supply Current
Full Scale Span(3)
Offset(4)
Sensitivity
Linearity(5)
Pressure Hysteresis(5) (0 to 700 kPa)
Temperature Hysteresis(5) (– 40°C to +125°C)
Temperature Effect on Full Scale Span(5)
Temperature Effect on Offset(5)
Input Impedance
Output Impedance
Response Time(6) (10% to 90%)
Warm–Up(7)
Symbol
POP
VS
Io
VFSS
Voff
∆V/∆P
—
—
—
TCVFSS
TCVoff
Zin
Zout
tR
—
0
—
—
w
P2; P2
v
1 Atmosphere.)
Typ
—
10
6.0
40
—
0.057
—
±
0.1
±
0.5
—
—
—
—
1.0
20
Max
700
16
—
41.5
1.0
—
0.5
—
—
1.0
1.0
4000
3000
—
—
Unit
kPa
Vdc
mAdc
mV
mV
mV/kPa
%VFSS
%VFSS
%VFSS
%VFSS
mV
Ω
Ω
ms
ms
Min
38.5
–1.0
—
– 0.5
—
—
–1.0
–1.0
1300
1400
—
—
MECHANICAL CHARACTERISTICS
Characteristic
Weight (Basic Element Case 344–15)
Symbol
—
Min
—
Typ
2.0
Max
—
Unit
Grams
NOTES:
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self–heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
•
Linearity:
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
•
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
•
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
•
TcSpan:
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
•
TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative
to 25°C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Warm–up is defined as the time required for the device to meet the specified output voltage after the pressure has been stabilized.
8. Basic Element only, Case 344–15.
9. P2 max : 500 kPa.
2
Motorola Sensor Device Data
MPX2700 SERIES
LINEARITY
Linearity refers to how well a transducer’s output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit or (2) a least
squares best line fit (see Figure 3). While a least squares fit
gives the “best case” linearity error (lower numerical value),
the calculations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola’s
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange
pressure.
LEAST SQUARES FIT
RELATIVE VOLTAGE OUTPUT
EXAGGERATED
PERFORMANCE
CURVE
LEAST
SQUARE
DEVIATION
STRAIGHT LINE
DEVIATION
END POINT
STRAIGHT LINE FIT
OFFSET
0
50
PRESSURE (% FULLSCALE)
100
Figure 2. Linearity Specification Comparison
ON–CHIP TEMPERATURE COMPENSATION and CALIBRATION
Figure 3 shows the output characteristics of the MPX2700
series at 25°C. The output is directly proportional to the dif-
ferential pressure and is essentially a straight line.
The effects of temperature on Full–Scale Span and Offset
are very small and are shown under Operating Characteris-
tics.
50
40
OUTPUT (mV)
30
20
MIN
10
0
–5
LEAD
FRAME
OFFSET
VS = 10 V
TA = 25°C
P1 > P2
MAX
TYP
SILICONE
DIE COAT
SPAN
RANGE
(TYP)
WIRE BOND
DIE
P1
STAINLESS STEEL
METAL COVER
PSI
kPa
20
140
40
280
60
420
80
560
100
700
Figure 3. Output versus Pressure Differential
Figure 4. Cross–Section of Differential Pressure
Sensor Die in Its Basic Package (Not to Scale)
Figure 4 shows the cross section of the Motorola MPX
pressure sensor die in the chip carrier package. A silicone
gel isolates the die surface and wire bonds from the
environment, while allowing the pressure signal to be
transmitted to the silicon diaphragm. MPX2700 series
pressure sensor operating characteristics and internal reli-
ability and qualification tests are based on use of dry air as
the pressure media. Media other than dry air may have
adverse effects on sensor performance and long term
reliability. Contact the factory for information regarding media
compatibility in your application.
Motorola Sensor Device Data
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
P2
EPOXY CASE
RTV DIE
BOND
3
MPX2700 SERIES
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
isolates the die from the environment. The Motorola MPX
Part Number
MPX2700D
MPX2700DP
MPX2700GP
MPX2700GVP
MPX2700GS
MPX2700GVS
MPX2700GSX
MPX2700GVSX
MPX2700ASX
MPX2700AS
MPX2700AP
MPX2700A
pressure sensor is designed to operate with positive differen-
tial pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the table
below:
Case Type
344–15C
344C–01
344B–01
344D–01
344E–01
344A–01
344F–01
344G–01
Pressure (P1) Side Identifier
Stainless Steel Cap
Side with Part Marking
Side with Port Attached
Stainless Steel Cap
Side with Port Attached
Stainless Steel Cap
Side with Port Attached
Stainless Steel Cap
ORDERING INFORMATION
MPX2700 series pressure sensors are available in differential and gauge configurations. Devices are available in the basic
element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure
connections.
MPX Series
Device Type
D i T
Basic Element
Ported Elements
Options
O i
Differential
Differential
Gauge
Gauge Vacuum
Gauge Stove Pipe
Gauge Vacuum Stove Pipe
Gauge Axial
Gauge Vacuum Axial
Case Type
C
T
Case 344–15
Case 344C–01
Case 344B–01
Case 344D–01
Case 344E–01
Case 344A–01
Case 344F–01
Case 344G–01
Order Number
MPX2700D
MPX2700DP
MPX2700GP
MPX2700GVP
MPX2700GS
MPX2700GVS
MPX2700GSX
MPX2700GVSX
Device Marking
MPX2700D
MPX2700DP
MPX2700GP
MPX2700GVP
MPX2700D
MPX2700D
MPX2700D
MPX2700D
4
Motorola Sensor Device Data
MPX2700 SERIES
PACKAGE DIMENSIONS
NOTES:
C
R
M
B
–A–
N
PIN 1
1
2
3
4
POSITIVE
PRESSURE (P1)
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION –A– IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
INCHES
MIN
MAX
0.595
0.630
0.514
0.534
0.200
0.220
0.016
0.020
0.048
0.064
0.100 BSC
0.014
0.016
0.695
0.725
30
_
NOM
0.475
0.495
0.430
0.450
MILLIMETERS
MIN
MAX
15.11
16.00
13.06
13.56
5.08
5.59
0.41
0.51
1.22
1.63
2.54 BSC
0.36
0.40
17.65
18.42
30
_
NOM
12.07
12.57
10.92
11.43
L
–T–
J
SEATING
PLANE
POSITIVE
PRESSURE
(P1)
G
F
4 PL
D
0.136 (0.005)
M
T A
M
DIM
A
B
C
D
F
G
J
L
M
N
R
STYLE 1:
PIN 1.
2.
3.
4.
GROUND
+ OUTPUT
+ SUPPLY
– OUTPUT
CASE 344–15
ISSUE W
PORT #2
VACUUM
PRESSURE
(P2)
C
POSITIVE
PRESSURE
(P1)
PIN 1
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
F
G
J
K
N
R
S
V
INCHES
MIN
MAX
0.690
0.720
0.245
0.255
0.780
0.820
0.016
0.020
0.048
0.064
0.100 BSC
0.014
0.016
0.345
0.375
0.300
0.310
0.178
0.186
0.220
0.240
0.182
0.194
GROUND
+ OUTPUT
+ SUPPLY
– OUTPUT
MILLIMETERS
MIN
MAX
17.53
18.28
6.22
6.48
19.81
20.82
0.41
0.51
1.22
1.63
2.54 BSC
0.36
0.41
8.76
9.53
7.62
7.87
4.52
4.72
5.59
6.10
4.62
4.93
–B–
V
1 2
3 4
K
J
R
SEATING
PLANE
S
G
F
D
4 PL
0.13 (0.005)
M
N
–T–
T B
M
STYLE 1:
PIN 1.
2.
3.
4.
CASE 344A–01
ISSUE B
Motorola Sensor Device Data
5
模拟与混合信号
