器件参数

参数名称

属性值

是否Rohs认证

不符合

厂商名称

LAPIS Semiconductor Co Ltd

零件包装代码

TSOP2

包装说明

TSOP2, TSOP48,.6,32

针数

Reach Compliance Code

unknow

ECCN代码

EAR99

最长访问时间

90 ns

备用内存宽度

JESD-30 代码

R-PDSO-G48

JESD-609代码

长度

19.68 mm

内存密度

16777216 bi

内存集成电路类型

MASK ROM

内存宽度

功能数量

端子数量

字数

1048576 words

字数代码

1000000

工作模式

ASYNCHRONOUS

最高工作温度

70 °C

最低工作温度

组织

1MX16

封装主体材料

PLASTIC/EPOXY

封装代码

TSOP2

封装等效代码

TSOP48,.6,32

封装形状

RECTANGULAR

封装形式

SMALL OUTLINE, THIN PROFILE

并行/串行

PARALLEL

峰值回流温度（摄氏度）

NOT SPECIFIED

电源

3/3.3 V

认证状态

Not Qualified

座面最大高度

1.2 mm

最大待机电流

0.00005 A

最大压摆率

0.04 mA

最大供电电压 (Vsup)

3.6 V

最小供电电压 (Vsup)

2.7 V

标称供电电压 (Vsup)

3 V

表面贴装

YES

技术

CMOS

温度等级

COMMERCIAL

端子面层

Tin/Lead (Sn/Pb)

端子形式

GULL WING

端子节距

0.8 mm

端子位置

DUAL

处于峰值回流温度下的最长时间

NOT SPECIFIED

宽度

13.97 mm

文档预览

Dear customers,

About the change in the name such as "Oki Electric Industry Co. Ltd." and

"OKI" in documents to OKI Semiconductor Co., Ltd.

The semiconductor business of Oki Electric Industry Co., Ltd. was succeeded to OKI

Semiconductor Co., Ltd. on October 1, 2008.

Therefore, please accept that although

the terms and marks of "Oki Electric Industry Co., Ltd.", “Oki Electric”, and "OKI"

remain in the documents, they all have been changed to "OKI Semiconductor Co., Ltd.".

It is a change of the company name, the company trademark, and the logo, etc. , and

NOT a content change in documents.

October 1, 2008

OKI Semiconductor Co., Ltd.

550-1 Higashiasakawa-cho, Hachioji-shi, Tokyo 193-8550, Japan

http://www.okisemi.com/en/

Semiconductor

MR27V1602D

1,048,576-Word x 16-Bit or 2,097,152-Word x 8-Bit

Production Programmed Read Only Memory (P2ROM)

DESCRIPTION

The MR27V1602D is a 16Mbit Production Programmed Read-Only Memory (P2ROM) whose

configuration can be electrically switched between 1,048,576 word x 16bit and 2,097,152 word x 8

bit. The MR27V1602D operates on a single +3V-3.3V power supply and is TTL compatible. Since

the MR27V1602D operates asynchronously , external clocks are not required , making this device

easy-to-use. The MR27V1602D is suitable as large-capacity fixed memory for microcomputers and

data terminals. It is manufactured using a CMOS double silicon gate technology and is offered in 42-

pin DIP, 44-pin SOP, 44-pin TSOP or 48-pin TSOP packages.

FEATURES

• 1,048,576 word x 16bit / 2,097,152 word x 8bit electrically switchable configuration

• Single +3V-3.3V power supply

• Access time

90ns access time (Vcc=+3V)

80ns access time (Vcc=+3.3V)

• Input / Output TTL compatible

• Three-state output

• Packages

42-pin plastic DIP (DIP42-P-600-2.54)

(Product name : MR27V1602D-xxRA)

44-pin plastic SOP (SOP44-P-600-1.27-K)

(Product name : MR27V1602D-xxMA)

44-pin plastic TSOP (TSOP II 44-P-400-0.80-K) (Product name : MR27V1602D-xxTP)

48-pin plastic TSOP (TSOP II 48-P-550-0.80-K) (Product name : MR27V1602D-xxTA)

November 1999

1/8

MR27V1602D

PIN CONFIGURATION (TOP VIEW)

NC 1

NC 2

A18 1

A17 2

A7 3

A6 4

A5 5

A4 6

A3 7

A2 8

A1 9

A0 10

CE 11

OE 13

D0 14

D8 15

D1 16

D9 17

D2 18

D10 19

D3 20

D11 21

42 A19

41 A8

40 A9

39 A10

38 A11

37 A12

36 A13

35 A14

34 A15

33 A16

32 BYTE

31 V

30 D15/A-1

29 D7

28 D14

27 D6

26 D13

25 D5

24 D12

23 D4

22 V

42-pin DIP

NC 1

A18 2

A17 3

A7 4

A6 5

A5 6

A4 7

A3 8

A2 9

A1 10

A0 11

CE 12

OE 14

D0 15

D8 16

D1 17

D9 18

D2 19

D10 20

D3 21

D11 22

44 NC

43 A19

42 A8

41 A9

40 A10

39 A11

38 A12

37 A13

36 A14

35 A15

34 A16

33 BYTE

32 V

31 D15/A-1

30 D7

29 D14

28 D6

27 D13

26 D5

25 D12

24 D4

23 V

NC 3

A18 4

A17 5

A7 6

A6 7

A5 8

A4 9

A3 10

A2 11

A1 12

A0 13

CE 14

OE 16

D0 17

D8 18

D1 19

D9 20

D2 21

D10 22

D3 23

D11 24

48 NC

47 NC

46 NC

45 A19

44 A8

43 A9

42 A10

41 A11

40 A12

39 A13

38 A14

37 A15

36 A16

35 BYTE

34 V

33 D15/A-1

32 D7

31 D14

30 D6

29 D13

28 D5

27 D12

26 D4

25 V

44-pin SOP,TSOP (II)

48-pin TSOP (II)

PIN NAMES

D15/A-1

A0-A19

D0-D14

BYTE

Address input

Data output

Chip enable

Output enable

FUNCTIONS

Data output / Address input

Power supply voltage

GND

Mode switch

Non connection

2/8

MR27V1602D

BLOCK DIAGRAM

A-1

X8/X16 Switch

BYTE

A10

A11

A12

A13

A14

A15

A16

A17

A18

A19

Row Decoder

Memory Matrix

Address Buffer

1,048,576X16-Bit or 2,097,152X8-Bit

Column Decoder

Multiplexer

Output Buffer

D10

D12

D14

D15

D11

D13

In 8-bit output mode, these pins are

three-stated and pin D15 functions

as the A-1 address pin.

FUNCTION TABLE

MODE

READ (16-Bit)

READ (8-Bit)

OUTPUT DISABLE

STAND-BY

*: Don't Care

BYTE

3.0V

3.3V

OUT

D0 - D7

D8 - D14

OUT

Hi-Z

D15/A-1

L/H

3/8

MR27V1602D

ABSOLUTE MAXIMUM RATINGS

Parameter

Operating temperature under bias

Storage temperature

Input voltage

Output voltage

Power supply voltage

Power dissipation per package

Symbol

opr

stg

relative to V

Condition

Value

0 to 70

-55 to 125

-0.5 to V

+ 0.5

-0.5 to V

+0.5

-0.5 to 5

1.0

Unit

°C

RECOMMENDED OPERATING CONDITIONS

(Ta=0 to 70

°C)

Parameter

power supply voltage

Input "H" level

Input "L" level

Voltage is relative to Vss

* : Vcc+1.5V (Max.) when pulse width of overshoot is less than 10nS.

** : -1.5V (Min.) when pulse width of undershoot is less than 10nS.

Symbol

=2.7V-3.6V

Condition

Min.

2.7

2.2

-0.5**

Typ.

Max.

3.6

+0.5*

0.6

Unit

4/8

参数对比

与MR27V1602D-XXTA相近的元器件有：MR27V1602D-XXTP、MR27V1602D-XXMA、MR27V1602D-XXRA。描述及对比如下：

型号	MR27V1602D-XXTA	MR27V1602D-XXTP	MR27V1602D-XXMA	MR27V1602D-XXRA
描述	MASK ROM, 1MX16, 90ns, CMOS, PDSO48, 0.550 INCH, 0.80 MM PITCH, PLASTIC, TSOP2-48	MASK ROM, 1MX16, 90ns, CMOS, PDSO44, 0.400 INCH, 0.80 MM PITCH, PLASTIC, TSOP2-44	MASK ROM, 1MX16, 90ns, CMOS, PDSO44, 0.600 INCH, 1.27 MM PITCH, PLASTIC, SOP-44	MASK ROM, 1MX16, 90ns, CMOS, PDIP42, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-42
是否Rohs认证	不符合	不符合	不符合	不符合
厂商名称	LAPIS Semiconductor Co Ltd	LAPIS Semiconductor Co Ltd	LAPIS Semiconductor Co Ltd	LAPIS Semiconductor Co Ltd
零件包装代码	TSOP2	TSOP2	SOIC	DIP
包装说明	TSOP2, TSOP48,.6,32	TSOP2, TSOP44,.46,32	SOP, SOP44,.63	DIP, DIP42,.6
针数	48	44	44	42
Reach Compliance Code	unknow	unknown	unknown	unknow
ECCN代码	EAR99	EAR99	EAR99	EAR99
最长访问时间	90 ns	90 ns	90 ns	90 ns
备用内存宽度	8	8	8	8
JESD-30 代码	R-PDSO-G48	R-PDSO-G44	R-PDSO-G44	R-PDIP-T42
JESD-609代码	e0	e0	e0	e0
长度	19.68 mm	18.41 mm	28.15 mm	51.98 mm
内存密度	16777216 bi	16777216 bit	16777216 bit	16777216 bi
内存集成电路类型	MASK ROM	MASK ROM	MASK ROM	MASK ROM
内存宽度	16	16	16	16
功能数量	1	1	1	1
端子数量	48	44	44	42
字数	1048576 words	1048576 words	1048576 words	1048576 words
字数代码	1000000	1000000	1000000	1000000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C	70 °C
组织	1MX16	1MX16	1MX16	1MX16
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	TSOP2	TSOP2	SOP	DIP
封装等效代码	TSOP48,.6,32	TSOP44,.46,32	SOP44,.63	DIP42,.6
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	IN-LINE
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
电源	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.2 mm	1.2 mm	3.1 mm	5.08 mm
最大待机电流	0.00005 A	0.00005 A	0.00005 A	0.00005 A
最大压摆率	0.04 mA	0.04 mA	0.04 mA	0.04 mA
最大供电电压 (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压 (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V
标称供电电压 (Vsup)	3 V	3 V	3 V	3 V
表面贴装	YES	YES	YES	NO
技术	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	GULL WING	GULL WING	GULL WING	THROUGH-HOLE
端子节距	0.8 mm	0.8 mm	1.27 mm	2.54 mm
端子位置	DUAL	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	13.97 mm	10.16 mm	13 mm	15.24 mm