首页 > 器件类别 > 存储 > 存储
 PDF数据手册

MR27V6452G-XXXMA

描述:
MASK ROM, 4MX16, 100ns, CMOS, PDSO44, 0.600 INCH, 1.27 MM PITCH, PLASTIC, SOP-44
分类:
存储    存储   
文件大小:
134KB,共9页
制造商:
概述
MASK ROM, 4MX16, 100ns, CMOS, PDSO44, 0.600 INCH, 1.27 MM PITCH, PLASTIC, SOP-44
器件参数
参数名称
属性值
厂商名称
LAPIS Semiconductor Co Ltd
零件包装代码
SOIC
包装说明
SOP, SOP44,.63
针数
44
Reach Compliance Code
unknown
ECCN代码
EAR99
最长访问时间
100 ns
备用内存宽度
8
JESD-30 代码
R-PDSO-G44
长度
28.15 mm
内存密度
67108864 bit
内存集成电路类型
MASK ROM
内存宽度
16
功能数量
1
端子数量
44
字数
4194304 words
字数代码
4000000
工作模式
ASYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
4MX16
封装主体材料
PLASTIC/EPOXY
封装代码
SOP
封装等效代码
SOP44,.63
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
并行/串行
PARALLEL
电源
3.3 V
认证状态
Not Qualified
座面最大高度
3.1 mm
最大待机电流
0.00001 A
最大压摆率
0.05 mA
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
3 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子形式
GULL WING
端子节距
1.27 mm
端子位置
DUAL
宽度
13 mm
文档预览
FEDR27V6452G-002-06
Issue Date: Jul. 9, 2004
MR27V6452G
4M–Word
×
16–Bit or 8M–Word
×
8–Bit
Page Mode
P2ROM
PIN CONFIGURATION (TOP VIEW)
FEATURES
· 4,194,304-word
×
16-bit / 8,388,608-word
×
8-bit electrically
switchable configuration
· Page size of 8-word x 16-Bit or 16-word x 8-Bit
· 3.0 V to 3.6 V power supply
·Random Access time
100 ns MAX
·Page Access time
30 ns MAX
· Operating current
50 mA MAX (5MHz)
· Standby current
10 µA MAX
· Input/Output TTL compatible
· Three-state output
A21
A18
A17
A7
A6
A5
A4
A3
A2
A1
A0
CE#
V
SS
D0
D8
D1
D9
D2
D10
D3
D11
1
2
3
4
5
6
7
8
9
10
11
12
13
44
A20
43
A19
42
A8
41
A9
40
A10
39
A11
38
A12
37
A13
36
A14
35
A15
34
A16
33
BYTE#
32
V
SS
31
D15/A–1
30
D7
29
D14
28
D6
27
D13
26
D5
25
D12
24
D4
23
V
CC
PACKAGES
· MR27V6452G-xxxMA
44-pin plastic SOP (SOP44-P-600-1.27-K)
·MR27V6452G-xxxTN
48-pin plastic TSOP (TSOP I 48-P-1220-0.50-1K)
OE#
14
15
16
17
18
19
20
21
22
P2ROM ADVANCED TECHNOLOGY
P2ROM stands for Production Programmed ROM. This
exclusive LAPIS Semiconductor’s technology utilizes factory
test equipment for programming the customers code into the
P2ROM prior to final production testing. Advancements in this
technology allows production costs to be equivalent to
MASKROM and has many advantages and added benefits over
the other non-volatile technologies, which include the
following;
·
Short lead time,
since the P2ROM is programmed at the
final stage of the production process, a large P2ROM
inventory "bank system" of un-programmed packaged
products are maintained to provide an aggressive lead-time
and minimize liability as a custom product.
·
No mask charge,
since P2ROMs do not utilize a custom
mask for storing customer code, no mask charges apply.
·
No additional programming charge,
unlike Flash and
OTP that require additional programming and handling
costs, the P2ROM already has the code loaded at the
factory with minimal effect on the production throughput.
The cost is included in the unit price.
·
Custom Marking is
available at no additional charge.
·
Pin Compatible with Mask ROM
and some FLASH
products.
44SOP
A15
A14
A13
A12
A11
A10
A9
A8
A19
A20
NC
NC
A21
NC
NC
A18
A17
A7
A6
A5
A4
A3
A2
A1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
A16
47
BYTE#
46
V
SS
45
D15/A–1
44
D7
43
D14
42
D6
41
D13
40
D5
39
D12
38
D4
37
V
CC
36
D11
35
D3
34
D10
33
D2
32
D9
31
D1
30
D8
29
D0
28
OE#
27
V
SS
26
CE#
25
A0
48TSOP(Type-I)
1/9
FEDR27V6452G-002-06
MR27V6452G / P2ROM
BLOCK DIAGRAM
A–1
× 8/× 16 Switch
CE#
CE
OE#
OE
BYTE#
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
Row Decoder
Memory Cell Matrix
4M × 16-Bit or 8M × 8-Bit
Address Buffer
Column Decoder
Multiplexer
Output Buffer
D0
D1
D2
D3
D4
D5
D6
D7
D8
D10
D9
D12
D14
D15
D11
D13
In 8-bit output mode, these pins
are placed in a high-Z state and
pin D15 functions as the A-1
address pin.
PIN DESCRIPTIONS
Pin name
D15 / A–1
A0 to A21
D0 to D14
CE#
OE#
BYTE#
V
CC
V
SS
NC
Address inputs
Data outputs
Chip enable input
Output enable input
Word / Byte select input
Power supply voltage
Ground
No connect
Functions
Data output / Address input
2/9
FEDR27V6452G-002-06
MR27V6452G / P2ROM
FUNCTION TABLE
Mode
Read (16-Bit)
Read (8-Bit)
Output disable
Standby
CE#
L
L
L
H
OE#
L
L
H
BYTE#
H
L
H
L
H
L
3.3 V
D
OUT
V
CC
D0 to D7
D8 to D14
D
OUT
Hi–Z
Hi–Z
Hi–Z
L/H
D15/A–1
∗:
Don’t Care (H or L)
ABSOLUTE MAXIMUM RATINGS
Parameter
Operating temperature under bias
Storage temperature
Input voltage
Output voltage
Power supply voltage
Power dissipation per package
Output short circuit current
Symbol
Ta
Tstg
V
I
V
O
V
CC
P
D
I
OS
Ta = 25°C
relative to V
SS
Condition
Value
0 to 70
–55 to 125
–0.5 to V
CC
+0.5
–0.5 to V
CC
+0.5
–0.5 to 5
1.0
10
Unit
°C
°C
V
V
V
W
mA
RECOMMENDED OPERATING CONDITIONS
(Ta = 0 to 70°C)
Parameter
V
CC
power supply voltage
Input “H” level
Input “L” level
Symbol
V
CC
V
IH
V
IL
V
CC
= 3.0 to 3.6 V
Condition
Min.
3.0
2.2
–0.5∗∗
Typ.
Max.
3.6
V
CC
+0.5∗
0.6
Unit
V
V
V
Voltage is relative to V
SS
.
: Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns.
∗∗
: -1.5V(Min.) when pulse width of undershoot is less than 10ns.
PIN CAPACITANCE
(V
CC
= 3.3 V, Ta = 25°C, f = 1 MHz)
Parameter
Input
BYTE#
Output
Symbol
C
IN1
C
IN2
C
OUT
Condition
V
I
= 0 V
V
O
= 0 V
Min.
Typ.
Max.
8
200
10
pF
Unit
3/9
FEDR27V6452G-002-06
MR27V6452G / P2ROM
ELECTRICAL CHARACTERISTICS
DC Characteristics
(V
CC
= 3.0 V to 3.6 V, Ta = 0 to 70°C)
Parameter
Input leakage current
Output leakage current
V
CC
power supply current
(Standby)
V
CC
power supply current
(Read)
Input “H” level
Input “L” level
Output “H” level
Output “L” level
Symbol
I
LI
I
LO
I
CCSC
I
CCST
I
CCA
V
IH
V
IL
V
OH
V
OL
Condition
V
I
= 0 to V
CC
V
O
= 0 to V
CC
CE# = V
CC
CE# = V
IH
CE# = V
IL
, OE# = V
IH
f=5MHz
I
OH
= –2 mA
I
OL
= 4 mA
Min.
2.2
–0.5∗∗
2.4
Typ.
Max.
10
10
10
1
50
V
CC
+0.5∗
0.6
0.4
Unit
μA
μA
μA
mA
mA
V
V
V
V
Voltage is relative to V
SS
.
: Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns.
∗∗
: -1.5V(Min.) when pulse width of undershoot is less than 10ns.
AC Characteristics
(V
CC
= 3.0 V to 3.6 V, Ta = 0 to 70°C)
Parameter
Address cycle time
Address access time
Page cycle time
Page access time
CE# access time
OE# access time
Output disable time
Output hold time
Symbol
t
C
t
ACC
t
PC
t
PAC
t
CE
t
OE
t
CHZ
t
OHZ
t
OH
Condition
CE# = OE# = V
IL
OE# = V
IL
CE# = V
IL
OE# = V
IL
CE# = V
IL
CE# = OE# = V
IL
Min.
100
30
0
0
0
Max.
100
30
100
25
20
20
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
Measurement conditions
Input signal level --------------------------------------0 V/3.0 V
Input timing reference level-------------------------1/2Vcc
Output load ---------------------------------------------50 pF
Output timing reference level ----------------------1/2Vcc
Output load
Output
50 pF
(Including scope and jig)
4/9
FEDR27V6452G-002-06
MR27V6452G / P2ROM
TIMING CHART (READ CYCLE)
RANDOM ACCESS MODE READ CYCLE
t
C
Address
t
OH
t
CE
CE#
t
CHZ
t
OE
OE#
t
ACC
Dout
Hi-Z
Valid Data
Valid Data
Hi-Z
t
OHZ
t
OH
t
ACC
t
C
PAGE ACCESS MODE READ CYCLE
t
C
A3 to A21
t
PC
A-1 to A2 (Byte mode)
A0 to A2 (Word mode)
t
CE
t
OH
t
PC
CE#
t
OE
OE#
t
ACC
Dout
Hi-Z
Hi-Z
t
PAC
t
PAC
t
OHZ
t
CHZ
5/9
参数对比
与MR27V6452G-XXXMA相近的元器件有:MR27V6452G-XXXTN。描述及对比如下:
型号 MR27V6452G-XXXMA MR27V6452G-XXXTN
描述 MASK ROM, 4MX16, 100ns, CMOS, PDSO44, 0.600 INCH, 1.27 MM PITCH, PLASTIC, SOP-44 MASK ROM, 4MX16, 100ns, CMOS, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48
零件包装代码 SOIC TSOP1
包装说明 SOP, SOP44,.63 TSSOP, TSSOP48,.8,20
针数 44 48
Reach Compliance Code unknown unknown
ECCN代码 EAR99 EAR99
最长访问时间 100 ns 100 ns
备用内存宽度 8 8
JESD-30 代码 R-PDSO-G44 R-PDSO-G48
长度 28.15 mm 18.4 mm
内存密度 67108864 bit 67108864 bit
内存集成电路类型 MASK ROM MASK ROM
内存宽度 16 16
功能数量 1 1
端子数量 44 48
字数 4194304 words 4194304 words
字数代码 4000000 4000000
工作模式 ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 70 °C
组织 4MX16 4MX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SOP TSSOP
封装等效代码 SOP44,.63 TSSOP48,.8,20
封装形状 RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行 PARALLEL PARALLEL
电源 3.3 V 3.3 V
认证状态 Not Qualified Not Qualified
座面最大高度 3.1 mm 1.2 mm
最大待机电流 0.00001 A 0.00001 A
最大压摆率 0.05 mA 0.05 mA
最大供电电压 (Vsup) 3.6 V 3.6 V
最小供电电压 (Vsup) 3 V 3 V
标称供电电压 (Vsup) 3.3 V 3.3 V
表面贴装 YES YES
技术 CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL
端子形式 GULL WING GULL WING
端子节距 1.27 mm 0.5 mm
端子位置 DUAL DUAL
宽度 13 mm 12 mm
互联网热门:四要素决定四类宽频运营企业
eNet硅谷动力 从2005年下半年以来,宽频概念已经成为中国互联网的热门方向,不断有企业...
fighting 无线连接
电流钳的这个方向到底是什么意思?
今天看了一个品致的电流钳,上面标定了要按照箭头的方向夹持待测电流线缆,方向一致输出为正,方向相反输...
乱世煮酒论天下 工业自动化与控制
请教,这个给芯片供电中的两处的那些二极管起什么作用
本帖最后由 kal9623287 于 2024-8-19 16:08 编辑 请教,这个给芯片...
kal9623287 电源技术
【GD32F310G-START】电压表
本帖最后由 lugl4313820 于 2022-5-9 15:59 编辑 为了验证ADC的...
lugl4313820 GD32 MCU
锂电池充电设置电流多大合适?
如图,现在我要给这块 220mAh 的软包电池设计一个充电电路, 不太清楚需要设计多大的电流。查...
普拉卡图 电源技术
聆思CSK6大模型开发板语音唤醒加载GIF动画
本篇文章主要介绍基于聆思CSK6大模型开发板的语音交互多模态实例进行二次开发,实现在语音唤...
胡黎明 DIY/开源硬件专区
热门器件
热门资源推荐
器件捷径:
L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ
索引文件:
1541  1982  1266  1899  1685  32  40  26  39  34 
需要登录后才可以下载。
登录取消
下载 PDF 文件