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MR27V802FTN

描述:
OTP ROM, 512KX16, 70ns, CMOS, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48
分类:
存储    存储   
文件大小:
175KB,共16页
制造商:
概述
OTP ROM, 512KX16, 70ns, CMOS, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48
器件参数
参数名称
属性值
厂商名称
LAPIS Semiconductor Co Ltd
零件包装代码
TSOP1
包装说明
TSSOP, TSSOP48,.8,20
针数
48
Reach Compliance Code
unknown
ECCN代码
EAR99
最长访问时间
70 ns
备用内存宽度
8
I/O 类型
COMMON
JESD-30 代码
R-PDSO-G48
长度
18.4 mm
内存密度
8388608 bit
内存集成电路类型
OTP ROM
内存宽度
16
功能数量
1
端子数量
48
字数
524288 words
字数代码
512000
工作模式
ASYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
512KX16
输出特性
3-STATE
封装主体材料
PLASTIC/EPOXY
封装代码
TSSOP
封装等效代码
TSSOP48,.8,20
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行
PARALLEL
电源
3.3 V
认证状态
Not Qualified
座面最大高度
1.2 mm
最大待机电流
0.000005 A
最大压摆率
0.05 mA
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
3 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子形式
GULL WING
端子节距
0.5 mm
端子位置
DUAL
宽度
12 mm
文档预览
Dear customers,
About the change in the name such as "Oki Electric Industry Co. Ltd." and
"OKI" in documents to OKI Semiconductor Co., Ltd.
The semiconductor business of Oki Electric Industry Co., Ltd. was succeeded to OKI
Semiconductor Co., Ltd. on October 1, 2008.
Therefore, please accept that although
the terms and marks of "Oki Electric Industry Co., Ltd.", “Oki Electric”, and "OKI"
remain in the documents, they all have been changed to "OKI Semiconductor Co., Ltd.".
It is a change of the company name, the company trademark, and the logo, etc. , and
NOT a content change in documents.
October 1, 2008
OKI Semiconductor Co., Ltd.
550-1 Higashiasakawa-cho, Hachioji-shi, Tokyo 193-8550, Japan
http://www.okisemi.com/en/
OKI Semiconductor
MR27V802F
524,288–Word
x
16–Bit or 1,048,576–Word
x
8–Bit One Time PROM
FEDR27V802F-01-03
Issue Date: Dec. 8, 2004
GENERAL DESCRIPTION
The MR27V802F is a 8Mbit electrically One Time Programmable Read-Only Memory that can be electrically
switched between 524,288-word
×
16-bit and 1,048,576-word
×
8-bit by the state of the BYTE# pin. The
MR27V802F supports high speed asynchronous read operation using a single 3.3V power supply.
FEATURES
· 524,288-word
×
16-bit/1,048,576-word
×
8-bit electrically switchable configuration
· +3.3 V power supply
· Access time
70 nS MAX
· Operating current
18 mA MAX (5MHz)
· Standby current
5 µA MAX
· Input/Output TTL compatible
· Tri-state output
· Packages:
44-pin plastic SOP (SOP44-P-600-1.27-K)
(Product Name : MR27V802FMA)
48-pin plastic TSOP (TSOP(1)48-P-1220-0.50-1K) (Product Name : MR27V802FTN)
44-pin plastic TSOP (TSOP II 44-P-400-0.80-K)
(Product Name : MR27V802FTP)
1/15
FEDR27V802F-01-03
OKI Semiconductor
MR27V802F / OTP
PIN CONFIGURATION (TOP VIEW)
A15
A14
NC
A18
A17
A7
A6
A5
A4
A3
A2
A1
A0
CE#
V
SS
OE#
D0
D8
D1
D9
D2
D10
D3
D11
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A16
BYTE#/V
PP
V
SS
D15/A–1
D7
D14
D6
D13
D5
D12
D4
V
CC
D11
D3
D10
D2
D9
D1
D8
D0
OE#
V
SS
CE#
A0
NC
NC
A8
A9
A10
A11
A12
A13
A14
A15
A16
BYTE#/V
PP
V
SS
D15/A–1
D7
D14
D6
D13
D5
D12
D4
V
CC
A13
A12
A11
A10
A9
A8
NC
NC
NC
NC
NC
NC
NC
A18
A17
A7
A6
A5
A4
A3
A2
A1
44-pin SOP
44-pin TSOP(II)
Pin name
D15/A–1
A0 to A18
D0 to D14
CE#
OE#
BYTE#/V
PP
V
CC
V
SS
NC
48-pin TSOP(I)
Functions
Data output/Address input
Address input
Data output
Chip enable
Output enable
Mode switch/Program power supply voltage
Power supply voltage
GND
Non connection
2/15
FEDR27V802F-01-03
OKI Semiconductor
MR27V802F / OTP
BLOCK DIAGRAM
A–1
× 8/× 16 Switch
CE#
CE
OE#
OE
BYTE#/V
PP
PGM
Column Decoder
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
Row Decoder
Memory Cell Matrix
524,288 × 16-Bit or 1,048,576× 8-Bit
Address Buffer
Multiplexer
Output Buffer
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D12
D14
D15
D11
D13
In 8-bit output mode, these pins
are placed in a high-Z state and
pin D15 functions as the A-1
address pin.
FUNCTION TABLE
Mode
Read (16-Bit)
Read (8-Bit)
Output disable
Standby
Program
Program inhibit
Program verify
CE#
L
L
L
H
L
H
H
OE#
L
L
H
H
H
L
BYTE#/V
PP
H
L
H
L
H
L
8.0 V
V
CC
D0 to D7
D
OUT
3.3 V
D8 to D14
D
OUT
Hi–Z
Hi–Z
Hi–Z
D
IN
Hi–Z
D
OUT
Hi-Z
Hi-Z
Hi-Z
D15/A–1
L/H
L/H
L/H
L/H
4.0 V
∗:
Don’t Care (H or L)
3/15
FEDR27V802F-01-03
OKI Semiconductor
MR27V802F / OTP
ABSOLUTE MAXIMUM RATINGS
Parameter
Operating temperature under bias
Storage temperature
Input voltage
Output voltage
Power supply voltage
Program power supply voltage
Power dissipation per package
Output short circuit current
Symbol
Ta
Tstg
V
I
V
O
V
CC
V
PP
P
D
I
OS
Condition
Value
0 to 70
–55 to 125
–0.5 to V
CC
+0.5
–0.5 to V
CC
+0.5
–0.5 to 5
–0.5 to 9.0
1.0
10
Unit
°C
°C
V
V
V
V
W
mA
relative to V
SS
Ta = 25°C
RECOMMENDED OPERATING CONDITIONS
Parameter
V
CC
power supply voltage
V
PP
power supply voltage
Input “H” level
Input “L” level
Symbol
V
CC
V
PP
V
IH
V
IL
V
CC
= 3.0 to 3.6 V
Condition
Min.
3.0
–0.5
2.2
–0.5∗∗
Typ.
(Ta = 0 to 70°C)
Max.
Unit
3.6
V
CC
+0.5
V
CC
+0.5∗
0.6
V
V
V
V
Voltage is relative to V
SS
.
: Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns.
∗∗
: -1.5V(Min.) when pulse width of undershoot is less than 10ns.
4/15
参数对比
与MR27V802FTN相近的元器件有:MR27V802FTP、MR27V802FMA。描述及对比如下:
型号 MR27V802FTN MR27V802FTP MR27V802FMA
描述 OTP ROM, 512KX16, 70ns, CMOS, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 OTP ROM, 512KX16, 70ns, CMOS, PDSO44, 0.400 INCH, 0.80 MM PITCH, PLASTIC, TSOP2-44 OTP ROM, 512KX16, 70ns, CMOS, PDSO44, 0.600 INCH, 1.27 MM PITCH, PLASTIC, SOP-44
厂商名称 LAPIS Semiconductor Co Ltd LAPIS Semiconductor Co Ltd LAPIS Semiconductor Co Ltd
零件包装代码 TSOP1 TSOP2 SOIC
包装说明 TSSOP, TSSOP48,.8,20 TSOP2, TSOP44,.46,32 SOP, SOP44,.63
针数 48 44 44
Reach Compliance Code unknown unknown unknown
ECCN代码 EAR99 EAR99 EAR99
最长访问时间 70 ns 70 ns 70 ns
备用内存宽度 8 8 8
I/O 类型 COMMON COMMON COMMON
JESD-30 代码 R-PDSO-G48 R-PDSO-G44 R-PDSO-G44
长度 18.4 mm 18.41 mm 28.15 mm
内存密度 8388608 bit 8388608 bit 8388608 bit
内存集成电路类型 OTP ROM OTP ROM OTP ROM
内存宽度 16 16 16
功能数量 1 1 1
端子数量 48 44 44
字数 524288 words 524288 words 524288 words
字数代码 512000 512000 512000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C
组织 512KX16 512KX16 512KX16
输出特性 3-STATE 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP TSOP2 SOP
封装等效代码 TSSOP48,.8,20 TSOP44,.46,32 SOP44,.63
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE SMALL OUTLINE
并行/串行 PARALLEL PARALLEL PARALLEL
电源 3.3 V 3.3 V 3.3 V
认证状态 Not Qualified Not Qualified Not Qualified
座面最大高度 1.2 mm 1.2 mm 3.1 mm
最大待机电流 0.000005 A 0.000005 A 0.000005 A
最大压摆率 0.05 mA 0.05 mA 0.05 mA
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 3 V 3 V 3 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES
技术 CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 GULL WING GULL WING GULL WING
端子节距 0.5 mm 0.8 mm 1.27 mm
端子位置 DUAL DUAL DUAL
宽度 12 mm 10.16 mm 13 mm
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A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ
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