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MR53V8002J-XXRA

描述:
MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-42
分类:
存储    存储   
文件大小:
187KB,共9页
制造商:
概述
MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-42
器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
LAPIS Semiconductor Co Ltd
零件包装代码
DIP
包装说明
DIP, DIP42,.6
针数
42
Reach Compliance Code
unknown
ECCN代码
EAR99
最长访问时间
100 ns
备用内存宽度
8
JESD-30 代码
R-PDIP-T42
JESD-609代码
e0
内存密度
8388608 bit
内存集成电路类型
MASK ROM
内存宽度
16
功能数量
1
端子数量
42
字数
524288 words
字数代码
512000
工作模式
ASYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
512KX16
封装主体材料
PLASTIC/EPOXY
封装代码
DIP
封装等效代码
DIP42,.6
封装形状
RECTANGULAR
封装形式
IN-LINE
并行/串行
PARALLEL
峰值回流温度(摄氏度)
NOT SPECIFIED
电源
3/3.3 V
认证状态
Not Qualified
最大待机电流
0.00001 A
最大压摆率
0.04 mA
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
2.7 V
标称供电电压 (Vsup)
3.3 V
表面贴装
NO
技术
CMOS
温度等级
COMMERCIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
THROUGH-HOLE
端子节距
2.54 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
文档预览
Dear customers,
About the change in the name such as "Oki Electric Industry Co. Ltd." and
"OKI" in documents to OKI Semiconductor Co., Ltd.
The semiconductor business of Oki Electric Industry Co., Ltd. was succeeded to OKI
Semiconductor Co., Ltd. on October 1, 2008.
Therefore, please accept that although
the terms and marks of "Oki Electric Industry Co., Ltd.", “Oki Electric”, and "OKI"
remain in the documents, they all have been changed to "OKI Semiconductor Co., Ltd.".
It is a change of the company name, the company trademark, and the logo, etc. , and
NOT a content change in documents.
October 1, 2008
OKI Semiconductor Co., Ltd.
550-1 Higashiasakawa-cho, Hachioji-shi, Tokyo 193-8550, Japan
http://www.okisemi.com/en/
Semiconductor
MR53V8002J
524,288-Word X 16-Bit or 1,048,576-Word X 8-Bit MASK ROM
This version: Feb. 1999
Previous version: -------
Preliminary
DESCRIPTION
The MR53V8002J is a 8Mbit Read-Only Memory whose configuration can be electrically switched
between 524,288 word x 16bit and 1,048,576 word x 8bit. The MR53V8002J operates asynchronously,
external clocks are not required, making this device easy-to-use. The MR53V8002J is suitable as
large-capacity fixed memory for microcomputers and data terminals. It is manufactured using a CMOS
silicon gate technology and is offered in 42-pin DIP, 44-pin SOP or 44-pin TSOP packages.
FEATURES
· 524,288 word x 16bit / 1,048,576 word x 8bit electrically switchable configuration
· Single +2.7V~3.6V power supply
· Access time
· V
CC
Power supply current
· V
CC
Standby current
· Three-state output
· Packages
42-pin plastic DIP
44-pin plastic SOP
(DIP42-P-600-2.54)
(SOP44-P-600-1.27-K)
MR53V8002J-XXRA
MR53V8002J-XXMA
100ns
40mA
10mA
· Input / Output TTL compatible
44-pin plastic TSOP (TSOPII44-P-400-0.80-K) MR53V8002J-XXTP
1/6
Semiconductor
MR53V8002J
PIN CONFIGURATION (TOP VIEW)
NC
A18
A17
A7
A6
A5
A4
A3
A2
A1
1
2
3
4
5
6
7
8
9
42
NC
41
A8
40
A9
39
A10
38
A11
37
A12
36
A13
35
A14
34
A15
33
A16
32
BYTE
31
V
SS
30
D15/A-1
29
D7
28
D14
27
D6
26
D13
25
D5
24
D12
23
D4
22
V
CC
1
2
3
4
5
6
7
8
9
44
NC
43
NC
42
A8
41
A9
40
A10
39
A11
38
A12
37
A13
36
A14
35
A15
34
A16
33
BYTE
32
V
SS
31
D15/A-1
30
D7
29
D14
28
D6
27
D13
26
D5
25
D12
24
D4
23
V
CC
A18
A17
A7
A6
A5
A4
A3
A2
A1
10
A0
11
CE
12
V
SS
13
OE
14
D0
15
D8
15
D1
17
D9
18
D2
19
D10
20
D3
21
D11
22
A0
10
CE
11
V
SS
12
OE
13
D0
14
D8
15
D1
16
D9
17
D2
18
D10
19
D3
20
D11
21
42-Pin DIP
44-Pin SOP
44-Pin TSOPII
PIN NAMES
D15/A-1
A0~A18
D0~D14
CE
OE
BYTE
V
CC
V
SS
NC
FUNCTIONS
Data output / Address input
Address input
Data output
Chip enable
Output enable
Mode switch
Power supply voltage
GND
Non connection
2/6
Semiconductor
MR53V8002J
BLOCK DIAGRAM
A-1
BYTE
X8/X16 SWITCH
CE
OE
CE
OE
CONTROL
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
Row
Decoder
Address
Buffer
Memory Cell
Matrix
524,288 x 16 or 1,048,676 x 8
Column
Decoder
Multiplex
Output Buffer
D0 D1 D2 D3 D4 D5 D6 D7
D8 D9 D10 D11 D12 D13 D14 D15
FUNCTION TABLE
MODE
STAND BY
OUTPUT DISABLE
READ(16-BIT)
READ(8-BIT)
CE
H
L
L
L
L
OE
X
H
H
L
L
BYTE
X
H
L
H
L
D0~D7
D8~D14
Hi-Z
D
OUT
Hi-Z
L/H
L/H
A-1/D15
D
OUT
3/6
Semiconductor
MR53V8002J
ABSOLUTE MAXIMUM RATINGS
Parameter
Operating temperature under bias
Storage temperature
Input voltage
Output voltage
Power supply voltage
Power dissipation per package
Symbol
T
OPR
T
STG
V
I
V
O
V
CC
P
D
Condition
-
-
Relative to V
SS
-
Value
0 ~ 70
-55 ~ 125
-0.5 ~ V
CC
+0.5
-0.5 ~ V
CC
+0.5
-0.5 ~ 5
1.0
Unit
`C
`C
V
V
V
W
RECOMMENDED OPERATING CONDITIONS FOR READ
Parameter
V
CC
power supply voltage
Input “H“ level
Input “L“ level
Voltage is relative to V
SS
Symbol
V
CC
V
IH
V
IL
Condition
V
CC
=2.7V ~ 3.6V
Min.
2.7
2.2
-0.5
Typ.
-
-
-
(Ta=0 ~ 70`C)
Min.
Unit
3.6
`C
V
CC
+0.5
`C
0.8
V
PIN Capacitance
Parameter
Input
Output
Symbol
C
IN
C
OUT
Condition
V
I
=0V
V
O
=0V
(Vcc=3.3V, Ta=25`C, f=1MHz)
Min.
Typ.
Min.
Unit
-
-
12
pF
-
-
15
pF
4/6
参数对比
与MR53V8002J-XXRA相近的元器件有:MR53V8002J-XXMA、MR53V8002J-XXTP。描述及对比如下:
型号 MR53V8002J-XXRA MR53V8002J-XXMA MR53V8002J-XXTP
描述 MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-42 MASK ROM, 512KX16, 100ns, CMOS, PDSO44, 0.600 INCH, 1.27 MM PITCH, PLASTIC, SOP-44 MASK ROM, 512KX16, 100ns, CMOS, PDSO44, 0.400 INCH, 0.80 MM PITCH, PLASTIC, TSOP2-44
是否Rohs认证 不符合 不符合 不符合
厂商名称 LAPIS Semiconductor Co Ltd LAPIS Semiconductor Co Ltd LAPIS Semiconductor Co Ltd
零件包装代码 DIP SOIC TSOP2
包装说明 DIP, DIP42,.6 SOP, SOP44,.63 SOP, TSOP44,.46,32
针数 42 44 44
Reach Compliance Code unknown unknown unknown
ECCN代码 EAR99 EAR99 EAR99
最长访问时间 100 ns 100 ns 100 ns
备用内存宽度 8 8 8
JESD-30 代码 R-PDIP-T42 R-PDSO-G44 R-PDSO-G44
JESD-609代码 e0 e0 e0
内存密度 8388608 bit 8388608 bit 8388608 bit
内存集成电路类型 MASK ROM MASK ROM MASK ROM
内存宽度 16 16 16
功能数量 1 1 1
端子数量 42 44 44
字数 524288 words 524288 words 524288 words
字数代码 512000 512000 512000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C
组织 512KX16 512KX16 512KX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 DIP SOP SOP
封装等效代码 DIP42,.6 SOP44,.63 TSOP44,.46,32
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE SMALL OUTLINE SMALL OUTLINE
并行/串行 PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
电源 3/3.3 V 3/3.3 V 3/3.3 V
认证状态 Not Qualified Not Qualified Not Qualified
最大待机电流 0.00001 A 0.00001 A 0.00001 A
最大压摆率 0.04 mA 0.04 mA 0.04 mA
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 2.7 V 2.7 V 2.7 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V
表面贴装 NO YES YES
技术 CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 THROUGH-HOLE GULL WING GULL WING
端子节距 2.54 mm 1.27 mm 0.8 mm
端子位置 DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
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器件捷径:
S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY
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