器件参数

参数名称

属性值

厂商名称

LAPIS Semiconductor Co Ltd

包装说明

SIMM, SSIM72

Reach Compliance Code

unknow

ECCN代码

EAR99

最长访问时间

70 ns

I/O 类型

COMMON

JESD-30 代码

R-PSMA-N72

内存密度

33554432 bi

内存集成电路类型

FAST PAGE DRAM MODULE

内存宽度

端子数量

字数

1048576 words

字数代码

1000000

最高工作温度

70 °C

最低工作温度

组织

1MX32

输出特性

3-STATE

封装主体材料

PLASTIC/EPOXY

封装代码

SIMM

封装等效代码

SSIM72

封装形状

RECTANGULAR

封装形式

MICROELECTRONIC ASSEMBLY

电源

5 V

认证状态

Not Qualified

刷新周期

1024

座面最大高度

25.4 mm

自我刷新

最大待机电流

0.008 A

最大压摆率

0.72 mA

标称供电电压 (Vsup)

5 V

表面贴装

技术

CMOS

温度等级

COMMERCIAL

端子形式

NO LEAD

端子节距

1.27 mm

端子位置

SINGLE

参数对比

与MSC23132-70DS8相近的元器件有：MSC23132-10BS8、MSC23B1321A-80DS2、MSC23B1321A-80BS2、MSC23132-10DS8、MSC23132-70BS8、MSC23132-80BS8、MSC23132-80DS8。描述及对比如下：

型号	MSC23132-70DS8	MSC23132-10BS8	MSC23B1321A-80DS2	MSC23B1321A-80BS2	MSC23132-10DS8	MSC23132-70BS8	MSC23132-80BS8	MSC23132-80DS8
描述	Fast Page DRAM Module, 1MX32, 70ns, CMOS, PSMA72	Fast Page DRAM Module, 1MX32, 100ns, CMOS, PSMA72	Fast Page DRAM Module, 1MX32, 80ns, CMOS, PSMA72,	Fast Page DRAM Module, 1MX32, 80ns, CMOS, PSMA72,	Fast Page DRAM Module, 1MX32, 100ns, CMOS, PSMA72	Fast Page DRAM Module, 1MX32, 70ns, CMOS, PSMA72	Fast Page DRAM Module, 1MX32, 80ns, CMOS, PSMA72	Fast Page DRAM Module, 1MX32, 80ns, CMOS, PSMA72
厂商名称	LAPIS Semiconductor Co Ltd	LAPIS Semiconductor Co Ltd	LAPIS Semiconductor Co Ltd	LAPIS Semiconductor Co Ltd	LAPIS Semiconductor Co Ltd	LAPIS Semiconductor Co Ltd	LAPIS Semiconductor Co Ltd	LAPIS Semiconductor Co Ltd
包装说明	SIMM, SSIM72	SIMM, SSIM72	SIMM, SSIM72	SIMM, SSIM72	SIMM, SSIM72	SIMM, SSIM72	SIMM, SSIM72	SIMM, SSIM72
Reach Compliance Code	unknow	unknown	unknown	unknown	unknow	unknow	unknow	unknow
最长访问时间	70 ns	100 ns	80 ns	80 ns	100 ns	70 ns	80 ns	80 ns
I/O 类型	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 代码	R-PSMA-N72	R-PSMA-N72	R-PSMA-N72	R-PSMA-N72	R-PSMA-N72	R-PSMA-N72	R-PSMA-N72	R-PSMA-N72
内存密度	33554432 bi	33554432 bit	33554432 bit	33554432 bit	33554432 bi	33554432 bi	33554432 bi	33554432 bi
内存集成电路类型	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE
内存宽度	32	32	32	32	32	32	32	32
端子数量	72	72	72	72	72	72	72	72
字数	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words
字数代码	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	1MX32	1MX32	1MX32	1MX32	1MX32	1MX32	1MX32	1MX32
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SIMM	SIMM	SIMM	SIMM	SIMM	SIMM	SIMM	SIMM
封装等效代码	SSIM72	SSIM72	SSIM72	SSIM72	SSIM72	SSIM72	SSIM72	SSIM72
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
电源	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
刷新周期	1024	1024	1024	1024	1024	1024	1024	1024
座面最大高度	25.4 mm	25.4 mm	19.05 mm	19.05 mm	25.4 mm	25.4 mm	25.4 mm	25.4 mm
自我刷新	NO	NO	NO	NO	NO	NO	NO	NO
最大待机电流	0.008 A	0.008 A	0.002 A	0.002 A	0.008 A	0.008 A	0.008 A	0.008 A
最大压摆率	0.72 mA	0.56 mA	0.34 mA	0.34 mA	0.56 mA	0.72 mA	0.64 mA	0.64 mA
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	NO	NO	NO	NO	NO	NO	NO	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子形式	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
端子节距	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
端子位置	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE
ECCN代码	EAR99	-	-	-	EAR99	EAR99	EAR99	EAR99