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MSC23240BL-60DS20

Fast Page DRAM Module, 2MX40, 60ns, CMOS, SIMM-72

器件类别:存储    存储   

厂商名称:OKI

厂商官网:http://www.oki.com

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器件参数
参数名称
属性值
厂商名称
OKI
零件包装代码
SIMM
包装说明
,
针数
72
Reach Compliance Code
unknown
ECCN代码
EAR99
访问模式
FAST PAGE
最长访问时间
60 ns
其他特性
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; TEST MODE; PRESENCE DETECT PINS
JESD-30 代码
R-XSMA-N72
内存密度
83886080 bit
内存集成电路类型
FAST PAGE DRAM MODULE
内存宽度
40
功能数量
1
端口数量
1
端子数量
72
字数
2097152 words
字数代码
2000000
工作模式
ASYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
2MX40
输出特性
3-STATE
封装主体材料
UNSPECIFIED
封装形状
RECTANGULAR
封装形式
MICROELECTRONIC ASSEMBLY
认证状态
Not Qualified
刷新周期
1024
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
4.5 V
标称供电电压 (Vsup)
5 V
表面贴装
NO
技术
CMOS
温度等级
COMMERCIAL
端子形式
NO LEAD
端子位置
SINGLE
参数对比
与MSC23240BL-60DS20相近的元器件有:MSC23240B-10BS20、MSC23240B-10DS20、MSC23240BL-80DS20、MSC23240BL-10DS20、MSC23240BL-10BS20、MSC23240BL-60BS20、MSC23240BL-70BS20、MSC23240BL-70DS20、MSC23240BL-80BS20。描述及对比如下:
型号 MSC23240BL-60DS20 MSC23240B-10BS20 MSC23240B-10DS20 MSC23240BL-80DS20 MSC23240BL-10DS20 MSC23240BL-10BS20 MSC23240BL-60BS20 MSC23240BL-70BS20 MSC23240BL-70DS20 MSC23240BL-80BS20
描述 Fast Page DRAM Module, 2MX40, 60ns, CMOS, SIMM-72 Fast Page DRAM Module, 2MX40, 100ns, CMOS, SIMM-72 Fast Page DRAM Module, 2MX40, 100ns, CMOS, SIMM-72 Fast Page DRAM Module, 2MX40, 80ns, CMOS, SIMM-72 Fast Page DRAM Module, 2MX40, 100ns, CMOS, SIMM-72 Fast Page DRAM Module, 2MX40, 100ns, CMOS, SIMM-72 Fast Page DRAM Module, 2MX40, 60ns, CMOS, SIMM-72 Fast Page DRAM Module, 2MX40, 70ns, CMOS, SIMM-72 Fast Page DRAM Module, 2MX40, 70ns, CMOS, SIMM-72 Fast Page DRAM Module, 2MX40, 80ns, CMOS, SIMM-72
厂商名称 OKI OKI OKI OKI OKI OKI OKI OKI OKI OKI
零件包装代码 SIMM SIMM SIMM SIMM SIMM SIMM SIMM SIMM SIMM SIMM
针数 72 72 72 72 72 72 72 72 72 72
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown unknow
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
访问模式 FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE
最长访问时间 60 ns 100 ns 100 ns 80 ns 100 ns 100 ns 60 ns 70 ns 70 ns 80 ns
其他特性 RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; TEST MODE; PRESENCE DETECT PINS RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; TEST MODE; PRESENCE DETECT PINS RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; TEST MODE; PRESENCE DETECT PINS RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; TEST MODE; PRESENCE DETECT PINS RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; TEST MODE; PRESENCE DETECT PINS RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; TEST MODE; PRESENCE DETECT PINS RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; TEST MODE; PRESENCE DETECT PINS RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; TEST MODE; PRESENCE DETECT PINS RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; TEST MODE; PRESENCE DETECT PINS RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; TEST MODE; PRESENCE DETECT PINS
JESD-30 代码 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72
内存密度 83886080 bit 83886080 bit 83886080 bit 83886080 bit 83886080 bit 83886080 bit 83886080 bit 83886080 bit 83886080 bit 83886080 bi
内存集成电路类型 FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE
内存宽度 40 40 40 40 40 40 40 40 40 40
功能数量 1 1 1 1 1 1 1 1 1 1
端口数量 1 1 1 1 1 1 1 1 1 1
端子数量 72 72 72 72 72 72 72 72 72 72
字数 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words
字数代码 2000000 2000000 2000000 2000000 2000000 2000000 2000000 2000000 2000000 2000000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
组织 2MX40 2MX40 2MX40 2MX40 2MX40 2MX40 2MX40 2MX40 2MX40 2MX40
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
刷新周期 1024 1024 1024 1024 1024 1024 1024 1024 1024 1024
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO NO NO NO NO NO NO NO NO NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
端子位置 SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE
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