| 型号 | MSC23408BL-10DS8 | P-0805K2341DSTP | MSC23408BL-70DS8 | MSC23408B-10DS8 |
|---|---|---|---|---|
| 描述 | Fast Page DRAM Module, 4MX8, 100ns, CMOS, PSMA30, | Fixed Resistor, Thin Film, 0.25W, 2340ohm, 100V, 0.5% +/-Tol, 100ppm/Cel, Surface Mount, 0805, CHIP | Fast Page DRAM Module, 4MX8, 70ns, CMOS, PSMA30, | Fast Page DRAM Module, 4MX8, 100ns, CMOS, PSMA30, |
| 包装说明 | SIMM, SIM30 | CHIP | SIMM, SIM30 | SIMM, SIM30 |
| Reach Compliance Code | unknown | compliant | unknown | unknown |
| 端子数量 | 30 | 2 | 30 | 30 |
| 最高工作温度 | 70 °C | 155 °C | 70 °C | 70 °C |
| 封装形式 | MICROELECTRONIC ASSEMBLY | SMT | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 表面贴装 | NO | YES | NO | NO |
| 技术 | CMOS | THIN FILM | CMOS | CMOS |
| 厂商名称 | LAPIS Semiconductor Co Ltd | - | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd |
| 最长访问时间 | 100 ns | - | 70 ns | 100 ns |
| I/O 类型 | COMMON | - | COMMON | COMMON |
| JESD-30 代码 | R-PSMA-N30 | - | R-PSMA-N30 | R-PSMA-N30 |
| 内存密度 | 33554432 bit | - | 33554432 bit | 33554432 bit |
| 内存集成电路类型 | FAST PAGE DRAM MODULE | - | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE |
| 内存宽度 | 8 | - | 8 | 8 |
| 字数 | 4194304 words | - | 4194304 words | 4194304 words |
| 字数代码 | 4000000 | - | 4000000 | 4000000 |
| 组织 | 4MX8 | - | 4MX8 | 4MX8 |
| 输出特性 | 3-STATE | - | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SIMM | - | SIMM | SIMM |
| 封装等效代码 | SIM30 | - | SIM30 | SIM30 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 电源 | 5 V | - | 5 V | 5 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified |
| 刷新周期 | 1024 | - | 1024 | 1024 |
| 座面最大高度 | 20.447 mm | - | 20.447 mm | 20.447 mm |
| 最大待机电流 | 0.0016 A | - | 0.0016 A | 0.008 A |
| 最大压摆率 | 0.56 mA | - | 0.72 mA | 0.56 mA |
| 标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V |
| 温度等级 | COMMERCIAL | - | COMMERCIAL | COMMERCIAL |
| 端子形式 | NO LEAD | - | NO LEAD | NO LEAD |
| 端子节距 | 2.54 mm | - | 2.54 mm | 2.54 mm |
| 端子位置 | SINGLE | - | SINGLE | SINGLE |