与MSC23432-80DS8相近的元器件有:MSC23432-60DS8、MSC23432-80BS8。描述及对比如下:
| 型号 |
MSC23432-80DS8 |
MSC23432-60DS8 |
MSC23432-80BS8 |
| 描述 |
Fast Page DRAM Module, 4MX32, 80ns, CMOS, PSMA72, |
Fast Page DRAM Module, 4MX32, 60ns, CMOS, PSMA72, |
Fast Page DRAM Module, 4MX32, 80ns, CMOS, PSMA72, |
| 包装说明 |
SIMM, SSIM72 |
SIMM, SSIM72 |
SIMM, SSIM72 |
| Reach Compliance Code |
unknown |
unknown |
unknown |
| 最长访问时间 |
80 ns |
60 ns |
80 ns |
| I/O 类型 |
COMMON |
COMMON |
COMMON |
| JESD-30 代码 |
R-PSMA-N72 |
R-PSMA-N72 |
R-PSMA-N72 |
| 内存密度 |
134217728 bit |
134217728 bit |
134217728 bit |
| 内存集成电路类型 |
FAST PAGE DRAM MODULE |
FAST PAGE DRAM MODULE |
FAST PAGE DRAM MODULE |
| 内存宽度 |
32 |
32 |
32 |
| 端子数量 |
72 |
72 |
72 |
| 字数 |
4194304 words |
4194304 words |
4194304 words |
| 字数代码 |
4000000 |
4000000 |
4000000 |
| 最高工作温度 |
70 °C |
70 °C |
70 °C |
| 组织 |
4MX32 |
4MX32 |
4MX32 |
| 输出特性 |
3-STATE |
3-STATE |
3-STATE |
| 封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| 封装代码 |
SIMM |
SIMM |
SIMM |
| 封装等效代码 |
SSIM72 |
SSIM72 |
SSIM72 |
| 封装形状 |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| 封装形式 |
MICROELECTRONIC ASSEMBLY |
MICROELECTRONIC ASSEMBLY |
MICROELECTRONIC ASSEMBLY |
| 电源 |
5 V |
5 V |
5 V |
| 认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
| 刷新周期 |
2048 |
2048 |
2048 |
| 座面最大高度 |
33.02 mm |
33.02 mm |
33.02 mm |
| 自我刷新 |
NO |
NO |
NO |
| 最大待机电流 |
0.008 A |
0.008 A |
0.008 A |
| 最大压摆率 |
0.8 mA |
0.96 mA |
0.8 mA |
| 标称供电电压 (Vsup) |
5 V |
5 V |
5 V |
| 表面贴装 |
NO |
NO |
NO |
| 技术 |
CMOS |
CMOS |
CMOS |
| 温度等级 |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
| 端子形式 |
NO LEAD |
NO LEAD |
NO LEAD |
| 端子节距 |
1.27 mm |
1.27 mm |
1.27 mm |
| 端子位置 |
SINGLE |
SINGLE |
SINGLE |
| 厂商名称 |
- |
LAPIS Semiconductor Co Ltd |
LAPIS Semiconductor Co Ltd |