型号
- 型号
- 关键词
| 型号 | MSM2764A-12AS | MSM2764A-15AS | MSM2764A-20AS |
|---|---|---|---|
| 描述 | EPROM, 8KX8, 120ns, MOS, CDIP28 | EPROM, 8KX8, 150ns, MOS, CDIP28 | EPROM, 8KX8, 200ns, MOS, CDIP28 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 |
| Reach Compliance Code | unknow | unknown | unknown |
| 最长访问时间 | 120 ns | 150 ns | 200 ns |
| I/O 类型 | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 |
| JESD-609代码 | e0 | e0 | e0 |
| 内存密度 | 65536 bi | 65536 bit | 65536 bit |
| 内存宽度 | 8 | 8 | 8 |
| 端子数量 | 28 | 28 | 28 |
| 字数 | 8192 words | 8192 words | 8192 words |
| 字数代码 | 8000 | 8000 | 8000 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C |
| 组织 | 8KX8 | 8KX8 | 8KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DIP | DIP | DIP |
| 封装等效代码 | DIP28,.6 | DIP28,.6 | DIP28,.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE |
| 电源 | 5 V | 5 V | 5 V |
| 编程电压 | 12.5 V | 12.5 V | 12.5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO |
| 技术 | MOS | MOS | MOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL |
| 厂商名称 | - | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd |
