型号
- 型号
- 关键词
| 型号 | MSM27C256ZB-RS | MSM27C256-10RS | MSM27C256-15RS | MSM27C256-20RS |
|---|---|---|---|---|
| 描述 | OTP ROM, 32KX8, 150ns, CMOS, PDIP28 | OTP ROM, 32KX8, 100ns, CMOS, PDIP28 | OTP ROM, 32KX8, 150ns, CMOS, PDIP28 | OTP ROM, 32KX8, 200ns, CMOS, PDIP28 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 |
| Reach Compliance Code | unknown | unknow | unknown | unknown |
| 最长访问时间 | 150 ns | 100 ns | 150 ns | 200 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 内存密度 | 262144 bit | 262144 bi | 262144 bit | 262144 bit |
| 内存宽度 | 8 | 8 | 8 | 8 |
| 端子数量 | 28 | 28 | 28 | 28 |
| 字数 | 32768 words | 32768 words | 32768 words | 32768 words |
| 字数代码 | 32000 | 32000 | 32000 | 32000 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | 5 V |
| 编程电压 | 12.5 V | 12.5 V | 12.5 V | 12.5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大待机电流 | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
| 最大压摆率 | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| Objectid | 101148639 | - | 101148638 | 101148675 |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 |
