型号
- 型号
- 关键词
| 型号 | MSM514101-80ZS | MSM514101-70RS | MSM514101-70ZS | MSM514101-10JS | MSM514101-70JS |
|---|---|---|---|---|---|
| 描述 | Nibble Mode DRAM, 4MX1, 80ns, CMOS, PZIP20 | Nibble Mode DRAM, 4MX1, 70ns, CMOS, PDIP18 | Nibble Mode DRAM, 4MX1, 70ns, CMOS, PZIP20 | Nibble Mode DRAM, 4MX1, 100ns, CMOS, PDSO20 | Nibble Mode DRAM, 4MX1, 70ns, CMOS, PDSO20 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | ZIP, ZIP20,.1 | DIP, DIP18,.4 | ZIP, ZIP20,.1 | SOJ, SOJ20/26,.4 | SOJ, SOJ20/26,.4 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknow |
| 最长访问时间 | 80 ns | 70 ns | 70 ns | 100 ns | 70 ns |
| I/O 类型 | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE |
| JESD-30 代码 | R-PZIP-T20 | R-PDIP-T18 | R-PZIP-T20 | R-PDSO-J20 | R-PDSO-J20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bi |
| 内存集成电路类型 | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM |
| 内存宽度 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 18 | 20 | 20 | 20 |
| 字数 | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words |
| 字数代码 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 4MX1 | 4MX1 | 4MX1 | 4MX1 | 4MX1 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | ZIP | DIP | ZIP | SOJ | SOJ |
| 封装等效代码 | ZIP20,.1 | DIP18,.4 | ZIP20,.1 | SOJ20/26,.4 | SOJ20/26,.4 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 1024 | 1024 | 1024 | 1024 | 1024 |
| 最大待机电流 | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A |
| 最大压摆率 | 0.09 mA | 0.1 mA | 0.1 mA | 0.08 mA | 0.1 mA |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | ZIG-ZAG | DUAL | ZIG-ZAG | DUAL | DUAL |
| 厂商名称 | LAPIS Semiconductor Co Ltd | - | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd |
