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MSM51V16165F-60JS

描述:
EDO DRAM, 1MX16, 60ns, CMOS, PDSO42, 0.400 INCH, 1.27 MM PITCH, PLASTIC, SOJ-42
分类:
存储    存储   
文件大小:
235KB,共15页
制造商:
概述
EDO DRAM, 1MX16, 60ns, CMOS, PDSO42, 0.400 INCH, 1.27 MM PITCH, PLASTIC, SOJ-42
器件参数
参数名称
属性值
厂商名称
LAPIS Semiconductor Co Ltd
零件包装代码
SOJ
包装说明
SOJ,
针数
42
Reach Compliance Code
unknown
ECCN代码
EAR99
访问模式
FAST PAGE WITH EDO
最长访问时间
60 ns
其他特性
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 代码
R-PDSO-J42
长度
27.3 mm
内存密度
16777216 bit
内存集成电路类型
EDO DRAM
内存宽度
16
功能数量
1
端口数量
1
端子数量
42
字数
1048576 words
字数代码
1000000
工作模式
ASYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
1MX16
封装主体材料
PLASTIC/EPOXY
封装代码
SOJ
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
认证状态
Not Qualified
座面最大高度
3.75 mm
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
3 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子形式
J BEND
端子节距
1.27 mm
端子位置
DUAL
宽度
10.16 mm
文档预览
FEDD51V16165F-02
1
Semiconductor
MSM51V16165F
DESCRIPTION
This version: May 2001
Previous version : Nov. 2000
1,048,576-Word
×
16-Bit DYNAMIC RAM : FAST PAGE MODE TYPE WITH EDO
The MSM51V16165F is a 1,048,576-word
×
16-bit dynamic RAM fabricated in Oki’s silicon-gate
CMOS technology. The MSM51V16165F achieves high integration, high-speed operation, and low-
power consumption because Oki manufactures the device in a quadruple-layer polysilicon/double-layer
metal CMOS process. The MSM51V16165F is available in a 42-pin plastic SOJ or 50/44-pin plastic
TSOP.
FEATURES
1,048,576-word
×
16-bit configuration
Single 3.3V power supply,
±0.3V
tolerance
Input : LVTTL compatible, low input capacitance
Output : LVTTL compatible, 3-state
Refresh : 4096 cycles/64ms
Fast page mode with EDO, read modify write capability
CAS
before
RAS
refresh, hidden refresh,
RAS-only
refresh capability
Packages
(
SOJ42-P-400-1.27
)
42-pin 400mil plastic SOJ
(Product : MSM51V16165F-xxJS)
50/44-pin 400mil plastic TSOP
(
TSOPII50/44-P-400-0.80-K
)
(Product : MSM51V16165F-xxTS-K)
xx indicates speed rank.
PRODUCT FAMILY
Access Time (Max.)
Family
t
RAC
50ns
60ns
70ns
t
AA
25ns
30ns
35ns
t
CAC
13ns
15ns
20ns
t
OEA
13ns
15ns
20ns
Cycle Time
(Min.)
84ns
104ns
124ns
Power Dissipation
Operating
(Max.)
270mW
252mW
234mW
Standby
(Max.)
1.8mW
MSM51V16165F
1/15
FEDD51V16165F-02
1
Semiconductor
MSM51V16165F
PIN CONFIGURATION (TOP VIEW)
V
CC
1
DQ1
2
DQ2
3
DQ3
4
DQ4
5
V
CC
6
DQ5 7
DQ6
8
DQ7
9
DQ8
10
NC
11
NC
12
WE
13
RAS
14
A11R
15
A10R
16
A0
17
A1
18
A2
19
A3
20
V
CC
21
42-Pin Plastic
SOJ
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
V
SS
DQ16
DQ15
DQ14
DQ13
V
SS
DQ12
DQ11
DQ10
DQ9
NC
LCAS
UCAS
OE
A9R
A8R
A7
A6
A5
A4
V
SS
V
CC
1
DQ1
2
DQ2
3
DQ3 4
DQ4 5
V
CC
6
DQ5 7
DQ6 8
DQ7 9
DQ8
10
NC
11
50
49
48
47
46
45
44
43
42
41
40
V
SS
DQ16
DQ15
DQ14
DQ13
V
SS
DQ12
DQ11
DQ10
DQ9
NC
NC
15
NC
16
WE
17
RAS
18
A11R
19
A10R
20
A0
21
A1
22
A2
23
A3
24
V
CC
25
36
35
34
33
32
31
30
29
28
27
26
NC
LCAS
UCAS
OE
A9R
A8R
A7
A6
A5
A4
V
SS
50/44-Pin Plastic TSOP
(K Type)
Pin Name
A0–A7, A8R–A11R
RAS
LCAS
UCAS
DQ1–DQ16
OE
WE
V
CC
V
SS
NC
Function
Address Input
Row Address Strobe
Lower Byte Column Address Strobe
Upper Byte Column Address Strobe
Data Input/Data Output
Output Enable
Write Enable
Power Supply (3.3V)
Ground (0V)
No Connection
Note : The same power supply voltage must be provided to every V
CC
pin, and the same GND voltage level must
be provided to every V
SS
pin.
2/15
FEDD51V16165F-02
1
Semiconductor
MSM51V16165F
BLOCK DIAGRAM
WE
RAS
LCAS
UCAS
Column
Address
Buffers
Internal
Address
Counter
Timing
Generator
I/O
Controller
I/O
Controller
8
8
Column Decoders
8
Output
Buffers
8
DQ1-DQ8
8
I/O
Selector
Input
Buffers
8
OE
A0-A7
Refresh
Control Clock
Sense Amplifiers
16
16
Input
Buffers
8
12
A8R-A11R
4
Row
Address
Buffers
12
Row
Deco-
ders
Word
Drivers
Memory
Cells
8
8
DQ9-DQ16
Output
Buffers
8
V
CC
On Chip
V
BB
Generator
On Chip
IV
CC
Generator
V
SS
FUNCTION TABLE
Input Pin
RAS
H
L
L
L
L
L
L
L
L
LCAS
*
H
L
H
L
L
H
L
L
UCAS
*
H
H
L
L
H
L
L
L
WE
*
*
H
H
H
L
L
L
H
OE
*
*
L
L
L
H
H
H
H
DQ Pin
Function Mode
DQ1-DQ8
High-Z
High-Z
D
OUT
High-Z
D
OUT
D
IN
Don’t Care
D
IN
High-Z
DQ9-DQ16
High-Z
High-Z
High-Z
D
OUT
D
OUT
Don’t Care
D
IN
D
IN
High-Z
Standby
Refresh
Lower Byte Read
Upper Byte Read
Word Read
Lower Byte Write
Upper Byte Write
Word Write
* : “H” or “L”
3/15
FEDD51V16165F-02
1
Semiconductor
MSM51V16165F
ELECTRICAL CHARACTERISTICS
ABSOLUTE MAXIMUM RATINGS
Parameter
Voltage on Any Pin Relative to V
SS
Voltage V
CC
Supply relative to V
SS
Short Circuit Output Current
Power Dissipation
Operating Temperature
Storage Temperature
Symbol
V
IN
, V
OUT
V
CC
I
OS
P
D*
T
opr
T
stg
Value
–0.5 to V
CC
+0.5
–0.5 to 4.6
50
1
0 to 70
–55 to 150
Unit
V
V
mA
W
°C
°C
*: Ta = 25°C
RECOMMENDED OPERATING CONDITIONS
(Ta = 0 to 70°C)
Parameter
Power Supply Voltage
Input High Voltage
Input Low Voltage
Symbol
V
CC
V
SS
V
IH
V
IL
Min.
3.0
0
2.0
0.3
*2
Typ.
3.3
0
Max.
3.6
0
V
CC
+ 0.3
*1
0.8
Unit
V
V
V
V
Notes: *1. The input voltage is V
CC
+ 1.0V when the pulse width is less than 20ns (the pulse width is with respect
to the point at which V
CC
is applied).
*2. The input voltage is V
SS
1.0V when the pulse width is less than 20ns (the pulse width respect to the
point at which V
SS
is applied).
PIN CAPACITANCE
(Vcc = 3.3V
±
0.3V, Ta = 25°C, f = 1 MHz)
Parameter
Input Capacitance (A0 – A7, A8R – A11R)
Input Capacitance
(RAS,
LCAS, UCAS, WE, OE)
Output Capacitance (DQ1 - DQ16)
Symbol
C
IN1
C
IN2
C
I/O
Min.
Max.
5
7
7
Unit
pF
pF
pF
4/15
FEDD51V16165F-02
1
Semiconductor
MSM51V16165F
DC CHARACTERISTICS
(V
CC
= 3.3V
±
0.3V, Ta = 0 to 70°C)
MSM51V16165 MSM51V16165 MSM51V16165
F-50
F-60
F-70
Unit Note
Min.
Output High Voltage
Output Low Voltage
Input Leakage
Current
Output Leakage
Current
Average Power
Supply Current
(Operating)
Power Supply
Current
(Standby)
Average Power
Supply Current
(RAS-only Refresh)
Power Supply
Current
(Standby)
Average Power
Supply Current
(CAS before
RAS
Refresh)
Average Power
Supply Current
(Fast Page Mode)
V
OH
V
OL
I
OH
=
−2.0mA
I
OL
= 2mA
0V
V
I
V
CC
+0.3V;
I
LI
All other pins not
under test = 0V
DQ disable
0V
V
O
V
CC
RAS, CAS
cycling,
t
RC
= Min.
RAS, CAS
= V
IH
I
CC2
RAS, CAS
V
CC
0.2V
RAS
cycling,
I
CC3
CAS
= V
IH
,
t
RC
= Min.
RAS
= V
IH
,
I
CC5
CAS
= V
IL
,
DQ = enable
RAS
= cycling,
CAS
before
RAS
RAS
= V
IL
,
I
CC7
CAS
cycling,
t
HPC
= Min.
75
70
65
mA
1,3
5
5
5
mA
1
75
70
65
mA
1,2
10
10
10
10
10
10
µA
2.4
0
Max.
V
CC
0.4
Min.
2.4
0
Max.
V
CC
0.4
Min.
2.4
0
Max.
V
CC
0.4
V
V
Parameter
Symbol
Condition
I
LO
10
10
10
10
10
10
µA
I
CC1
75
70
65
mA
1,2
2
0.5
2
0.5
2
mA
0.5
1
I
CC6
75
70
65
mA
1,2
Notes: 1. I
CC
Max. is specified as I
CC
for output open condition.
2. The address can be changed once or less while
RAS
= V
IL
.
3. The address can be changed once or less while
CAS
= V
IH
.
5/15
参数对比
与MSM51V16165F-60JS相近的元器件有:MSM51V16165F-70JS、MSM51V16165F-50JS。描述及对比如下:
型号 MSM51V16165F-60JS MSM51V16165F-70JS MSM51V16165F-50JS
描述 EDO DRAM, 1MX16, 60ns, CMOS, PDSO42, 0.400 INCH, 1.27 MM PITCH, PLASTIC, SOJ-42 EDO DRAM, 1MX16, 70ns, CMOS, PDSO42, 0.400 INCH, 1.27 MM PITCH, PLASTIC, SOJ-42 EDO DRAM, 1MX16, 50ns, CMOS, PDSO42, 0.400 INCH, 1.27 MM PITCH, PLASTIC, SOJ-42
厂商名称 LAPIS Semiconductor Co Ltd LAPIS Semiconductor Co Ltd LAPIS Semiconductor Co Ltd
零件包装代码 SOJ SOJ SOJ
包装说明 SOJ, SOJ, SOJ,
针数 42 42 42
Reach Compliance Code unknown unknown unknown
ECCN代码 EAR99 EAR99 EAR99
访问模式 FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO
最长访问时间 60 ns 70 ns 50 ns
其他特性 RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 代码 R-PDSO-J42 R-PDSO-J42 R-PDSO-J42
长度 27.3 mm 27.3 mm 27.3 mm
内存密度 16777216 bit 16777216 bit 16777216 bit
内存集成电路类型 EDO DRAM EDO DRAM EDO DRAM
内存宽度 16 16 16
功能数量 1 1 1
端口数量 1 1 1
端子数量 42 42 42
字数 1048576 words 1048576 words 1048576 words
字数代码 1000000 1000000 1000000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C
组织 1MX16 1MX16 1MX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SOJ SOJ SOJ
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
认证状态 Not Qualified Not Qualified Not Qualified
座面最大高度 3.75 mm 3.75 mm 3.75 mm
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 3 V 3 V 3 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES
技术 CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 J BEND J BEND J BEND
端子节距 1.27 mm 1.27 mm 1.27 mm
端子位置 DUAL DUAL DUAL
宽度 10.16 mm 10.16 mm 10.16 mm
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器件捷径:
00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W
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