型号
- 型号
- 关键词
| 型号 | MSM51V18165A-70TS-K | MSM51V18165A-60JS | MSM51V18165A-80TS-K |
|---|---|---|---|
| 描述 | EDO DRAM, 1MX16, 70ns, CMOS, PDSO44, | EDO DRAM, 1MX16, 60ns, CMOS, PDSO42, | EDO DRAM, 1MX16, 80ns, CMOS, PDSO44, |
| 厂商名称 | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd |
| 包装说明 | TSOP, TSOP44/50,.46,32 | SOJ, SOJ42,.44 | TSOP, TSOP44/50,.46,32 |
| Reach Compliance Code | unknown | unknown | unknow |
| 最长访问时间 | 70 ns | 60 ns | 80 ns |
| I/O 类型 | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PDSO-G44 | R-PDSO-J42 | R-PDSO-G44 |
| 内存密度 | 16777216 bit | 16777216 bit | 16777216 bi |
| 内存集成电路类型 | EDO DRAM | EDO DRAM | EDO DRAM |
| 内存宽度 | 16 | 16 | 16 |
| 端子数量 | 44 | 42 | 44 |
| 字数 | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 1000000 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C |
| 组织 | 1MX16 | 1MX16 | 1MX16 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSOP | SOJ | TSOP |
| 封装等效代码 | TSOP44/50,.46,32 | SOJ42,.44 | TSOP44/50,.46,32 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE |
| 电源 | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 1024 | 1024 | 1024 |
| 自我刷新 | NO | NO | NO |
| 最大待机电流 | 0.001 A | 0.001 A | 0.001 A |
| 最大压摆率 | 0.2 mA | 0.22 mA | 0.18 mA |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | GULL WING | J BEND | GULL WING |
| 端子节距 | 0.8 mm | 1.27 mm | 0.8 mm |
| 端子位置 | DUAL | DUAL | DUAL |
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工业自动化与控制
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Microchip MCU
FPGA/CPLD
机器人开发
