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MSM9803-XXXRS

描述:
Speech Synthesizer, 32.4s, PDIP18, 0.300 INCH, 2.54 MM PITCH, PLASTIC, DIP-18
分类:
文件大小:
425KB,共54页
制造商:
概述
Speech Synthesizer, 32.4s, PDIP18, 0.300 INCH, 2.54 MM PITCH, PLASTIC, DIP-18
器件参数
参数名称
属性值
厂商名称
LAPIS Semiconductor Co Ltd
零件包装代码
DIP
包装说明
DIP, DIP18,.3
针数
18
Reach Compliance Code
unknown
商用集成电路类型
SPEECH SYNTHESIZER
JESD-30 代码
R-PDIP-T18
长度
22.6 mm
功能数量
1
端子数量
18
片上内存类型
MASK ROM
最高工作温度
85 °C
最低工作温度
-40 °C
封装主体材料
PLASTIC/EPOXY
封装代码
DIP
封装等效代码
DIP18,.3
封装形状
RECTANGULAR
封装形式
IN-LINE
电源
2/5.5 V
认证状态
Not Qualified
最长读取时间
32.4 s
座面最大高度
5.08 mm
最大压摆率
10 mA
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
2 V
表面贴装
NO
温度等级
INDUSTRIAL
端子形式
THROUGH-HOLE
端子节距
2.54 mm
端子位置
DUAL
宽度
7.62 mm
文档预览
Dear customers,
About the change in the name such as "Oki Electric Industry Co. Ltd." and
"OKI" in documents to OKI Semiconductor Co., Ltd.
The semiconductor business of Oki Electric Industry Co., Ltd. was succeeded to OKI
Semiconductor Co., Ltd. on October 1, 2008.
Therefore, please accept that although
the terms and marks of "Oki Electric Industry Co., Ltd.", “Oki Electric”, and "OKI"
remain in the documents, they all have been changed to "OKI Semiconductor Co., Ltd.".
It is a change of the company name, the company trademark, and the logo, etc. , and
NOT a content change in documents.
October 1, 2008
OKI Semiconductor Co., Ltd.
550-1 Higashiasakawa-cho, Hachioji-shi, Tokyo 193-8550, Japan
http://www.okisemi.com/en/
OKI Semiconductor
MSM9802/03/05-xxx
Voice Synthesis IC with Built-in Mask ROM
FEDL9802-03-05-05
Issue Date: Nov. 4, 2003
GENERAL DESCRIPTION
The MSM9802/03/05 is a PCM voice synthesis IC with built-in mask ROM.
This IC has two user selectable playback algorithms, OKI Non-linear PCM and straight PCM. It also contains a
current mode 10-bit D/A converter and a low-pass filter.
External control has been made easy by the built-in edit ROM that can form sentences by linking phrases. By
using Oki's Sound Analysis and Editing Tool, ROM data such as Phrase Control Table can be easily set, created,
edited, and evaluated.
With the stand-alone mode/microcontroller interface mode switching pin, the MSM9802/03/05 can support
various applications.
FEATURES
Device
MSM9802
MSM9803
MSM9805
ROM size*
512Kbits
1Mbit
2Mbits
Speech period (sec)
f
SAM
= 4.0kHz
16.0
32.4
65.1
f
SAM
= 6.4kHz
10.0
20.2
40.7
f
SAM
= 8.0kHz
8.0
16.2
32.5
f
SAM
= 16.0kHz
4.0
8.1
16.2
*
Actual voice ROM area is smaller by 11 Kbits.
ROM custom
8-bit OKI nonlinear PCM method/8-bit straight PCM method
Built-in edit ROM
Random playback function
Sampling frequency
: 4.0 kHz/5.3 kHz/6.4 kHz/8.0 kHz/10.6 kHz/12.8 kHz/16.0 kHz
Note: If RC oscillation is selected, 10.6 kHz, 12.8 kHz, and 16.0 kHz
cannot be selected.
Maximum number of phrases
: 63 (Microcontroller interface mode)
56 (Stand-alone mode)
Built-in current mode 10-bit D/A converter
Built-in low-pass filter
Standby function
RC oscillation (256 kHz)/ceramic oscillation (4.096 MHz) selectable
Package options:
18-pin plastic DIP
(DIP18-P-300-2.54)
(MSM9802-xxxRS/MSM9803-xxxRS/
MSM9805-xxxRS)
24-pin plastic SOP (SOP24-P-430-1.27-K) (MSM9802-xxxGS-K/MSM9803-xxxGS-K/
MSM9805-xxxGS-K)
30-pin plastic SSOP (SSOP30-P-56-0.65-K) (MSM9802-xxxGS-AK/MSM9803-xxxGS-AK/
MSM9805-xxxGS-AK)
Chip
xxx indicates code number.
Note: This data sheet explains a stand-alone mode and a microcontroller interface mode, separately.
1/53
FEDL9802-03-05-05
OKI Semiconductor
MSM9802/03/05-xxx
CONTENTS
(1) STAND-ALONE MODE
BLOCK DIAGRAM ................................................................................................................................................3
PIN CONFIGURATION .........................................................................................................................................4
PIN DESCRIPTIONS ..............................................................................................................................................6
ABSOLUTE MAXIMUM RATINGS .....................................................................................................................8
RECOMMENDED OPERATING CONDITIONS..................................................................................................8
ELECTRICAL CHARACTERISTICS ....................................................................................................................9
TIMING DIAGRAMS...........................................................................................................................................12
FUNCTIONAL DESCRIPTION ...........................................................................................................................14
Playback Code Specification............................................................................................................................14
Pull-up/Pull-down Resistor ..............................................................................................................................14
Stand-alone Mode.............................................................................................................................................14
APPLICATION CIRCUITS ..................................................................................................................................19
(2) MICROCONTROLLER INTERFACE MODE
BLOCK DIAGRAM ..............................................................................................................................................21
PIN CONFIGURATION .......................................................................................................................................22
PIN DESCRIPTIONS ............................................................................................................................................24
ABSOLUTE MAXIMUM RATINGS ...................................................................................................................25
RECOMMENDED OPERATING CONDITIONS................................................................................................25
ELECTRICAL CHARACTERISTICS ..................................................................................................................26
TIMING DIAGRAMS...........................................................................................................................................29
FUNCTIONAL DESCRIPTION ...........................................................................................................................31
1. Playback Code Specification........................................................................................................................31
2. Address Data ................................................................................................................................................31
3. Stop Code .....................................................................................................................................................32
4. Generating Pseudo -
BUSY
Signal through NAR pin ..................................................................................33
APPLICATION CIRCUIT ....................................................................................................................................34
(3) COMMON
Sampling Frequency.........................................................................................................................................35
Recording/Playback Time ................................................................................................................................35
Playback Method..............................................................................................................................................36
Phrase Control Table ........................................................................................................................................37
CR Oscillation ..................................................................................................................................................39
Determining CR Contents ................................................................................................................................40
Ceramic Oscillation..........................................................................................................................................40
Low-pass Filter.................................................................................................................................................42
Standby Transition ...........................................................................................................................................43
Voice Output Unit Equivalent Circuit (AOUT, VREF Pins) ...........................................................................44
D/A CONVERTER CURRENT CHARACTERISTICS .......................................................................................45
PAD CONFIGURATION......................................................................................................................................46
PACKAGE DIMENSIONS ...................................................................................................................................49
2/53
OKI Semiconductor
BLOCK DIAGRAM
A2
A1
A0
SW2
SW1
SW0
Address &
Switching
Controller
8
6
16-Bit (MSM9802)
17-Bit (MSM9803)
18-Bit (MSM9805)
Multiplexer
512-Kbit (MSM9802)
1-Mbit (MSM9803)
2-Mbit (MSM9805)
ROM
(Including 11 Kbits of
Edit ROM & Address ROM)
CPU/STD
Random
Circuit
16-Bit (MSM9802)
17-Bit (MSM9803)
18-Bit (MSM9805)
Address Counter
DATA
Controller
RND
PCM
Synthesizer
(1) STAND-ALONE MODE (CPU/STD: "L" LEVEL)
BUSY
I/O
Interface
10
OSC1
OSC
XT/CR
Timing Controller
OSC2
OSC3/TEST
10-Bit
DAC
&
LPF
FEDL9802-03-05-05
MSM9802/03/05-xxx
XT/CR
RESET
V
DD
GND
V
REF
AOUT
3/53
FEDL9802-03-05-05
OKI Semiconductor
MSM9802/03/05-xxx
PIN CONFIGURATION (TOP VIEW)
A0
1
A1
2
A2
3
RESET
4
XT/CR
5
BUSY
6
GND
7
V
REF
8
AOUT
9
18
SW2
17
SW1
16
SW0
15
RND
14
CPU/STD
13
OSC3/TEST
12
OSC2
11
OSC1
10
V
DD
18-Pin Plastic DIP
Note: Applicable to MSM9802-xxxRS, MSM9803-xxxRS, and MSM9805-xxxRS.
V
DD
1
OSC1
2
OSC2
3
NC
4
OSC3/TEST
5
NC
6
CPU/STD
7
RND
8
NC
9
SW0
10
SW1
11
SW2
12
NC: No connection
24
AOUT
23
V
REF
22
GND
21
NC
20
BUSY
19
NC
18
XT/CR
17
RESET
16
NC
15
A2
14
A1
13
A0
24-Pin Plastic SOP
Note: Applicable to MSM9802-xxxGS-K, MSM9803-xxxGS-K, and MSM9805-xxxGS-K.
4/53
参数对比
与MSM9803-XXXRS相近的元器件有:MSM9803-XXXGS-AK、MSM9803-XXXGS-K、MSM9805-XXXGS-K、MSM9805-XXXGS-AK、MSM9805-XXXRS、MSM9802-XXXGS-AK、MSM9802-XXXGS-K、MSM9802-XXXRS。描述及对比如下:
型号 MSM9803-XXXRS MSM9803-XXXGS-AK MSM9803-XXXGS-K MSM9805-XXXGS-K MSM9805-XXXGS-AK MSM9805-XXXRS MSM9802-XXXGS-AK MSM9802-XXXGS-K MSM9802-XXXRS
描述 Speech Synthesizer, 32.4s, PDIP18, 0.300 INCH, 2.54 MM PITCH, PLASTIC, DIP-18 Speech Synthesizer, 32.4s, PDSO30, 5.60 MM, 0.65 MM PITCH, PLASTIC, SSOP-30 Speech Synthesizer, 32.4s, PDSO24, 0.430 INCH, 1.27 MM PITCH, PLASTIC, SOP-24 Speech Synthesizer, 65.1s, PDSO24, 0.430 INCH, 1.27 MM PITCH, PLASTIC, SOP-24 Speech Synthesizer, 65.1s, PDSO30, 5.60 MM, 0.65 MM PITCH, PLASTIC, SSOP-30 Speech Synthesizer, 65.1s, PDIP18, 0.300 INCH, 2.54 MM PITCH, PLASTIC, DIP-18 Speech Synthesizer, 16s, PDSO30, 5.60 MM, 0.65 MM PITCH, PLASTIC, SSOP-30 Speech Synthesizer, 16s, PDSO24, 0.430 INCH, 1.27 MM PITCH, PLASTIC, SOP-24 Speech Synthesizer, 16s, PDIP18, 0.300 INCH, 2.54 MM PITCH, PLASTIC, DIP-18
厂商名称 LAPIS Semiconductor Co Ltd LAPIS Semiconductor Co Ltd LAPIS Semiconductor Co Ltd LAPIS Semiconductor Co Ltd LAPIS Semiconductor Co Ltd LAPIS Semiconductor Co Ltd LAPIS Semiconductor Co Ltd LAPIS Semiconductor Co Ltd LAPIS Semiconductor Co Ltd
零件包装代码 DIP SSOP SOIC SOIC SSOP DIP SSOP SOIC DIP
包装说明 DIP, DIP18,.3 SSOP, SSOP30,.3 SOP, SOP24,.5 SOP, SOP24,.5 SSOP, SSOP30,.3 DIP, DIP18,.3 SSOP, SSOP30,.3 SOP, SOP24,.5 DIP, DIP18,.3
针数 18 30 24 24 30 18 30 24 18
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
商用集成电路类型 SPEECH SYNTHESIZER SPEECH SYNTHESIZER SPEECH SYNTHESIZER SPEECH SYNTHESIZER SPEECH SYNTHESIZER SPEECH SYNTHESIZER SPEECH SYNTHESIZER SPEECH SYNTHESIZER SPEECH SYNTHESIZER
JESD-30 代码 R-PDIP-T18 R-PDSO-G30 R-PDSO-G24 R-PDSO-G24 R-PDSO-G30 R-PDIP-T18 R-PDSO-G30 R-PDSO-G24 R-PDIP-T18
长度 22.6 mm 9.7 mm 15.95 mm 15.95 mm 9.7 mm 22.6 mm 9.7 mm 15.95 mm 22.6 mm
功能数量 1 1 1 1 1 1 1 1 1
端子数量 18 30 24 24 30 18 30 24 18
片上内存类型 MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM MASK ROM
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 DIP SSOP SOP SOP SSOP DIP SSOP SOP DIP
封装等效代码 DIP18,.3 SSOP30,.3 SOP24,.5 SOP24,.5 SSOP30,.3 DIP18,.3 SSOP30,.3 SOP24,.5 DIP18,.3
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH IN-LINE SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE IN-LINE
电源 2/5.5 V 2/5.5 V 2/5.5 V 2/5.5 V 2/5.5 V 2/5.5 V 2/5.5 V 2/5.5 V 2/5.5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
最长读取时间 32.4 s 32.4 s 32.4 s 65.1 s 65.1 s 65.1 s 16 s 16 s 16 s
座面最大高度 5.08 mm 1.85 mm 2.5 mm 2.5 mm 1.85 mm 5.08 mm 1.85 mm 2.5 mm 5.08 mm
最大压摆率 10 mA 16 mA 10 mA 10 mA 16 mA 10 mA 16 mA 10 mA 10 mA
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 2 V 2 V 2 V 2 V 2 V 2 V 2 V 2 V 2 V
表面贴装 NO YES YES YES YES NO YES YES NO
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 THROUGH-HOLE GULL WING GULL WING GULL WING GULL WING THROUGH-HOLE GULL WING GULL WING THROUGH-HOLE
端子节距 2.54 mm 0.65 mm 1.27 mm 1.27 mm 0.65 mm 2.54 mm 0.65 mm 1.27 mm 2.54 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
宽度 7.62 mm 5.6 mm 7.9 mm 7.9 mm 5.6 mm 7.62 mm 5.6 mm 7.9 mm 7.62 mm
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