256Mb: x4, x8, x16 SDRAM
Features
SDR SDRAM
MT48LC64M4A2 – 16 Meg x 4 x 4 banks
MT48LC32M8A2 – 8 Meg x 8 x 4 banks
MT48LC16M16A2 – 4 Meg x 16 x 4 banks
Features
•
PC100- and PC133-compliant
•
Fully synchronous; all signals registered on positive
edge of system clock
•
Internal, pipelined operation; column address can
be changed every clock cycle
•
Internal banks for hiding row access/precharge
•
Programmable burst lengths: 1, 2, 4, 8, or full page
•
Auto precharge, includes concurrent auto pre-
charge and auto refresh modes
•
Self refresh mode (not available on AT devices)
•
Auto refresh
–
64ms, 8192-cycle (commercial and industrial)
–
16ms, 8192-cycle (automotive)
•
LVTTL-compatible inputs and outputs
•
Single +3.3V ±0.3V power supply
Table 1: Address Table
Parameter
Configuration
Refresh count
Row addressing
Bank addressing
Column
addressing
64 Meg x 4 32 Meg x 8
16 Meg x 4
x 4 banks
8K
8K A[12:0]
4 BA[1:0]
2K A[9:0],
A11
8 Meg x 8 x
4 banks
8K
8K A[12:0]
4 BA[1:0]
1K A[9:0]
16 Meg
x 16
4 Meg x 16
x 4 banks
8K
8K A[12:0]
4 BA[1:0]
512 A[8:0]
Options
•
Configurations
–
64 Meg x 4 (16 Meg x 4 x 4 banks)
–
32 Meg x 8 (8 Meg x 8 x 4 banks)
–
16 Meg x 16 (4 Meg x 16 x 4 banks)
•
Write recovery (
t
WR)
–
t
WR = 2 CLK
1
•
Plastic package – OCPL
2
–
54-pin TSOP II OCPL
2
(400 mil)
(standard)
–
54-pin TSOP II OCPL
2
(400 mil)
Pb-free
–
60-ball FBGA (x4, x8) (8mm x 16mm)
–
60-ball FBGA (x4, x8) (8mm x 16mm)
Pb-free
–
54-ball VFBGA (x16) (8mm x 14 mm)
–
54-ball VFBGA (x16) (8mm x 14 mm)
Pb-free
•
Timing – cycle time
–
6ns @ CL = 3 (x8, x16 only)
–
7.5ns @ CL = 3 (PC133)
–
7.5ns @ CL = 2 (PC133)
•
Self refresh
–
Standard
–
Low power
•
Operating temperature range
–
Commercial (0˚C to +70˚C)
–
Industrial (–40˚C to +85˚C)
–
Automotive (–40˚C to +105˚C)
•
Revision
Notes:
Marking
64M4
32M8
16M16
A2
TG
P
FB
BB
FG
BG
-6A
-75
-7E
None
L
3
None
IT
AT
3
:D
Table 2: Key Timing Parameters
CL = CAS (READ) latency
Speed
Grade
-6A
-7E
-75
-7E
-75
Clock
Frequency
167 MHz
143 MHz
133 MHz
133 MHz
100 MHz
Setup
CL = 2 CL = 3 Time
–
–
–
5.4ns
6ns
5.4ns
5.4ns
5.4ns
–
–
1.5ns
1.5ns
1.5ns
1.5ns
1.5ns
Access Time
Hold
Time
0.8ns
0.8ns
0.8ns
0.8ns
0.8ns
1. See Micron technical note TN-48-05 on
Micron's Web site.
2. Off-center parting line.
3. Contact Micron for availability.
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. N 1/10 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
1999 Micron Technology, Inc. All rights reserved.
256Mb: x4, x8, x16 SDRAM
Features
Table 3: 256Mb SDR Part Numbering
Part Numbers
MT48LC64M4A2TG
MT48LC64M4A2P
MT48LC64M4A2FB
1
MT48LC64M4A2BB
1
MT48LC32M8A2TG
MT48LC32M8A2P
MT48LC32M8A2FB
1
MT48LC32M8A2BB
1
MT48LC16M16A2TG
MT48LC16M16A2P
MT48LC16M16A2FG
MT48LC16M16A2BG
Note:
Architecture
64 Meg x 4
64 Meg x 4
64 Meg x 4
64 Meg x 4
32 Meg x 8
32 Meg x 8
32 Meg x 8
32 Meg x 8
16 Meg x 16
16 Meg x 16
16 Meg x 16
16 Meg x 16
Package
54-pin TSOP II
54-pin TSOP II
60-ball FBGA
60-ball FBGA
54-pin TSOP II
54-pin TSOP II
60-ball FBGA
60-ball FBGA
54-pin TSOP II
54-pin TSOP II
54-ball FBGA
54-ball FBGA
1. Actual FBGA part marking is shown in Package Dimensions (page 16).
FBGA Part Marking Decoder
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. Micron’s FBGA part marking decoder is available at
www.micron.com/decoder.
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. N 1/10 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
1999 Micron Technology, Inc. All rights reserved.
256Mb: x4, x8, x16 SDRAM
General Description ......................................................................................................................................... 8
Automotive Temperature ............................................................................................................................. 8
Functional Block Diagrams ............................................................................................................................... 9
Pin and Ball Assignments and Descriptions ..................................................................................................... 12
Package Dimensions ...................................................................................................................................... 16
Temperature and Thermal Impedance ............................................................................................................ 19
Electrical Specifications .................................................................................................................................. 22
Electrical Specifications – I
DD
Parameters ........................................................................................................ 24
Electrical Specifications – AC Operating Conditions ......................................................................................... 26
Functional Description ................................................................................................................................... 31
Commands .................................................................................................................................................... 32
COMMAND INHIBIT .................................................................................................................................. 32
NO OPERATION (NOP) .............................................................................................................................. 33
LOAD MODE REGISTER (LMR) ................................................................................................................... 33
ACTIVE ...................................................................................................................................................... 33
READ ......................................................................................................................................................... 34
WRITE ....................................................................................................................................................... 35
PRECHARGE .............................................................................................................................................. 36
BURST TERMINATE ................................................................................................................................... 36
AUTO REFRESH ......................................................................................................................................... 37
SELF REFRESH ........................................................................................................................................... 37
Truth Tables ................................................................................................................................................... 38
Initialization .................................................................................................................................................. 43
Mode Register ................................................................................................................................................ 46
Burst Length .............................................................................................................................................. 48
Burst Type ................................................................................................................................................. 48
CAS Latency ............................................................................................................................................... 50
Operating Mode ......................................................................................................................................... 50
Write Burst Mode ....................................................................................................................................... 50
Bank/Row Activation ...................................................................................................................................... 51
READ Operation ............................................................................................................................................. 52
WRITE Operation ........................................................................................................................................... 61
Burst Read/Single Write .............................................................................................................................. 68
PRECHARGE Operation .................................................................................................................................. 69
Auto Precharge ........................................................................................................................................... 69
AUTO REFRESH Operation ............................................................................................................................. 81
SELF REFRESH Operation .............................................................................................................................. 83
Power-Down .................................................................................................................................................. 85
Clock Suspend ............................................................................................................................................... 86
Revision History ............................................................................................................................................. 89
Rev. N – 1/10 .............................................................................................................................................. 89
Rev. M – 11/08 ............................................................................................................................................ 89
Rev. L – 8/07 ............................................................................................................................................... 89
Rev. K – 2/07 .............................................................................................................................................. 90
Rev. K – 6/06 .............................................................................................................................................. 90
Rev. J – 3/05 ............................................................................................................................................... 90
Rev. H – 2/05 .............................................................................................................................................. 90
Rev. H – 10/04 ............................................................................................................................................ 90
Rev. G – 8/03 .............................................................................................................................................. 90
Rev. F – 1/03 ............................................................................................................................................... 90
Contents
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. N 1/10 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
1999 Micron Technology, Inc. All rights reserved.
256Mb: x4, x8, x16 SDRAM
Rev. E – 3/02 ...............................................................................................................................................
Rev. D – 7/01 ..............................................................................................................................................
Rev. C – 3/01 ..............................................................................................................................................
Rev. B – 10/00 .............................................................................................................................................
Rev. A – 11/99 .............................................................................................................................................
91
91
91
92
92
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. N 1/10 EN
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
1999 Micron Technology, Inc. All rights reserved.
256Mb: x4, x8, x16 SDRAM
Table 1: Address Table .................................................................................................................................... 1
Table 2: Key Timing Parameters ...................................................................................................................... 1
Table 3: 256Mb SDR Part Numbering ............................................................................................................... 2
Table 4: Pin and Ball Descriptions .................................................................................................................. 15
Table 5: Temperature Limits .......................................................................................................................... 19
Table 6: Thermal Impedance Simulated Values .............................................................................................. 20
Table 7: Absolute Maximum Ratings .............................................................................................................. 22
Table 8: DC Electrical Characteristics and Operating Conditions ..................................................................... 22
Table 9: Capacitance ..................................................................................................................................... 23
Table 10: I
DD
Specifications and Conditions (-6A) ........................................................................................... 24
Table 11: I
DD
Specifications and Conditions (-7E, -75) .................................................................................... 24
Table 12: Electrical Characteristics and Recommended AC Operating Conditions (-6A) ................................... 26
Table 13: Electrical Characteristics and Recommended AC Operating Conditions (-7E, -75) ............................. 27
Table 14: AC Functional Characteristics (-6A) ................................................................................................. 28
Table 15: AC Functional Characteristics (-7E, -75) .......................................................................................... 29
Table 16: Truth Table – Commands and DQM Operation ................................................................................ 32
Table 17: Truth Table – Current State Bank
n,
Command to Bank
n
................................................................. 38
Table 18: Truth Table – Current State Bank n, Command to Bank
m
................................................................ 40
Table 19: Truth Table – CKE .......................................................................................................................... 42
Table 20: Burst Definition Table .................................................................................................................... 49
List of Tables
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. N 1/10 EN
5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
1999 Micron Technology, Inc. All rights reserved.
