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MT48LC4M32B2B5-6A XIT:L

DRAM Chip SDRAM 128Mbit 4Mx32 3.3V 90-Pin VFBGA

厂商名称:Micron Technology

厂商官网:http://www.mdtic.com.tw/

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器件参数
参数名称
属性值
欧盟限制某些有害物质的使用
Compliant
ECCN (US)
EAR99
Part Status
Active
HTS
8542.32.00.24
DRAM Type
SDRAM
Chip Density (bit)
128M
Organization
4Mx32
Number of Internal Banks
4
Number of Words per Bank
1M
Number of Bits/Word (bit)
32
Data Bus Width (bit)
32
Maximum Clock Rate (MHz)
166
Maximum Access Time (ns)
17|7.5|5.4
Address Bus Width (bit)
14
Process Technology
CMOS
接口类型
Interface Type
LVTTL
Minimum Operating Supply Voltage (V)
3
Typical Operating Supply Voltage (V)
3.3
Maximum Operating Supply Voltage (V)
3.6
Operating Current (mA)
120
Minimum Operating Temperature (°C)
-40
Maximum Operating Temperature (°C)
85
Supplier Temperature Grade
Industrial
Number of I/O Lines (bit)
32
Supplier Package
VFBGA
Pin Count
90
Standard Package Name
BGA
Mounting
Surface Mount
Package Height
0.65
Package Length
13
Package Width
8
PCB changed
90
Lead Shape
Ball
参考设计
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128Mb: x32 Automotive SDRAM
Features
Automotive SDR SDRAM
MT48LC4M32B2 – 1 Meg x 32 x 4 Banks
Features
• PC100-compliant
• Fully synchronous; all signals registered on positive
edge of system clock
• Internal pipelined operation; column address can
be changed every clock cycle
• Internal banks for hiding row access/precharge
• Programmable burst lengths: 1, 2, 4, 8, or full page
• Auto precharge, includes concurrent auto precharge
and auto refresh modes
• Self refresh mode (not available on AT devices)
• Auto refresh
– 64ms, 4096-cycle refresh (commercial and
industrial)
– 16ms, 4096-cycle refresh (automotive)
• LVTTL-compatible inputs and outputs
• Single 3.3V ±0.3V power supply
• Supports CAS latency (CL) of 1, 2, and 3
• AEC-Q100
• PPAP submission
• 8D response time
Options
• Configuration
– 4 Meg x 32 (1 Meg x 32 x 4 banks)
• Package – OCPL
1
– 86-pin TSOP II (400 mil)
– 86-pin TSOP II (400 mil) Pb-free
– 90-ball VFBGA (8mm x 13mm)
– 90-ball VFBGA (8mm x 13mm) Pb-
free
• Timing (cycle time)
– 6ns (167 MHz)
– 6ns (167 MHz)
– 7ns (143 MHz)
• Revision
• Special options
– Automotive grade
– Product longevity program
• Operating temperature range
– Industrial (–40°C to +85°C)
– Automotive (–40°C to +105°C)
Notes:
1.
2.
3.
4.
Marking
4M32B2
TG
P
F5
B5
-6A
3
-6
2
-7
2
:G/:L
A
4
X
IT
AT
5
Off-center parting line.
Available only on Revision G.
Available only on Revision L.
Some automotive parts are included in the
product longevity program (PLP) and some
are not, see www.micron.com/plp for a list
of PLP parts.
5. Contact Micron for availability.
Table 1: Key Timing Parameters
CL = CAS (READ) latency
Speed Grade
-6
-6A
-7
Clock
Frequency (MHz)
167
167
143
Target
t
RCD-
t
RP-CL
3-3-3
3-3-3
3-3-3
t
RCD
(ns)
t
RP
(ns)
CL (ns)
18
18
15
18
18
15
18
18
15
PDF: 09005aef84ee4811
128mb_x32_ait-aat_sdram.pdf - Rev. C 4/16 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
128Mb: x32 Automotive SDRAM
Features
Table 2: Address Table
Parameter
Configuration
Refresh count
Row addressing
Bank addressing
Column addressing
4 Meg x 32
1 Meg x 32 x 4 banks
4K
4K A[11:0]
4 BA[1:0]
256 A[7:0]
Table 3: 128Mb (x32) SDR Part Numbering
Part Numbers
MT48LC4M32B2TG
MT48LC4M32B2P
MT48LC4M32B2F5
1
MT48LC4M32B2B5
1
Note:
1. FBGA Device Decoder: www.micron.com/decoder.
Architecture
4 Meg x 32
4 Meg x 32
4 Meg x 32
4 Meg x 32
PDF: 09005aef84ee4811
128mb_x32_ait-aat_sdram.pdf - Rev. C 4/16 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
128Mb: x32 Automotive SDRAM
Features
Contents
General Description ......................................................................................................................................... 7
Automotive Temperature .............................................................................................................................. 7
Functional Block Diagram ................................................................................................................................ 8
Pin and Ball Assignments and Descriptions ....................................................................................................... 9
Package Dimensions ....................................................................................................................................... 12
Temperature and Thermal Impedance ............................................................................................................ 14
Electrical Specifications .................................................................................................................................. 17
Electrical Specifications – I
DD
Parameters ........................................................................................................ 18
Electrical Specifications – AC Operating Conditions ......................................................................................... 20
Functional Description ................................................................................................................................... 23
Commands .................................................................................................................................................... 24
COMMAND INHIBIT .................................................................................................................................. 24
NO OPERATION (NOP) ............................................................................................................................... 25
LOAD MODE REGISTER (LMR) ................................................................................................................... 25
ACTIVE ...................................................................................................................................................... 25
READ ......................................................................................................................................................... 26
WRITE ....................................................................................................................................................... 27
PRECHARGE .............................................................................................................................................. 28
BURST TERMINATE ................................................................................................................................... 28
REFRESH ................................................................................................................................................... 29
AUTO REFRESH ..................................................................................................................................... 29
SELF REFRESH ....................................................................................................................................... 29
Truth Tables ................................................................................................................................................... 30
Initialization .................................................................................................................................................. 35
Mode Register ................................................................................................................................................ 37
Burst Length .............................................................................................................................................. 39
Burst Type .................................................................................................................................................. 39
CAS Latency ............................................................................................................................................... 41
Operating Mode ......................................................................................................................................... 41
Write Burst Mode ....................................................................................................................................... 41
Bank/Row Activation ...................................................................................................................................... 42
READ Operation ............................................................................................................................................. 43
WRITE Operation ........................................................................................................................................... 52
Burst Read/Single Write .............................................................................................................................. 59
PRECHARGE Operation .................................................................................................................................. 60
Auto Precharge ........................................................................................................................................... 60
AUTO REFRESH Operation ............................................................................................................................. 72
SELF REFRESH Operation ............................................................................................................................... 74
Power-Down .................................................................................................................................................. 76
Clock Suspend ............................................................................................................................................... 77
Revision History ............................................................................................................................................. 80
Rev. C – 04/16 ............................................................................................................................................. 80
Rev. B – 10/13 ............................................................................................................................................. 80
Rev. A – 10/12 ............................................................................................................................................. 80
PDF: 09005aef84ee4811
128mb_x32_ait-aat_sdram.pdf - Rev. C 4/16 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
128Mb: x32 Automotive SDRAM
Features
List of Figures
Figure 1: 4 Meg x 32 Functional Block Diagram ................................................................................................. 8
Figure 2: 86-Pin TSOP Pin Assignments (Top View) ........................................................................................... 9
Figure 3: 90-Ball FBGA Ball Assignments (Top View) ....................................................................................... 10
Figure 4: 86-Pin Plastic TSOP II (400 mil) – Package Codes TG/P ...................................................................... 12
Figure 5: 90-Ball VFBGA (8mm x 13mm) ......................................................................................................... 13
Figure 6: Example: Temperature Test Point Location, 54-Pin TSOP (Top View) ................................................. 15
Figure 7: Example: Temperature Test Point Location, 90-Ball VFBGA (Top View) .............................................. 16
Figure 8: ACTIVE Command .......................................................................................................................... 25
Figure 9: READ Command ............................................................................................................................. 26
Figure 10: WRITE Command ......................................................................................................................... 27
Figure 11: PRECHARGE Command ................................................................................................................ 28
Figure 12: Initialize and Load Mode Register .................................................................................................. 36
Figure 13: Mode Register Definition ............................................................................................................... 38
Figure 14: CAS Latency .................................................................................................................................. 41
Figure 15: Example: Meeting
t
RCD (MIN) When 2 <
t
RCD (MIN)/
t
CK < 3 .......................................................... 42
Figure 16: Consecutive READ Bursts .............................................................................................................. 44
Figure 17: Random READ Accesses ................................................................................................................ 45
Figure 18: READ-to-WRITE ............................................................................................................................ 46
Figure 19: READ-to-WRITE With Extra Clock Cycle ......................................................................................... 47
Figure 20: READ-to-PRECHARGE .................................................................................................................. 47
Figure 21: Terminating a READ Burst ............................................................................................................. 48
Figure 22: Alternating Bank Read Accesses ..................................................................................................... 49
Figure 23: READ Continuous Page Burst ......................................................................................................... 50
Figure 24: READ – DQM Operation ................................................................................................................ 51
Figure 25: WRITE Burst ................................................................................................................................. 52
Figure 26: WRITE-to-WRITE .......................................................................................................................... 53
Figure 27: Random WRITE Cycles .................................................................................................................. 54
Figure 28: WRITE-to-READ ............................................................................................................................ 54
Figure 29: WRITE-to-PRECHARGE ................................................................................................................. 55
Figure 30: Terminating a WRITE Burst ............................................................................................................ 56
Figure 31: Alternating Bank Write Accesses ..................................................................................................... 57
Figure 32: WRITE – Continuous Page Burst ..................................................................................................... 58
Figure 33: WRITE – DQM Operation ............................................................................................................... 59
Figure 34: READ With Auto Precharge Interrupted by a READ ......................................................................... 61
Figure 35: READ With Auto Precharge Interrupted by a WRITE ........................................................................ 62
Figure 36: READ With Auto Precharge ............................................................................................................ 63
Figure 37: READ Without Auto Precharge ....................................................................................................... 64
Figure 38: Single READ With Auto Precharge .................................................................................................. 65
Figure 39: Single READ Without Auto Precharge ............................................................................................. 66
Figure 40: WRITE With Auto Precharge Interrupted by a READ ........................................................................ 67
Figure 41: WRITE With Auto Precharge Interrupted by a WRITE ...................................................................... 67
Figure 42: WRITE With Auto Precharge ........................................................................................................... 68
Figure 43: WRITE Without Auto Precharge ..................................................................................................... 69
Figure 44: Single WRITE With Auto Precharge ................................................................................................. 70
Figure 45: Single WRITE Without Auto Precharge ............................................................................................ 71
Figure 46: Auto Refresh Mode ........................................................................................................................ 73
Figure 47: Self Refresh Mode .......................................................................................................................... 75
Figure 48: Power-Down Mode ........................................................................................................................ 76
Figure 49: Clock Suspend During WRITE Burst ............................................................................................... 77
Figure 50: Clock Suspend During READ Burst ................................................................................................. 78
PDF: 09005aef84ee4811
128mb_x32_ait-aat_sdram.pdf - Rev. C 4/16 EN
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
128Mb: x32 Automotive SDRAM
Features
Figure 51: Clock Suspend Mode ..................................................................................................................... 79
PDF: 09005aef84ee4811
128mb_x32_ait-aat_sdram.pdf - Rev. C 4/16 EN
5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
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参数对比
与MT48LC4M32B2B5-6A XIT:L相近的元器件有:MT48LC4M32B2B5-6A AAT:L、MT48LC4M32B2B5-6A AAT:L TR、MT48LC4M32B2P-6A IT:L、MT48LC4M32B2P-6A XIT:L。描述及对比如下:
型号 MT48LC4M32B2B5-6A XIT:L MT48LC4M32B2B5-6A AAT:L MT48LC4M32B2B5-6A AAT:L TR MT48LC4M32B2P-6A IT:L MT48LC4M32B2P-6A XIT:L
描述 DRAM Chip SDRAM 128Mbit 4Mx32 3.3V 90-Pin VFBGA DRAM Chip SDRAM 128Mbit 4Mx32 3.3V Automotive 90-Pin VFBGA DRAM Chip SDRAM 128Mbit 4Mx32 3.3V Automotive 90-Pin VFBGA DRAM Chip SDRAM 128Mbit 4Mx32 3.3V 86-Pin TSOP-II DRAM Chip SDRAM 128Mbit 4Mx32 3.3V 86-Pin TSOP-II
欧盟限制某些有害物质的使用 Compliant Compliant Compliant Compliant Compliant
ECCN (US) EAR99 EAR99 EAR99 EAR99 EAR99
Part Status Active Active Active LTB Obsolete
DRAM Type SDRAM SDRAM SDRAM SDRAM SDRAM
Chip Density (bit) 128M 128M 128M 128M 128M
Organization 4Mx32 4Mx32 4Mx32 4Mx32 4Mx32
Number of Internal Banks 4 4 4 4 4
Number of Words per Bank 1M 1M 1M 1M 1M
Number of Bits/Word (bit) 32 32 32 32 32
Data Bus Width (bit) 32 32 32 32 32
Maximum Clock Rate (MHz) 166 166 166 166 166
Maximum Access Time (ns) 17|7.5|5.4 5.4|7.5|17 5.4|7.5|17 5.5|7.5|17 17|5.4|7.5
Address Bus Width (bit) 14 14 14 14 14
接口类型
Interface Type
LVTTL LVTTL LVTTL LVTTL LVTTL
Minimum Operating Supply Voltage (V) 3 3 3 3 3
Typical Operating Supply Voltage (V) 3.3 3.3 3.3 3.3 3.3
Maximum Operating Supply Voltage (V) 3.6 3.6 3.6 3.6 3.6
Operating Current (mA) 120 120 120 120 120
Minimum Operating Temperature (°C) -40 -40 -40 -40 -40
Maximum Operating Temperature (°C) 85 105 105 85 85
Supplier Temperature Grade Industrial Automotive Automotive Industrial Industrial
Number of I/O Lines (bit) 32 32 32 32 32
Supplier Package VFBGA VFBGA VFBGA TSOP-II TSOP-II
Pin Count 90 90 90 86 86
Standard Package Name BGA BGA BGA SOP SOP
Mounting Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package Height 0.65 0.65 0.65 1(Max) 1(Max)
Package Length 13 13 13 22.22 22.22
Package Width 8 8 8 10.16 10.16
PCB changed 90 90 90 86 86
Lead Shape Ball Ball Ball Gull-wing Gull-wing
HTS 8542.32.00.24 8542.32.00.02 - 8542.32.00.02 8542.32.00.02
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