Fast Page DRAM, 4MX1, 70ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, TSOP-26/20
厂商名称:Micron Technology
厂商官网:http://www.mdtic.com.tw/
下载文档型号 | MT4C1004JTG-7STR | MT4C1004JDJ-7S | MT4C1004JDJ-7STR | MT4C1004JTG-6STR | MT4C1004JTG-7S | MT4C1004JDJ-6STR | MT4C1004JDJ-6S | MT4C1004JTG-6S |
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描述 | Fast Page DRAM, 4MX1, 70ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, TSOP-26/20 | Fast Page DRAM, 4MX1, 70ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-26/20 | Fast Page DRAM, 4MX1, 70ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-26/20 | Fast Page DRAM, 4MX1, 60ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, TSOP-26/20 | Fast Page DRAM, 4MX1, 70ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, TSOP-26/20 | Fast Page DRAM, 4MX1, 60ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-26/20 | Fast Page DRAM, 4MX1, 60ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-26/20 | Fast Page DRAM, 4MX1, 60ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, TSOP-26/20 |
厂商名称 | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
零件包装代码 | TSOP | SOJ | SOJ | TSOP | TSOP | SOJ | SOJ | TSOP |
包装说明 | TSOP2, | 0.300 INCH, PLASTIC, SOJ-26/20 | SOJ, | TSOP2, | 0.300 INCH, PLASTIC, TSOP-26/20 | SOJ, | 0.300 INCH, PLASTIC, SOJ-26/20 | 0.300 INCH, PLASTIC, TSOP-26/20 |
针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | not_compliant | not_compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
最长访问时间 | 70 ns | 70 ns | 70 ns | 60 ns | 70 ns | 60 ns | 60 ns | 60 ns |
其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
JESD-30 代码 | R-PDSO-G20 | R-PDSO-J20 | R-PDSO-J20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-J20 | R-PDSO-J20 | R-PDSO-G20 |
长度 | 17.14 mm | 17.17 mm | 17.17 mm | 17.14 mm | 17.14 mm | 17.17 mm | 17.17 mm | 17.14 mm |
内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
内存集成电路类型 | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM |
内存宽度 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
字数 | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words |
字数代码 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 4MX1 | 4MX1 | 4MX1 | 4MX1 | 4MX1 | 4MX1 | 4MX1 | 4MX1 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSOP2 | SOJ | SOJ | TSOP2 | TSOP2 | SOJ | SOJ | TSOP2 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 |
座面最大高度 | 1.2 mm | 3.61 mm | 3.61 mm | 1.2 mm | 1.2 mm | 3.61 mm | 3.61 mm | 1.2 mm |
自我刷新 | YES | YES | YES | YES | YES | YES | YES | YES |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | GULL WING | J BEND | J BEND | GULL WING | GULL WING | J BEND | J BEND | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 7.62 mm | 7.67 mm | 7.67 mm | 7.62 mm | 7.62 mm | 7.67 mm | 7.67 mm | 7.62 mm |
JESD-609代码 | e0 | e0 | - | e0 | e0 | - | e0 | e0 |
端子面层 | TIN LEAD | Tin/Lead (Sn/Pb) | - | TIN LEAD | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |