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MT58L64L18FT-7.5

64K X 18 CACHE SRAM, 7.5 ns, PQFP100, PLASTIC, MS-026BHA, TQFP-100

器件类别:存储    存储   

厂商名称:Rochester Electronics

厂商官网:https://www.rocelec.com/

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器件参数
参数名称
属性值
零件包装代码
QFP
包装说明
LQFP,
针数
100
Reach Compliance Code
unknown
最长访问时间
7.5 ns
JESD-30 代码
R-PQFP-G100
长度
20 mm
内存密度
1179648 bit
内存集成电路类型
CACHE SRAM
内存宽度
18
功能数量
1
端子数量
100
字数
65536 words
字数代码
64000
工作模式
SYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
64KX18
封装主体材料
PLASTIC/EPOXY
封装代码
LQFP
封装形状
RECTANGULAR
封装形式
FLATPACK, LOW PROFILE
并行/串行
PARALLEL
认证状态
COMMERCIAL
座面最大高度
1.6 mm
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
3.135 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子形式
GULL WING
端子节距
0.65 mm
端子位置
QUAD
宽度
14 mm
Base Number Matches
1
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NOT RECOMENDED FOR NEW DESIGNS
1Mb: 64K x 18, 32K x 32/36
3.3V I/O, FLOW-THROUGH SYNCBURST SRAM
1Mb SYNCBURST
SRAM
FEATURES
• Fast clock and OE# access times
• Single +3.3V +0.3V/-0.165V power supply (V
DD
)
• Separate +3.3V +0.3V/-0.165V isolated output
buffer supply (V
DD
Q)
• SNOOZE MODE for reduced-power standby
• Common data inputs and data outputs
• Individual BYTE WRITE control and GLOBAL
WRITE
• Three chip enables for simple depth expansion
and address pipelining
• Clock-controlled and registered addresses, data
I/Os and control signals
• Internally self-timed WRITE cycle
• Burst control pin (interleaved or linear burst)
• Automatic power-down for portable applications
• 100-lead TQFP package for high density, high
speed SRAMs
• Low capacitive bus loading
• x18, x32, and x36 versions available
MT58L64L18F, MT58L32L32F,
MT58L32L36F
3.3V V
DD
, 3.3V I/O, Flow-Through
100-Pin TQFP*
*JEDEC-standard MS-026 BHA (LQFP).
OPTIONS
• Timing (Access/Cycle/MHz)
7.5ns/8.8ns/113 MHz
8.5ns/10ns/100 MHz
10ns/15ns/66 MHz
• Configurations
64K x 18
32K x 32
32K x 36
• Package
100-pin TQFP
• Operating Temperature Range
Commercial (0ºC to +70ºC)
Part Number Example:
MARKING
-7.5
-8.5
-10
MT58L64L18F
MT58L32L32F
MT58L32L36F
T
None
MT58L32L36FT-10
GENERAL DESCRIPTION
The Micron
®
SyncBurst
SRAM family employs
high-speed, low-power CMOS designs that are fabri-
cated using an advanced CMOS process.
The MT58L64L18F and MT58L32L32/36F 1Mb
SRAMs integrate a 64K x 18, 32K x 32, or 32K x 36 SRAM
core with advanced synchronous peripheral circuitry
and a 2-bit burst counter. All synchronous inputs pass
through registers controlled by a positive-edge-trig-
1Mb: 64K x 18, 32K x 32/36 3.3V I/O, Flow-Through SyncBurst SRAM
MT58L64L18F_B.p65 – Rev. B, Pub. 11/02
gered single clock input (CLK). The synchronous in-
puts include all addresses, all data inputs, active LOW
chip enable (CE#), two additional chip enables for easy
depth expansion (CE2, CE2#), burst control inputs
(ADSC#, ADSP#, ADV#), byte write enables (BWx#) and
global write (GW#).
Asynchronous inputs include the output enable
(OE#), snooze enable (ZZ) and clock (CLK). There is
also a burst mode pin (MODE) that selects between
interleaved and linear burst modes. The data-out (Q),
enabled by OE#, is also asynchronous. WRITE cycles
can be from one to two bytes wide (x18) or from one to
four bytes wide (x32/x36), as controlled by the write
control inputs.
Burst operation can be initiated with either address
status processor (ADSP#) or address status controller
(ADSC#) input pins. Subsequent burst addresses can
be internally generated as controlled by the burst ad-
vance pin (ADV#).
Address and write control are registered on-chip to
simplify WRITE cycles. This allows self-timed WRITE
cycles. Individual byte enables allow individual bytes
to be written.
During WRITE cycles on the x18 device, BWa# con-
trols DQa pins and DQPa; BWb# controls DQb pins and
DQPb. During WRITE cycles on the x32 and x36 de-
vices, BWa# controls DQa pins and DQPa; BWb# con-
1
©2002, Micron Technology, Inc.
PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE SUBJECT TO CHANGE BY MICRON WITHOUT NOTICE.
NOT RECOMENDED FOR NEW DESIGNS
1Mb: 64K x 18, 32K x 32/36
3.3V I/O, FLOW-THROUGH SYNCBURST SRAM
FUNCTIONAL BLOCK DIAGRAM
64K x 18
16
SA0, SA1, SA
MODE
ADV#
CLK
ADDRESS
REGISTER
16
14
16
2
SA0-SA1
SA1'
BINARY Q1
COUNTER AND
LOGIC
CLR
Q0
SA0'
ADSC#
ADSP#
BYTE “b”
WRITE REGISTER
9
BYTE “b”
WRITE DRIVER
9
64K x 9 x 2
MEMORY
ARRAY
9
18
SENSE 18
AMPS
OUTPUT
BUFFERS
18
BWb#
BWa#
BWE#
GW#
CE#
CE2
CE2#
OE#
BYTE “a”
WRITE REGISTER
9
BYTE “a”
WRITE DRIVER
DQs
DQPa
DQPb
ENABLE
REGISTER
18
INPUT
REGISTERS
2
FUNCTIONAL BLOCK DIAGRAM
32K x 32/36
15
SA0, SA1, SA
MODE
ADV#
CLK
BINARY Q1
SA1'
COUNTER
AND LOGIC
Q0
CLR
SA0'
ADDRESS
REGISTER
15
SA0-SA1
13
15
ADSC#
ADSP#
BWd#
BYTE “d”
WRITE REGISTER
BYTE “c”
WRITE REGISTER
BYTE
“d”
WRITE DRIVER
BYTE
“c”
WRITE DRIVER
BYTE
“b”
WRITE DRIVER
BYTE
“a”
WRITE DRIVER
INPUT
REGISTERS
32K x 8 x 4
(x32)
32K x 9 x 4
(x36)
SENSE
AMPS
OUTPUT
BUFFERS
BWc#
DQs
BWb#
BYTE “b”
WRITE REGISTER
MEMORY
ARRAY
BWa#
BWE#
GW#
CE#
CE2
CE2#
OE#
BYTE “a”
WRITE REGISTER
ENABLE
REGISTER
4
NOTE:
Functional Block Diagrams illustrate simplified device operation. See Truth Table, Pin Descriptions and timing diagrams for
detailed information.
1Mb: 64K x 18, 32K x 32/36 3.3V I/O, Flow-Through SyncBurst SRAM
MT58L64L18F_B.p65 – Rev. B, Pub. 11/02
2
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2002, Micron Technology, Inc.
NOT RECOMENDED FOR NEW DESIGNS
1Mb: 64K x 18, 32K x 32/36
3.3V I/O, FLOW-THROUGH SYNCBURST SRAM
GENERAL DESCRIPTION (continued)
trols DQb pins and DQPb; BWc# controls DQc pins and
DQPc; BWd# controls DQd pins and DQPd. GW# LOW
causes all bytes to be written. Parity bits are only avail-
able on the x18 and x36 versions.
Micron’s 1Mb SyncBurst SRAMs operate from a +3.3V
power supply, and all inputs and outputs are TTL-com-
patible. The device is ideally suited for 486, Pentium
®
,
680X0 and PowerPC systems and systems that benefit
from a very wide data bus. The device is also ideal in
generic 16-, 18-, 32-, 36-, 64- and 72-bit-wide applica-
tions.
Please refer to Micron’s Web site (www.micron.com/
sramds)
for the latest data sheet.
TQFP PIN ASSIGNMENT TABLE
PIN #
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
x32/x36
NC/DQPc**
DQc
DQc
V
DD
Q
V
SS
NC
DQc
NC
DQc
DQb
DQc
DQb
DQc
V
SS
V
DD
Q
DQb
DQc
DQb
DQc
V
SS
V
DD
NC
V
SS
DQb
DQd
DQb
DQd
V
DD
Q
V
SS
DQb
DQd
DQb
DQd
DQPb
DQd
NC
DQd
x18
NC
NC
NC
PIN #
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
x18
x32/x36
V
SS
V
DD
Q
NC
DQd
NC
DQd
NC
NC/DQPd**
MODE
SA
SA
SA
SA
SA1
SA0
DNU
DNU
V
SS
V
DD
DNU
DNU
SA
SA
SA
SA
SA
NC/SA*
NC/SA*
PIN #
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
x32/x36
NC/DQPa**
DQa
DQa
V
DD
Q
V
SS
NC
DQa
NC
DQa
DQa
DQa
V
SS
V
DD
Q
DQa
DQa
ZZ
V
DD
NC
V
SS
DQa
DQb
DQa
DQb
V
DD
Q
V
SS
DQa
DQb
DQa
DQb
DQPa
DQb
NC
DQb
x18
NC
NC
NC
PIN #
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
x18
x32/x36
V
SS
V
DD
Q
DQb
DQb
NC/DQPb**
SA
SA
ADV#
ADSP#
ADSC#
OE#
BWE#
GW#
CLK
V
SS
V
DD
CE2#
BWa#
BWb#
BWc#
BWd#
CE2
CE#
SA
SA
NC
NC
SA
NC
NC
* Pins 49 and 50 are reserved for address expansion.
** No Connect (NC) is used on the x32 version. Parity (DQPx) is used on the x36 version.
1Mb: 64K x 18, 32K x 32/36 3.3V I/O, Flow-Through SyncBurst SRAM
MT58L64L18F_B.p65 – Rev. B, Pub. 11/02
3
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2002, Micron Technology, Inc.
NOT RECOMENDED FOR NEW DESIGNS
1Mb: 64K x 18, 32K x 32/36
3.3V I/O, FLOW-THROUGH SYNCBURST SRAM
PIN ASSIGNMENT (Top View)
100-Pin TQFP
(D-1)
SA
NC
NC
V
DD
Q
V
SS
NC
DQPa
DQa
DQa
V
SS
V
DD
Q
DQa
DQa
V
SS
NC
V
DD
ZZ
DQa
DQa
V
DD
Q
V
SS
DQa
DQa
NC
NC
V
SS
V
DD
Q
NC
NC
NC
SA
SA
ADV#
ADSP#
ADSC#
OE#
BWE#
GW#
CLK
V
SS
V
DD
CE2#
BWa#
BWb#
NC
NC
CE2
CE#
SA
SA
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
50
81
49
82
48
83
47
84
46
85
45
86
44
87
43
88
42
89
41
90
40
91
39
92
38
93
37
94
36
95
35
96
34
97
33
98
32
99
31
100
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
x18
NC/SA*
NC/SA*
SA
SA
SA
SA
SA
DNU
DNU
V
DD
V
SS
DNU
DNU
SA0
SA1
SA
SA
SA
SA
MODE
SA
SA
ADV#
ADSP#
ADSC#
OE#
BWE#
GW#
CLK
V
SS
V
DD
CE2#
BWa#
BWb#
BWc#
BWd#
CE2
CE#
SA
SA
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
50
81
49
82
48
83
47
84
46
85
45
86
44
87
43
88
42
89
41
90
40
91
39
92
38
93
37
94
36
95
35
96
34
97
33
98
32
99
31
100
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
NC/DQPb**
DQb
DQb
V
DD
Q
V
SS
DQb
DQb
DQb
DQb
V
SS
V
DD
Q
DQb
DQb
V
SS
NC
V
DD
ZZ
DQa
DQa
V
DD
Q
V
SS
DQa
DQa
DQa
DQa
V
SS
V
DD
Q
DQa
DQa
NC/DQPa**
NC
NC
NC
V
DD
Q
V
SS
NC
NC
DQb
DQb
V
SS
V
DD
Q
DQb
DQb
V
SS
V
DD
NC
V
SS
DQb
DQb
V
DD
Q
V
SS
DQb
DQb
DQPb
NC
V
SS
V
DD
Q
NC
NC
NC
x32/x36
NC/SA*
NC/SA*
SA
SA
SA
SA
SA
DNU
DNU
V
DD
V
SS
DNU
DNU
SA0
SA1
SA
SA
SA
SA
MODE
* Pins 49 and 50 are reserved for address expansion.
**No Connect (NC) is used on the x32 version. Parity (DQPx) is used on the x36 version.
1Mb: 64K x 18, 32K x 32/36 3.3V I/O, Flow-Through SyncBurst SRAM
MT58L64L18F_B.p65 – Rev. B, Pub. 11/02
NC/DQPc**
DQc
DQc
V
DD
Q
V
SS
DQc
DQc
DQc
DQc
V
SS
V
DD
Q
DQc
DQc
V
SS
V
DD
NC
V
SS
DQd
DQd
V
DD
Q
V
SS
DQd
DQd
DQd
DQd
V
SS
V
DD
Q
DQd
DQd
NC/DQPd**
4
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2002, Micron Technology, Inc.
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参数对比
与MT58L64L18FT-7.5相近的元器件有:MT58L32L36FT-10、MT58L64L18FT-10、MT58L64L18FT-8.5、MT58L32L32FT-8.5、MT58L32L32FT-10。描述及对比如下:
型号 MT58L64L18FT-7.5 MT58L32L36FT-10 MT58L64L18FT-10 MT58L64L18FT-8.5 MT58L32L32FT-8.5 MT58L32L32FT-10
描述 64K X 18 CACHE SRAM, 7.5 ns, PQFP100, PLASTIC, MS-026BHA, TQFP-100 32K X 36 CACHE SRAM, 10 ns, PQFP100, PLASTIC, MS-026BHA, TQFP-100 64KX18 CACHE SRAM, 10ns, PQFP100, PLASTIC, MS-026BHA, TQFP-100 64K X 18 CACHE SRAM, 8.5 ns, PQFP100, PLASTIC, MS-026BHA, TQFP-100 32K X 32 CACHE SRAM, 8.5 ns, PQFP100, PLASTIC, MS-026BHA, TQFP-100 32K X 32 CACHE SRAM, 10 ns, PQFP100, PLASTIC, MS-026BHA, TQFP-100
零件包装代码 QFP QFP QFP QFP QFP QFP
包装说明 LQFP, LQFP, LQFP, LQFP, LQFP, LQFP,
针数 100 100 100 100 100 100
Reach Compliance Code unknown unknown unknown unknown unknown unknown
最长访问时间 7.5 ns 10 ns 10 ns 8.5 ns 8.5 ns 10 ns
JESD-30 代码 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100
长度 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm
内存密度 1179648 bit 1179648 bit 1179648 bit 1179648 bit 1048576 bit 1048576 bit
内存集成电路类型 CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM
功能数量 1 1 1 1 1 1
端子数量 100 100 100 100 100 100
字数 65536 words 32768 words 65536 words 65536 words 32768 words 32768 words
字数代码 64000 32000 64000 64000 32000 32000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
组织 64KX18 32KX36 64KX18 64KX18 32KX32 32KX32
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LQFP LQFP LQFP LQFP LQFP LQFP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
认证状态 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
座面最大高度 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD
宽度 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
内存宽度 18 36 18 18 - -
厂商名称 - Rochester Electronics - Rochester Electronics Rochester Electronics Rochester Electronics
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MSP430F6638系统版
刚申请了两块6638的样片,想问一下各位谁有6638系统版的pcb,这样就不用再动动手画了…… MS...
黑桃K 微控制器 MCU
pads9.5安装的时候出现No license was found for feature pwrshell. 求助
PADS9.5安装成功后,出现 No license was found for feature p...
zhangjr PCB设计
为什么我的ShellExecute不认呢?
在EVC下面新建立了一个新的工程,想使用ShellExecute来调用一个文件,可是却出现了Shel...
wfy3200590 嵌入式系统
DVD不讀MPEG-4而其他功能正常和RF IC品質有關聯嗎?
我認為DVD機台不讀MPEG-4與RF IC品質是有關聯的,我的理由如下: 1.MPE...
zenger708 RF/无线
有成都的兄弟么,说说成都那块WINCE的情况
那边做WINCE的公司多不?主要做哪些产品? 有哪些比较好的? 做应用和做驱动的,薪资大概啥行情呀?...
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