型号
- 型号
- 关键词
| 型号 | N08L1618C2AB-85I | N08L1618C2AB2-70I | N08L1618C2AB2-85I | N08L1618C2AB-70I |
|---|---|---|---|---|
| 描述 | Standard SRAM, 512KX16, 85ns, CMOS, PBGA42, BGA-42 | Standard SRAM, 512KX16, 70ns, CMOS, PBGA42, GREEN, BGA-42 | Standard SRAM, 512KX16, 85ns, CMOS, PBGA42, GREEN, BGA-42 | Standard SRAM, 512KX16, 70ns, CMOS, PBGA42, BGA-42 |
| 是否Rohs认证 | 不符合 | 符合 | 符合 | 不符合 |
| 厂商名称 | AMI Semiconductor | AMI Semiconductor | AMI Semiconductor | AMI Semiconductor |
| 包装说明 | BGA-42 | GREEN, BGA-42 | GREEN, BGA-42 | BGA-42 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 最长访问时间 | 85 ns | 70 ns | 85 ns | 70 ns |
| JESD-30 代码 | R-PBGA-B42 | R-PBGA-B42 | R-PBGA-B42 | R-PBGA-B42 |
| JESD-609代码 | e0 | e1 | e1 | e0 |
| 长度 | 10 mm | 10 mm | 10 mm | 10 mm |
| 内存密度 | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 42 | 42 | 42 | 42 |
| 字数 | 524288 words | 524288 words | 524288 words | 524288 words |
| 字数代码 | 512000 | 512000 | 512000 | 512000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 512KX16 | 512KX16 | 512KX16 | 512KX16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TFBGA | TFBGA | TFBGA | TFBGA |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 240 | 260 | 260 | 240 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 2.2 V | 2.2 V | 2.2 V | 2.2 V |
| 最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | TIN LEAD | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | TIN LEAD |
| 端子形式 | BALL | BALL | BALL | BALL |
| 端子节距 | 0.75 mm | 0.75 mm | 0.75 mm | 0.75 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | 30 | 40 | 40 | 30 |
| 宽度 | 8 mm | 8 mm | 8 mm | 8 mm |