首页 > 器件类别 > 嵌入式处理器和控制器 > 微控制器和处理器

NE80567KE025015

Microprocessor, 64-Bit, 667MHz, CMOS, CPGA611, 113 X 48.26 MM, PPGA-611

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:Intel(英特尔)

厂商官网:http://www.intel.com/

器件标准:

下载文档
器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
Intel(英特尔)
零件包装代码
PGA
包装说明
SPGA,
针数
611
Reach Compliance Code
compliant
ECCN代码
3A001.A.3
地址总线宽度
64
位大小
64
边界扫描
NO
最大时钟频率
1660 MHz
外部数据总线宽度
128
格式
FLOATING POINT
集成缓存
YES
JESD-30 代码
R-CPGA-P611
长度
113 mm
低功率模式
YES
端子数量
611
封装主体材料
CERAMIC, METAL-SEALED COFIRED
封装代码
SPGA
封装形状
RECTANGULAR
封装形式
GRID ARRAY, SHRINK PITCH
座面最大高度
5.668 mm
速度
667 MHz
表面贴装
NO
技术
CMOS
端子形式
PIN/PEG
端子节距
1.27 mm
端子位置
PERPENDICULAR
宽度
48.26 mm
uPs/uCs/外围集成电路类型
MICROPROCESSOR
文档预览
Dual-Core Intel
®
Itanium
®
Processor
9000 and 9100 Series
Dual-Core Intel
®
Itanium
®
Processor 1.6 GHz with 24 MB L3 Cache 9050
Dual-Core Intel
®
Itanium
®
Processor 1.6 GHz with 18 MB L3 Cache 9040
Dual-Core Intel
®
Itanium
®
Processor 1.6 GHz with 8 MB L3 Cache 9030
Dual-Core Intel
®
Itanium
®
Processor 1.42 GHz with 12 MB L3 Cache 9020
Dual-Core Intel
®
Itanium
®
Processor 1.4 GHz with 12 MB L3 Cache 9015
Intel
®
Itanium
®
Processor 1.6 GHz with 6 MB L3 Cache 9010
Dual-Core Intel® Itanium® Processor 1.66/1.6 GHz with 24 MB L3 Cache 9152
Dual-Core Intel
®
Itanium
®
Processor 1.66 GHz with 24 MB L3 Cache 9150M
Dual-Core Intel
®
Itanium
®
Processor 1.6 GHz with 24 MB L3 Cache 9150N
Dual-Core Intel
®
Itanium
®
Processor 1.66 GHz with 18 MB L3 Cache 9140M
Dual-Core Intel
®
Itanium
®
Processor 1.6 GHz with 18 MB L3 Cache 9140N
Dual-Core Intel
®
Itanium
®
Processor 1.42 GHz with 12 MB L3 Cache 9120N
Dual-Core Intel
®
Itanium
®
Processor 1.66 GHz with 8 MB L3 Cache 9130M
Intel
®
Itanium
®
Processor 1.6 GHz with 12 MB L3 Cache 9110N
Datasheet
October 2007
Document Number: 314054-002
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL
®
PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,
BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS
PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER,
AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING
LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY
PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving,
life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel
reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to them
The Dual-Core Intel
®
Itanium
®
9000 and 9100 series processor may contain design defects or errors known as errata which may
cause the product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained
by calling1-800-548-4725, or by visiting Intel's website at http://www.intel.com.
Intel, Itanium, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United
States and other countries.
Copyright © 2002-2007, Intel Corporation
*Other names and brands may be claimed as the property of others.
I2C is a two-wire communication bus /protocol developed by Phillips. SMBus is a subset of the I2C bus/protocol developed by Intel.
Implementation of the I2C bus/protocol or the SMBus bus/protocol may require licenses from various entities, including Phillips
Electronics, N.V. and North American Phillips Corporation.
2
Dual-Core Intel
®
Itanium
®
Processor 9000 and 9100 Series Datasheet
Contents
1
Introduction............................................................................................................... 11
1.1
Overview ......................................................................................................... 11
1.2
Processor Abstraction Layer ................................................................................ 11
1.3
Mixing Processors of Different Frequencies and Cache Sizes .................................... 12
1.4
Terminology ..................................................................................................... 12
1.5
State of Data .................................................................................................... 12
1.6
Reference Documents ........................................................................................ 13
Electrical Specifications ............................................................................................... 15
2.1
Dual-Core Intel
®
Itanium
®
Processor 9000 and 9100 Series System Bus .................. 15
2.1.1
System Bus Power Pins ........................................................................ 15
2.1.2
System Bus No Connect ....................................................................... 15
2.2
System Bus Signals ........................................................................................... 15
2.2.1
Signal Groups ..................................................................................... 15
2.2.2
Signal Descriptions .............................................................................. 17
2.3
Package Specifications ....................................................................................... 18
2.4
Signal Specifications .......................................................................................... 18
2.4.1
Maximum Ratings ................................................................................ 22
2.5
System Bus Signal Quality Specifications and Measurement Guidelines ..................... 23
2.5.1
Overshoot/Undershoot Magnitude .......................................................... 23
2.5.2
Overshoot/Undershoot Pulse Duration .................................................... 24
2.5.3
Activity Factor..................................................................................... 24
2.5.4
Reading Overshoot/Undershoot Specification Tables ................................. 24
2.5.5
Determining if a System Meets the Overshoot/Undershoot
Specifications...................................................................................... 25
2.5.6
Wired-OR Signals ................................................................................ 25
2.6
Voltage Regulator Connector Signals.................................................................... 27
2.7
System Bus Clock and Processor Clocking............................................................. 31
2.8
Recommended Connections for Unused Pins.......................................................... 33
Pinout Specifications ................................................................................................... 35
Mechanical Specifications............................................................................................. 65
4.1
Processor Package Dimensions ............................................................................ 65
4.1.1
Voltage Regulator (MVR) to Processor Package Interface........................... 71
4.2
Package Marking ............................................................................................... 72
4.2.1
Processor Top-Side Marking .................................................................. 72
4.2.2
Processor Bottom-Side Marking ............................................................. 73
Thermal Specifications ................................................................................................ 75
5.1
Thermal Features .............................................................................................. 75
5.1.1
Thermal Alert...................................................................................... 75
5.1.2
Enhanced Thermal Management ............................................................ 76
5.1.3
Power Trip .......................................................................................... 76
5.1.4
Thermal Trip ....................................................................................... 76
5.2
Case Temperature ............................................................................................. 76
System Management Feature Specifications ................................................................... 79
6.1
System Management Bus ................................................................................... 79
6.1.1
System Management Bus Interface ........................................................ 79
6.1.2
System Management Interface Signals ................................................... 79
6.1.3
SMBus Device Addressing ..................................................................... 81
6.2
Processor Information ROM ................................................................................ 82
6.3
Scratch EEPROM ............................................................................................... 85
2
3
4
5
6
Dual-Core Intel
®
Itanium
®
Processor 9000 and 9100 Series Datasheet
3
6.4
6.5
6.6
6.7
Processor Information ROM and Scratch EEPROM Supported SMBus
Transactions .....................................................................................................85
Thermal Sensing Device .....................................................................................86
Thermal Sensing Device Supported SMBus Transactions..........................................87
Thermal Sensing Device Registers........................................................................88
6.7.1
Thermal Reference Registers .................................................................88
6.7.2
Thermal Limit Registers ........................................................................89
6.7.3
Status Register ....................................................................................89
6.7.4
Configuration Register ..........................................................................89
6.7.5
Conversion Rate Register ......................................................................90
A
Signals Reference .......................................................................................................91
A.1
Alphabetical Signals Reference ............................................................................91
A.1.1 A[49:3]# (I/O).......................................................................................91
A.1.2 A20M# (I) .............................................................................................91
A.1.3 ADS# (I/O)............................................................................................91
A.1.4 AP[1:0]# (I/O).......................................................................................91
A.1.5 ASZ[1:0]# (I/O).....................................................................................91
A.1.6 ATTR[3:0]# (I/O) ...................................................................................92
A.1.7 BCLKp/BCLKn (I) ....................................................................................92
A.1.8 BE[7:0]# (I/O).......................................................................................92
A.1.9 BERR# (I/O) ..........................................................................................93
A.1.10 BINIT# (I/O)..........................................................................................94
A.1.11 BNR# (I/O)............................................................................................94
A.1.12 BPM[5:0]# (I/O) ....................................................................................94
A.1.13 BPRI# (I) ..............................................................................................94
A.1.14 BR[0]# (I/O) and BR[3:1]# (I).................................................................94
A.1.15 BREQ[3:0]# (I/O)...................................................................................95
A.1.16 CCL# (I/O) ............................................................................................96
A.1.17 CPUPRES# (O) .......................................................................................96
A.1.18 D[127:0]# (I/O).....................................................................................96
A.1.19 D/C# (I/O) ............................................................................................96
A.1.20 DBSY# (I/O) ..........................................................................................96
A.1.21 DBSY_C1# (O) .......................................................................................96
A.1.22 DBSY_C2# (O) .......................................................................................96
A.1.23 DEFER# (I) ............................................................................................96
A.1.24 DEN# (I/O)............................................................................................97
A.1.25 DEP[15:0]# (I/O) ...................................................................................97
A.1.26 DHIT# (I) ..............................................................................................97
A.1.27 DPS# (I/O) ............................................................................................98
A.1.28 DRDY# (I/O)..........................................................................................98
A.1.29 DRDY_C1# (O).......................................................................................98
A.1.30 DRDY_C2# (O).......................................................................................98
A.1.31 DSZ[1:0]# (I/O) ....................................................................................98
A.1.32 EXF[4:0]# (I/O) .....................................................................................98
A.1.33 FCL# (I/O) ............................................................................................99
A.1.34 FERR# (O).............................................................................................99
A.1.35 GSEQ# (I) .............................................................................................99
A.1.36 HIT# (I/O) and HITM# (I/O) ....................................................................99
A.1.37 ID[9:0]# (I) ..........................................................................................99
A.1.38 IDS# (I)................................................................................................99
A.1.39 IGNNE# (I)............................................................................................99
A.1.40 INIT# (I) ...............................................................................................99
A.1.41 INT (I) ................................................................................................ 100
A.1.42 IP[1:0]# (I) ......................................................................................... 100
A.1.43 LEN[2:0]# (I/O) ................................................................................... 100
A.1.44 LINT[1:0] (I) ....................................................................................... 100
4
Dual-Core Intel
®
Itanium
®
Processor 9000 and 9100 Series Datasheet
A.2
A.1.45 LOCK# (I/O)........................................................................................ 100
A.1.46 NMI (I) ............................................................................................... 101
A.1.47 OWN# (I/O) ........................................................................................ 101
A.1.48 PMI# (I) ............................................................................................. 101
A.1.49 PWRGOOD (I) ...................................................................................... 101
A.1.50 REQ[5:0]# (I/O) .................................................................................. 101
A.1.51 RESET# (I) ......................................................................................... 102
A.1.52 RP# (I/O) ........................................................................................... 102
A.1.53 RS[2:0]# (I) ....................................................................................... 103
A.1.54 RSP# (I) ............................................................................................. 103
A.1.55 SBSY# (I/O)........................................................................................ 103
A.1.56 SBSY_C1# (O)..................................................................................... 103
A.1.57 SBSY_C2# (O)..................................................................................... 103
A.1.58 SPLCK# (I/O) ...................................................................................... 103
A.1.59 STBn[7:0]# and STBp[7:0]# (I/O) ......................................................... 103
A.1.60 TCK (I) ............................................................................................... 104
A.1.61 TDI (I)................................................................................................ 104
A.1.62 TDO (O).............................................................................................. 104
A.1.63 THRMTRIP# (O) ................................................................................... 104
A.1.64 THRMALERT# (O)................................................................................. 104
A.1.65 TMS (I) ............................................................................................... 104
A.1.66 TND# (I/O) ......................................................................................... 104
A.1.67 TRDY# (I) ........................................................................................... 105
A.1.68 TRST# (I) ........................................................................................... 105
A.1.69 WSNP# (I/O)....................................................................................... 105
Signal Summaries ........................................................................................... 105
Figures
2-1
2-2
2-3
2-4
2-5
2-6
3-1
4-1
4-2
4-3
4-4
4-5
4-6
4-7
4-8
5-1
5-2
6-1
Generic Clock Waveform .................................................................................... 21
SMSC Clock Waveform ....................................................................................... 22
System Bus Signal Waveform Exhibiting Overshoot/Undershoot............................... 23
Processors Power Tab Physical Layout .................................................................. 28
System Bus Reset and Configuration Timings for Cold Reset.................................... 31
System Bus Reset and Configuration Timings for Warm Reset ................................. 32
Dual-Core Intel
®
Itanium
®
Processor 9000 and 9100 Series Pinout.......................... 35
Processor Package............................................................................................. 66
Package Height and Pin Dimensions ..................................................................... 67
Processor Package Mechanical Interface Dimensions .............................................. 69
Processor Package Top-Side Components Height Dimensions .................................. 70
Processor Package Bottom-Side Components Height Dimensions ............................. 70
Processor to MVR Interface Loads ........................................................................ 71
Processor Top-Side Marking on IHS ..................................................................... 73
Processor Bottom-Side Marking Placement on Interposer ........................................ 74
Dual-Core Intel
®
Itanium
®
Processor 9000 and 9100 Series Thermal
Features .......................................................................................................... 75
Itanium
®
Processor Package Thermocouple Location .............................................. 77
Logical Schematic of SMBus Circuitry ................................................................... 80
Dual-Core Intel
®
Itanium
®
Processor 9000 and 9100 Series Datasheet
5
查看更多>
参数对比
与NE80567KE025015相近的元器件有:NE80567KF028009、NE80567KE025009、NE80567KF028015、NE80567KEB17003、NE80567KF0288M、NE80567KE025003。描述及对比如下:
型号 NE80567KE025015 NE80567KF028009 NE80567KE025009 NE80567KF028015 NE80567KEB17003 NE80567KF0288M NE80567KE025003
描述 Microprocessor, 64-Bit, 667MHz, CMOS, CPGA611, 113 X 48.26 MM, PPGA-611 Microprocessor, 64-Bit, 667MHz, CMOS, CPGA611, 113 X 48.26 MM, PPGA-611 Microprocessor, 64-Bit, 667MHz, CMOS, CPGA611, 113 X 48.26 MM, PPGA-611 Microprocessor, 64-Bit, 667MHz, CMOS, CPGA611, 113 X 48.26 MM, PPGA-611 Microprocessor, 64-Bit, 667MHz, CMOS, CPGA611, 113 X 48.26 MM, PPGA-611 Microprocessor, 64-Bit, 667MHz, CMOS, CPGA611, 113 X 48.26 MM, PPGA-611 Microprocessor, 64-Bit, 667MHz, CMOS, CPGA611, 113 X 48.26 MM, PPGA-611
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合
零件包装代码 PGA PGA PGA PGA PGA PGA PGA
包装说明 SPGA, SPGA, SPGA, SPGA, SPGA, SPGA, SPGA,
针数 611 611 611 611 611 611 611
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant
ECCN代码 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3
地址总线宽度 64 64 64 64 64 64 64
位大小 64 64 64 64 64 64 64
边界扫描 NO NO NO NO NO NO NO
最大时钟频率 1660 MHz 1660 MHz 1660 MHz 1660 MHz 1660 MHz 1660 MHz 1660 MHz
外部数据总线宽度 128 128 128 128 128 128 128
格式 FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT
集成缓存 YES YES YES YES YES YES YES
JESD-30 代码 R-CPGA-P611 R-CPGA-P611 R-CPGA-P611 R-CPGA-P611 R-CPGA-P611 R-CPGA-P611 R-CPGA-P611
长度 113 mm 113 mm 113 mm 113 mm 113 mm 113 mm 113 mm
低功率模式 YES YES YES YES YES YES YES
端子数量 611 611 611 611 611 611 611
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装代码 SPGA SPGA SPGA SPGA SPGA SPGA SPGA
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, SHRINK PITCH GRID ARRAY, SHRINK PITCH GRID ARRAY, SHRINK PITCH GRID ARRAY, SHRINK PITCH GRID ARRAY, SHRINK PITCH GRID ARRAY, SHRINK PITCH GRID ARRAY, SHRINK PITCH
座面最大高度 5.668 mm 5.368 mm 5.368 mm 5.668 mm 5.668 mm 5.368 mm 5.668 mm
速度 667 MHz 667 MHz 667 MHz 667 MHz 667 MHz 667 MHz 667 MHz
表面贴装 NO NO NO NO NO NO NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS
端子形式 PIN/PEG PIN/PEG PIN/PEG PIN/PEG PIN/PEG PIN/PEG PIN/PEG
端子节距 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
端子位置 PERPENDICULAR PERPENDICULAR PERPENDICULAR PERPENDICULAR PERPENDICULAR PERPENDICULAR PERPENDICULAR
宽度 48.26 mm 48.26 mm 48.26 mm 48.26 mm 48.26 mm 48.26 mm 48.26 mm
uPs/uCs/外围集成电路类型 MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR
厂商名称 Intel(英特尔) - - - Intel(英特尔) Intel(英特尔) Intel(英特尔)
热门器件
热门资源推荐
器件捷径:
E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ
需要登录后才可以下载。
登录取消