Preliminary
INFRARED REMOTE CONTROL RECEIVER
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GENERAL DESCRIPTION
The NJL10H000 series are surface mount receiving devices
for infrared remote control system with surface mount package
which can be soldered by reflow method.
NJL10H000
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OUTLINE (typ.)
unit: mm
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FEATURES
1. Surface mount type
2. Package size
3. Half angle
5.3 mm
×
7.6mm
×
1.5mm
75deg typ.
4. Line-up for various center carrier frequencies.
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APPLICATIONS
1. Small AV instruments such as Portable Audio, DVD etc.
2. Car Audio, Car Navigation system etc.
3. Camera, VCR Camera etc.
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LINE-UP
Carrier Frequency
36
kHz
36.7 kHz
38
kHz
40
kHz
Item Number
NJL10H360
NJL10H367
NJL10H380
NJL10H400
Regarding the other frequencies or packages, please contact to New JRC individually.
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BLOCK DIAGRAM
Vcc
Head Amp
2nd Amp
3rd Amp
Comparator
22K
Vout
B.P.F.
PD
ABLC
Detector
GND
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ABSOLUTE MAXIMUM RATINGS
(Ta=25°C)
PARAMETER
Supply Voltage
Operating Temperature Range
Storage Temperature Range
Reflow Soldering Temperature
SYMBOL
V
cc
T
opr
T
stg
T
sol
RATINGS
6.3
-30 to +85
-40 to +85
260 (10sec.)
UNIT
V
°C
°C
°C
Preliminary
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RECOMMENDED OPERATING CONDITION
Supply Voltage Range
V
cc
4.5V to 5.5V
NJL10H000
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ELECTRO-OPTICAL CHARACTERISTICS
(Vcc = 5.0V, Ta = 25°C)
PARAMETER
SYMBOL
TEST CONDITION
MIN
—
Supply Current
Icc
No Signal Input
Transmission Distance
Lc
Direction of Ray Axis *1
8
—
Directivity
θ
1/2
Angle of half Lc
—
Output Voltage Low
VL
No Load
4.5
Output Voltage High
VH
No Load
350
Low Level Pulse Width
TwL
See Test Circuit
350
High Level Pulse Width
TwH
See Test Circuit
Note *1: Test with each center carrier frequency under the test condition shown below.
TYP
1.0
12
75
0.2
—
—
—
MAX
2.0
—
—
0.5
—
850
850
UNIT
mA
m
deg
V
V
µs
µs
s
TEST METHOD
Carrier frequency is adjusted to
center frequency of each product
Test condition is as follows:
IR TRANSMITTER
(1) Standard transmitter:
Transmitting waveform is shown in Fig.1
Transmitting power should be adjusted
so that output voltage Vout will be
400mVp-p.(Test circuit is shown in Fig.2)
Regarding IR LED used for transmitter,
λp=940nm, ∆λ=50nm.
Regarding photo diode,
Sensitivity S=26nA/Lx
in case light source temperature 2856°K,
Ee=100Lx, VR=5V
OUTPUT WAVE FORM
600us
600us
V
H
OUTPUT PULSE
OF DEVICE
T
WL
T
WH
V
L
Fig.1 TRANSMITTER WAVE FORM
20cm
10K
4.9
-5.1V
+
-
(2) Test system: Shown in Fig.3.
100K
SENSING DISTANCE : L
Vout
Vcc
OUT
STANDARD
TRANSMITTER
Vout
Fig.2 STD.TRANSMITTER TEST CIRCUIT
GND
Fig.3 TEST SYSTEM
Preliminary
PRECAUTION FOR HANDLING
1. Soldering to actual circuit board
Soldering condition
NJL10H000
- Heated condition of plastic package.
Lower than 240°C of maximum surface temperature, less than 30 seconds of time kept higher than 200°C.
Soldering Method
1) Reflow Method
Recommended temperature profile of its method.
➀
Preparatory heating condition
: 120 to 150°C about 60 sec.
➁
Recommended soldering temperature : 230 to 240°C about 3 to 5 sec.
➂
Slowly cool down right after soldering.
➃
Soldering to be done within twice under this condition.
(°C)
250
200
150
100
50
0
Time
2) Reflow Method
(In
case of infrared heating)
- Temperature profile : Same to the above
- Avoid direct irradiation to the plastic package because it is mold resin, absorbs the Infrared Radiation and its surface
temperature will be higher than lead itself.
3) The other method
Avoid rapid heating up like dipping the devices directly into the melting solder or vapor phase method
(VPS).
If the device is heated to high temperature and kept in its condition for longer time, it would affect to its reliability.
It is necessary to solder in short time as soon as possible.
Preparatory heating
60 to 120 sec.
Less than
30 sec.
3 to 5 sec.
240°C max.
2. Cleaning
Avoid washing of the device after soldering by reflow method.
3. Attention in handling
1) Avoid dust and any other foreign materials (paint, bonding material, etc.) on the lens surface.
2) When mounting, special care has to be taken on the mounting position and tilting of the device because it is very
important to place the device to the optimum position to the object.
4. Storage
In order to prevent from degradation of this device in moisturing at reflow method, so that this device is contained in
dampproof packaging. So that mount the device as short as possible after opening the envelope.
[CAUTION]
The specifications on this databook are
only
given for information , without any
guarantee
as regards either mistakes or omissions. The
application circuits in this databook are
described only to show representative
usages
