NL27WZ04
Dual Inverter
The NL27WZ04 is a high performance dual inverter operating from
a 1.65 V to 5.5 V supply. High impedance TTL compatible inputs
significantly reduce current loading to input drivers while TTL
compatible outputs offer improved switching noise performance.
Features
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MARKING
DIAGRAMS
SC−88
(SC70−6/SOT−363)
DF SUFFIX
CASE 419B
6
M5 M
G
G
M
•
•
•
•
•
•
•
•
•
•
•
Extremely High Speed: t
PD
2.0 ns (typical) at V
CC
= 5 V
Designed for 1.65 V to 5.5 V V
CC
Operation
Over Voltage Tolerant Inputs and Outputs
LVTTL Compatible
−
Interface Capability with 5 V TTL Logic
with V
CC
= 3 V
LVCMOS Compatible
24 mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current Substantially Reduces System
Power Requirements
Replacement for NC7W04
Chip Complexity: FET = 72; Equivalent Gate = 18
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
1
1
1
M5
M
G
TSOP−6
DT SUFFIX
CASE 318G
1
= Device Code
= Date Code*
= Pb−Free Package
M5 M
G
G
(Note: Microdot may be in either location)
IN A1
1
6
OUT Y1
*Date Code orientation and/or position and underbar
may vary depending upon manufacturing location.
GND
2
5
V
CC
PIN ASSIGNMENT
Pin
Function
IN A1
GND
IN A2
OUT Y2
V
CC
OUT Y1
IN A2
3
4
OUT Y2
1
2
3
4
5
6
Figure 1. Pinout
(Top View)
IN A1
IN A2
1
1
OUT Y1
OUT Y2
FUNCTION TABLE
A Input
L
H
Y Output
H
L
Figure 2. Logic Symbol
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
©
Semiconductor Components Industries, LLC, 2013
March, 2013
−
Rev. 10
1
Publication Order Number:
NL27WZ04/D
NL27WZ04
MAXIMUM RATINGS
Symbol
V
CC
V
I
V
O
I
IK
I
OK
I
O
I
CC
I
GND
T
STG
P
D
q
JA
T
L
T
J
V
ESD
DC Supply Voltage
DC Input Voltage
DC Output Voltage
Output in HIGH or LOW State (Note 1)
DC Input Diode Current
DC Output Diode Current
DC Output Source/Sink Current
DC Supply Current Per Supply Pin
DC Ground Current Per Ground Pin
Storage Temperature Range
Power Dissipation in Still Air
SC−88, TSOP−6 (Note 2)
Thermal Resistance
SC−88, TSOP−6 (Note 2)
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
ESD Withstand Voltage
Human Body Model (Note 3)
Machine Model (Note 4)
Charged Device Model (Note 5)
Latchup Performance Above V
CC
and Below GND at 125°C (Note 6)
V
I
< GND
V
O
< GND
Characteristics
Value
−0.5
to +7.0
−0.5
≤
V
I
≤
+7.0
−0.5
≤
V
O
≤
7.0
−50
−50
±50
±100
±100
−65
to +150
200
333
260
+150
> 2000
> 200
N/A
±100
Units
V
V
V
mA
mA
mA
mA
mA
°C
mW
°C/W
°C
°C
V
I
LATCHUP
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. I
O
absolute maximum rating must be observed.
2. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
3. Tested to EIA/JESD22−A114−A
4. Tested to EIA/JESD22−A115−A
5. Tested to JESD22−C101−A
6. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply Voltage
Operating
Data Retention Only
Input Voltage
Output Voltage (HIGH or LOW State)
Operating Free−Air Temperature
Input Transition Rise or Fall Rate
V
CC
= 2.5 V
±0.2
V
V
CC
= 3.0 V
±0.3
V
V
CC
= 5.0 V
±0.5
V
Symbol
V
CC
Min
1.65
1.5
0
0
−55
0
0
0
Max
5.5
5.5
5.5
5.5
+125
20
10
5
Units
V
V
I
V
O
T
A
Dt/DV
V
V
°C
ns/V
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2
NL27WZ04
DC ELECTRICAL CHARACTERISTICS
V
CC
Parameter
High−Level Input
Voltage
Low−Level Input
Voltage
High−Level Output
Voltage
V
IN
= V
IL
I
OH
=
−100
mA
I
OH
=
−3
mA
I
OH
=
−8
mA
I
OH
=
−12
mA
I
OH
=
−16
mA
I
OH
=
−24
mA
I
OH
=
−32
mA
Low−Level Output
Voltage
V
IN
= V
IH
I
OL
= 100
mA
I
OL
= 3 mA
I
OL
= 8 mA
I
OL
= 12 mA
I
OL
= 16 mA
I
OL
= 24 mA
I
OL
= 32 mA
Input Leakage Current
Power Off
Leakage Current
Quiescent Supply
Current
V
IN
= 5.5 V or GND
V
IN
= 5.5 V or
V
OUT
= 5.5 V
V
IN
= 5.5 V or GND
I
IN
I
OFF
I
CC
V
OL
Condition
Symbol
V
IH
V
IL
V
OH
(V)
1.65−1.95
2.3 to 5.5
1.65−1.95
2.3 to 5.5
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
0 to 5.5
0
5.5
0.08
0.20
0.22
0.28
0.38
0.42
V
CC
−
0.1
1.29
1.9
2.2
2.4
2.3
3.8
V
CC
1.52
2.1
2.4
2.7
2.5
4.0
0.1
0.24
0.3
0.4
0.4
0.55
0.55
±0.1
1
1
Min
0.75 V
CC
0.7 V
CC
0.25 V
CC
0.3 V
CC
V
CC
−
0.1
1.29
1.9
2.2
2.4
2.3
3.8
0.1
0.24
0.3
0.4
0.4
0.55
0.55
±1.0
10
10
mA
mA
mA
V
T
A
= 25°C
Typ
Max
−55°C
3
T
A
3
125°C
Min
0.75 V
CC
0.7 V
CC
0.25 V
CC
0.3 V
CC
V
V
Max
Units
V
AC ELECTRICAL CHARACTERISTICS
t
R
= t
F
= 2.5 ns; C
L
= 50 pF; R
L
= 500
W
Parameter
Propagation Delay
(Figure 3 and 4)
Condition
R
L
= 1 MW, C
L
= 15 pF
R
L
= 1 MW, C
L
= 15 pF
R
L
= 1 MW, C
L
= 15 pF
R
L
= 1 MW, C
L
= 15 pF
R
L
= 500
W,
C
L
= 50 pF
R
L
= 1 MW, C
L
= 15 pF
R
L
= 500
W,
C
L
= 50 pF
5.0
±
0.5
Symbol
t
PLH
t
PHL
V
CC
(V)
1.65
1.8
2.5
±
0.2
3.3
±
0.3
T
A
= 25°C
Min
1.8
1.8
1.2
0.8
1.2
0.5
0.8
Typ
2.3
4.4
3.0
2.2
2.9
1..8
2.3
Max
9.2
7.6
5.1
3.4
4.5
2.8
3.6
−55°C
3
T
A
3
125°C
Min
1.8
1.8
1.2
0.8
1.2
0.5
0.8
Max
11.0
8.4
5.6
3.8
5.0
3.1
4.0
Units
ns
CAPACITIVE CHARACTERISTICS
Parameter
Input Capacitance
Power Dissipation
Capacitance (Note 7)
Symbol
C
IN
C
PD
Condition
V
CC
= 5.5 V, V
I
= 0 V or V
CC
10 MHz, V
CC
= 3.3 V, V
I
= 0 V or V
CC
10 MHz, V
CC
= 5.5 V, V
I
= 0 V or V
CC
Typical
2.5
9
11
Units
pF
pF
7. C
PD
is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: I
CC(OPR
)
= C
PD
V
CC
f
in
+ I
CC
. C
PD
is used to determine the no−load dynamic
power consumption; P
D
= C
PD
V
CC2
f
in
+ I
CC
V
CC
.
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3
NL27WZ04
A
V
CC
50%
t
PLH
t
PHL
GND
Y
50% V
CC
PROPAGATION DELAYS
t
R
= t
F
= 2.5 ns, 10% to 90%; f = 1 MHz; t
W
= 500 ns
Figure 3. Switching Waveforms
V
CC
PULSE
GENERATOR
R
T
DUT
C
L
R
L
R
T
= Z
OUT
of pulse generator (typically 50
W)
Figure 4. Test Circuit
ORDERING INFORMATION
Device
NL27WZ04DFT1G
NL27WZ04DFT2G
NLV27WZ04DFT1G*
NLV27WZ04DFT2G*
NL27WZ04DTT1G
Package
SC−88/SC70−6/SOT−363
(Pb−Free)
SC−88/SC70−6/SOT−363
(Pb−Free)
SC−88/SC70−6/SOT−363
(Pb−Free)
SC−88/SC70−6/SOT−363
(Pb−Free)
TSOP−6
(Pb−Free)
Shipping
†
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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4
NL27WZ04
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE Y
2X
aaa H D
D
A
D
5
4
H
GAGE
PLANE
6
E
1
2X
2
3
E1
L2
L
DETAIL A
aaa C
bbb H D
2X 3 TIPS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRU-
SIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END.
4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF
THE PLASTIC BODY AND DATUM H.
5. DATUMS A AND B ARE DETERMINED AT DATUM H.
6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP.
7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN
EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDI-
TION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OF THE FOOT.
DIM
A
A1
A2
b
C
D
E
E1
e
L
L2
aaa
bbb
ccc
ddd
MILLIMETERS
MIN
NOM MAX
−−−
−−−
1.10
0.00
−−−
0.10
0.70
0.90
1.00
0.15
0.20
0.25
0.08
0.15
0.22
1.80
2.00
2.20
2.00
2.10
2.20
1.15
1.25
1.35
0.65 BSC
0.26
0.36
0.46
0.15 BSC
0.15
0.30
0.10
0.10
INCHES
MIN
NOM MAX
−−−
−−−
0.043
0.000
−−−
0.004
0.027 0.035 0.039
0.006 0.008 0.010
0.003 0.006 0.009
0.070 0.078 0.086
0.078 0.082 0.086
0.045 0.049 0.053
0.026 BSC
0.010 0.014 0.018
0.006 BSC
0.006
0.012
0.004
0.004
e
B
TOP VIEW
6X
b
ddd
A2
A
M
C A-B D
DETAIL A
6X
ccc C
SIDE VIEW
A1
C
SEATING
PLANE
END VIEW
c
RECOMMENDED
SOLDERING FOOTPRINT*
0.30
6X
0.66
6X
2.50
0.65
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
