型号
- 型号
- 关键词
| 型号 | NM27C256VE200X | RCA12104M42FKEC | NM27C256V120X | NM27C256QM200 | NM27C256VE120X | NM27C256V200X | NM27C256VE150X |
|---|---|---|---|---|---|---|---|
| 描述 | 32KX8 OTPROM, 200ns, PQCC32, PLASTIC, LCC-32 | FIXED RESISTOR, METAL GLAZE/THICK FILM, 0.5W, 4420000OHM, 400V, 1% +/-TOL, 100PPM/CEL, SURFACE MOUNT, 1210, CHIP, ROHS COMPLIANT | 32KX8 OTPROM, 120ns, PQCC32, PLASTIC, LCC-32 | 32KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERDIP-28 | 32KX8 OTPROM, 120ns, PQCC32, PLASTIC, LCC-32 | 32KX8 OTPROM, 200ns, PQCC32, PLASTIC, LCC-32 | 32KX8 OTPROM, 150ns, PQCC32, PLASTIC, LCC-32 |
| 包装说明 | QCCJ, | CHIP | QCCJ, | WDIP, DIP28,.6 | QCCJ, | QCCJ, | QCCJ, |
| Reach Compliance Code | unknown | compliant | unknown | unknown | unknown | unknown | unknown |
| 端子数量 | 32 | 2 | 32 | 28 | 32 | 32 | 32 |
| 最高工作温度 | 85 °C | 155 °C | 70 °C | 125 °C | 85 °C | 70 °C | 85 °C |
| 最低工作温度 | -40 °C | -55 °C | - | -55 °C | -40 °C | - | -40 °C |
| 封装形式 | CHIP CARRIER | SMT | CHIP CARRIER | IN-LINE, WINDOW | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 表面贴装 | YES | YES | YES | NO | YES | YES | YES |
| 技术 | CMOS | METAL GLAZE/THICK FILM | CMOS | CMOS | CMOS | CMOS | CMOS |
| 厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| ECCN代码 | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 200 ns | - | 120 ns | 200 ns | 120 ns | 200 ns | 150 ns |
| JESD-30 代码 | R-PQCC-J32 | - | R-PQCC-J32 | R-GDIP-T28 | R-PQCC-J32 | R-PQCC-J32 | R-PQCC-J32 |
| 长度 | 13.97 mm | - | 13.97 mm | - | 13.97 mm | 13.97 mm | 13.97 mm |
| 内存密度 | 262144 bit | - | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| 内存集成电路类型 | OTP ROM | - | OTP ROM | UVPROM | OTP ROM | OTP ROM | OTP ROM |
| 内存宽度 | 8 | - | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | - | 1 | 1 | 1 | 1 | 1 |
| 字数 | 32768 words | - | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| 字数代码 | 32000 | - | 32000 | 32000 | 32000 | 32000 | 32000 |
| 工作模式 | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 组织 | 32KX8 | - | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| 输出特性 | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | - | QCCJ | WDIP | QCCJ | QCCJ | QCCJ |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 并行/串行 | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.55 mm | - | 3.55 mm | 5.72 mm | 3.55 mm | 3.55 mm | 3.55 mm |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V |
| 温度等级 | INDUSTRIAL | - | COMMERCIAL | MILITARY | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
| 端子形式 | J BEND | - | J BEND | THROUGH-HOLE | J BEND | J BEND | J BEND |
| 端子节距 | 1.27 mm | - | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | - | QUAD | DUAL | QUAD | QUAD | QUAD |
| 宽度 | 11.43 mm | - | 11.43 mm | 15.24 mm | 11.43 mm | 11.43 mm | 11.43 mm |