IC 64K X 16 OTPROM, 150 ns, PQCC44, PLASTIC, LCC-44, Programmable ROM
厂商名称:National Semiconductor(TI )
厂商官网:http://www.ti.com
下载文档型号 | NM27LV210V150 | NM27LV210FE150 | NM27LV210F250 | NM27LV210VE200 | NM27LV210VE150 | NM27LV210FE200 | NM27LV210F150 | NM27LV210F200 | NM27LV210FE250 |
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描述 | IC 64K X 16 OTPROM, 150 ns, PQCC44, PLASTIC, LCC-44, Programmable ROM | IC 64K X 16 OTPROM, 150 ns, PQFP44, 10 X 10 MM, PLASTIC, TQFP-44, Programmable ROM | IC 64K X 16 OTPROM, 250 ns, PQFP44, 10 X 10 MM, PLASTIC, TQFP-44, Programmable ROM | IC 64K X 16 OTPROM, 200 ns, PQCC44, PLASTIC, LCC-44, Programmable ROM | IC 64K X 16 OTPROM, 150 ns, PQCC44, PLASTIC, LCC-44, Programmable ROM | IC 64K X 16 OTPROM, 200 ns, PQFP44, 10 X 10 MM, PLASTIC, TQFP-44, Programmable ROM | IC 64K X 16 OTPROM, 150 ns, PQFP44, 10 X 10 MM, PLASTIC, TQFP-44, Programmable ROM | IC 64K X 16 OTPROM, 200 ns, PQFP44, 10 X 10 MM, PLASTIC, TQFP-44, Programmable ROM | IC 64K X 16 OTPROM, 250 ns, PQFP44, 10 X 10 MM, PLASTIC, TQFP-44, Programmable ROM |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | PLASTIC, LCC-44 | LQFP, QFP44,.47SQ,32 | LQFP, QFP44,.47SQ,32 | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | LQFP, QFP44,.47SQ,32 | LQFP, QFP44,.47SQ,32 | LQFP, QFP44,.47SQ,32 | LQFP, QFP44,.47SQ,32 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 150 ns | 150 ns | 250 ns | 200 ns | 150 ns | 200 ns | 150 ns | 200 ns | 250 ns |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | S-PQCC-J44 | S-PQFP-G44 | S-PQFP-G44 | S-PQCC-J44 | S-PQCC-J44 | S-PQFP-G44 | S-PQFP-G44 | S-PQFP-G44 | S-PQFP-G44 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 16.51 mm | 10 mm | 10 mm | 16.51 mm | 16.51 mm | 10 mm | 10 mm | 10 mm | 10 mm |
内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
内存集成电路类型 | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 44 | 44 | 44 | 44 | 44 | 44 | 44 | 44 | 44 |
字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C |
最低工作温度 | - | -40 °C | - | -40 °C | -40 °C | -40 °C | - | - | -40 °C |
组织 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCJ | LQFP | LQFP | QCCJ | QCCJ | LQFP | LQFP | LQFP | LQFP |
封装等效代码 | LDCC44,.7SQ | QFP44,.47SQ,32 | QFP44,.47SQ,32 | LDCC44,.7SQ | LDCC44,.7SQ | QFP44,.47SQ,32 | QFP44,.47SQ,32 | QFP44,.47SQ,32 | QFP44,.47SQ,32 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | CHIP CARRIER | CHIP CARRIER | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.57 mm | 1.6 mm | 1.6 mm | 4.57 mm | 4.57 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
最大待机电流 | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A |
最大压摆率 | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | J BEND | GULL WING | GULL WING | J BEND | J BEND | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 0.8 mm | 0.8 mm | 1.27 mm | 1.27 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 16.51 mm | 10 mm | 10 mm | 16.51 mm | 16.51 mm | 10 mm | 10 mm | 10 mm | 10 mm |
厂商名称 | National Semiconductor(TI ) | - | - | - | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) |