IC OP-AMP, 200 uV OFFSET-MAX, MBCY8, TO-99, 8 PIN, Operational Amplifier
厂商名称:ADI(亚德诺半导体)
下载文档型号 | OP06AJ/883C | OP06GT | OP06G | OP06NT | OP06BIGZ | OP06AJ883C | OP06GR | OP06N |
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描述 | IC OP-AMP, 200 uV OFFSET-MAX, MBCY8, TO-99, 8 PIN, Operational Amplifier | IC OP-AMP, 700 uV OFFSET-MAX, UUC6, 2.41 X 1.30 MM, DIE-6, Operational Amplifier | IC OP-AMP, 500 uV OFFSET-MAX, UUC6, 2.41 X 1.30 MM, DIE-6, Operational Amplifier | IC OP-AMP, 300 uV OFFSET-MAX, UUC6, 2.41 X 1.30 MM, DIE-6, Operational Amplifier | IC OP-AMP, 1600 uV OFFSET-MAX, CDIP8, HERMETIC SEALED, CERDIP-8, Operational Amplifier | IC OP-AMP, MBCY8, TO-99, 8 PIN, Operational Amplifier | IC OP-AMP, 1300 uV OFFSET-MAX, UUC6, 2.41 X 1.30 MM, DIE-6, Operational Amplifier | IC OP-AMP, 200 uV OFFSET-MAX, UUC6, 2.41 X 1.30 MM, DIE-6, Operational Amplifier |
厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
零件包装代码 | TO-99 | DIE | DIE | DIE | DIP | TO-99 | DIE | DIE |
包装说明 | TO-99, 8 PIN | 2.41 X 1.30 MM, DIE-6 | 2.41 X 1.30 MM, DIE-8 | 2.41 X 1.30 MM, DIE-8 | DIP, | TO-99, 8 PIN | 2.41 X 1.30 MM, DIE-6 | 2.41 X 1.30 MM, DIE-6 |
针数 | 8 | 6 | 6 | 6 | 8 | 8 | 6 | 6 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | unknown | compliant | compliant |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 符合 | - | 不符合 | 不符合 |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 |
放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | - | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
最大平均偏置电流 (IIB) | 0.07 µA | 0.07 µA | 0.08 µA | 0.06 µA | 0.11 µA | - | 0.11 µA | 0.07 µA |
标称共模抑制比 | 112 dB | 108 dB | 114 dB | 108 dB | 110 dB | - | 110 dB | 114 dB |
最大输入失调电压 | 200 µV | 700 µV | 500000 µV | 300000 µV | 1600 µV | - | 1300 µV | 200 µV |
JESD-30 代码 | O-MBCY-W8 | R-XUUC-N6 | R-XUUC-N8 | R-XUUC-N8 | R-GDIP-T8 | - | R-XUUC-N6 | R-XUUC-N6 |
负供电电压上限 | -22 V | -22 V | -22 V | -22 V | - | - | -22 V | -22 V |
标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | - | -15 V | -15 V |
功能数量 | 1 | 1 | 1 | 1 | 1 | - | 1 | 1 |
端子数量 | 8 | 6 | 8 | 8 | 8 | - | 6 | 6 |
最高工作温度 | 125 °C | 70 °C | 70 °C | - | 70 °C | - | 70 °C | - |
封装主体材料 | METAL | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | CERAMIC, GLASS-SEALED | - | UNSPECIFIED | UNSPECIFIED |
封装形状 | ROUND | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
封装形式 | CYLINDRICAL | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP | IN-LINE | - | UNCASED CHIP | UNCASED CHIP |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
供电电压上限 | 22 V | 22 V | 22 V | 22 V | - | - | 22 V | 22 V |
标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | - | 15 V | 15 V |
表面贴装 | NO | YES | YES | YES | NO | - | YES | YES |
温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | - | COMMERCIAL | - |
端子形式 | WIRE | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE | - | NO LEAD | NO LEAD |
端子位置 | BOTTOM | UPPER | UPPER | UPPER | DUAL | - | UPPER | UPPER |
最小共模抑制比 | - | 108 dB | 114 dB | 108 dB | - | - | 110 dB | 114 dB |
JESD-609代码 | - | e0 | e0 | e0 | - | - | e0 | e0 |
封装代码 | - | DIE | DIE | DIE | DIP | - | DIE | DIE |
峰值回流温度(摄氏度) | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
技术 | - | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | - | BIPOLAR | BIPOLAR |
端子面层 | - | TIN LEAD | TIN LEAD | TIN LEAD | - | - | TIN LEAD | TIN LEAD |
处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
最小电压增益 | - | 800000 | 1000000 | 1000000 | - | - | 500000 | 1000000 |