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OPA541SM-BI

Operational Amplifier, 1 Func, 1000uV Offset-Max, BIPolar, MBFM8, HERMETIC SEALED, TO-3, 8 PIN

器件类别:模拟混合信号IC    放大器电路   

厂商名称:Burr-Brown

厂商官网:http://www.burr-brown.com/

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
Burr-Brown
包装说明
TO-3, CAN8/9,.5FL
Reach Compliance Code
unknown
放大器类型
OPERATIONAL AMPLIFIER
架构
VOLTAGE-FEEDBACK
最大平均偏置电流 (IIB)
0.00005 µA
25C 时的最大偏置电流 (IIB)
0.00005 µA
标称共模抑制比
113 dB
频率补偿
YES
最大输入失调电压
1000 µV
JESD-30 代码
O-MBFM-P8
JESD-609代码
e0
低-偏置
YES
低-失调
NO
微功率
NO
负供电电压上限
-40 V
标称负供电电压 (Vsup)
-35 V
功能数量
1
端子数量
8
最高工作温度
125 °C
最低工作温度
-55 °C
封装主体材料
METAL
封装代码
TO-3
封装等效代码
CAN8/9,.5FL
封装形状
ROUND
封装形式
FLANGE MOUNT
功率
YES
电源
+-35 V
可编程功率
NO
认证状态
Not Qualified
最小摆率
6 V/us
标称压摆率
10 V/us
最大压摆率
25 mA
供电电压上限
40 V
标称供电电压 (Vsup)
35 V
表面贴装
NO
技术
BIPOLAR
温度等级
MILITARY
端子面层
Tin/Lead (Sn/Pb)
端子形式
PIN/PEG
端子位置
BOTTOM
标称均一增益带宽
1600 kHz
最小电压增益
32000
宽带
NO
文档预览
OPA541
SBOS153A – SEPTEMBER 2000 – AUGUST 2006
High Power Monolithic
OPERATIONAL AMPLIFIER
FEATURES
q
POWER SUPPLIES TO
±
40V
q
OUTPUT CURRENT TO 10A PEAK
q
PROGRAMMABLE CURRENT LIMIT
q
INDUSTRY-STANDARD PIN OUT
q
FET INPUT
q
TO-3 AND LOW-COST POWER PLASTIC
PACKAGES
APPLICATIONS
q
MOTOR DRIVER
q
SERVO AMPLIFIER
q
SYNCHRO EXCITATION
q
AUDIO AMPLIFIER
q
PROGRAMMABLE POWER SUPPLY
DESCRIPTION
The OPA541 is a power operational amplifier capable of
operation from power supplies up to
±40V
and delivering
continuous output currents up to 5A. Internal current limit
circuitry can be user-programmed with a single external
resistor, protecting the amplifier and load from fault condi-
tions. The OPA541 is fabricated using a proprietary bipolar/
FET process.
Pinout is compatible with popular hybrid power amplifiers
such as the OPA511, OPA512 and the 3573. The OPA541
uses a single current-limit resistor to set both the positive and
negative current limits. Applications currently using hybrid
power amplifiers requiring two current-limit resistors need not
be modified.
The OPA541 is available in an 11-pin power plastic package
and an industry-standard 8-pin TO-3 hermetic package. The
power plastic package has a copper-lead frame to maximize
heat transfer. The TO-3 package is isolated from all circuitry,
allowing it to be mounted directly to a heat sink without
special insulators.
+V
S
–In
+In
Current
Sense
R
CL
Output
Drive
External
V
O
–V
S
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright © 2000-2006, Texas Instruments Incorporated
www.ti.com
ABSOLUTE MAXIMUM RATINGS
(1)
Supply Voltage, +V
S
to –V
S
............................................................... 80V
Output Current ............................................................................. see SOA
Power Dissipation, Internal
(2)
.......................................................... 125W
Input Voltage: Differential ....................................................................
±V
S
Common-mode ............................................................
±V
S
Temperature: Pin solder, 10s ........................................................ +300°C
Junction
(2)
............................................................... +150°C
Temperature Range:
AM, BM SM
Storage ..................................................................... –65°C to +150°C
Operating (case) ....................................................... –55°C to +125°C
AP
Storage ....................................................................... –40°C to +85°C
Operating (case) ......................................................... –25°C to +85°C
NOTE: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability. (2) Long term operation at the maximum junction temperature
will result in reduced product life. Derate internal power dissipation to achieve
high MTTF.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
PACKAGE/ORDERING INFORMATION
For the most current package and ordering information, see
the Package Option Addendum at the end of this document,
or see the TI website at www.ti.com.
CONNECTION DIAGRAMS
Top View
TO–3
Plastic Package
Tab at
−V
S
. Do not use to conduct current.
+V
S
3
+In
4
NC
2
1
Current
Sense
–In
5
8
6
–V
S
7
NC
Output
Drive
R
CL
2
V
O
4
3
5
6
NC
Output
Drive
7
8
9
NC
Current
Sense
R
CL
V
O
10
11
1
+In
−In
−V
S
+V
S
2
OPA541
www.ti.com
SBOS153A
ELECTRICAL CHARACTERISTICS
At T
C
= +25°C and V
S
=
±35VDC,
unless otherwise noted.
OPA541AM/AP
PARAMETER
INPUT OFFSET VOLTAGE
V
OS
vs Temperature
vs Supply Voltage
vs Power
INPUT BIAS CURRENT
I
B
INPUT OFFSET CURRENT
I
OS
Specified Temperature Range
INPUT CHARACTERISTICS
Common-Mode Voltage Range
Common-Mode Rejection
Input Capacitance
Input Impedance, DC
GAIN CHARACTERISTICS
Open Loop Gain at 10Hz
Gain-Bandwidth Product
OUTPUT
Voltage Swing
Specified Temperature Range
V
CM
= (|±V
S
| – 6V)
±(|V
S
| – 6)
95
±(|V
S
| – 3)
113
5
1
97
1.6
±(|V
S
| – 4.5)
±(|V
S
| – 3.6)
±(|V
S
| – 3.2)
10
10
55
2
SOA
(1)
40
±10
±30
20
2.5
3
40
40
–25
+85
–55
+125
±35
25
±35
±40
CONDITIONS
MIN
TYP
±2
±20
±2.5
±20
4
±1
MAX
±10
±40
±10
±60
50
±30
5
OPA541BM/SM
MIN
TYP
±0.1
±15
MAX
±1
±30
UNITS
mV
µV/°C
µV/V
µV/W
pA
pA
nA
V
dB
pF
TΩ
dB
MHz
V
V
V
A
V/µs
kHz
µs
nF
Degrees
V
mA
°C/W
°C/W
°C/W
°C/W
°C
°C
Specified Temperature Range
V
S
=
±10V
to
±V
MAX
R
L
= 6Ω
90
I
O
= 5A, Continuous
I
O
= 2A
I
O
= 0.5A
Current, Peak
AC PERFORMANCE
Slew Rate
Power Bandwidth
Settling Time to 0.1%
Capacitive Load
Phase Margin
POWER SUPPLY
Power Supply Voltage,
±V
S
Current, Quiescent
THERMAL RESISTANCE
θ
JC
(Junction-to-Case)
(2)
θ
JC(2)
θ
JA
(Junction-to-Ambient)
OPA541AP (Plastic)
TEMPERATURE RANGE
T
CASE
±(|V
S
| – 5.5)
±(|V
S
| – 4.5)
±(|V
S
| – 4)
9
6
45
3.3
R
L
= 8Ω, V
O
= 20Vrms
2V Step
Specified Temperature Range, G = 1
Specified Temperature Range, G >10
Specified Temperature Range, R
L
= 8Ω
Specified Temperature Range
AC Output f > 60Hz
DC Output
No Heat Sink
AM, BM, AP
SM
Specification same as OPA541AM/AP.
NOTE: (1) SOA is the Safe Operating Area shown in Figure 1. (2) Plastic package may require insulator which typically adds 1°C/W.
OPA541
SBOS153A
www.ti.com
3
TYPICAL CHARACTERISTICS
At T
A
= +25°C, V
S
=
±35VDC,
unless otherwise noted.
INPUT BIAS CURRENT
vs TEMPERATURE
100
OPEN-LOOP GAIN AND PHASE
vs FREQUENCY
110
90
Voltage Gain (dB)
Input Bias Current (nA)
10
70
50
30
10
1
Z
L
= 3.3nF
Gain
Z
L
= 2k
0.1
0.01
Z
L
= 3.3nF
0.001
–25
–10
0
25
50
75
100
125
1
10
100
1k
10k
100k
1M
10M
Temperature (°C)
Frequency (Hz)
NORMALIZED QUIESCENT CURRENT
vs TOTAL POWER SUPPLY VOLTAGE
1.3
1.2
6
5
OUTPUT VOLTAGE SWING
vs OUTPUT CURRENT
|±V
S
| – |V
OUT
| (V)
Normalized I
Q
1.1
T
C
= –25°C
1
0.9
0.8
0.7
0.6
20
30
40
50
60
70
80
90
+V
S
+ |–V
S
| (V)
T
C
= +125°C
T
C
= +25°C
(+V
S
) – V
O
4
3
2
1
0
0
1
2
3
4
5
I
OUT
(A)
6
7
8
9
10
|–V
S
| – |V
O
|
VOLTAGE NOISE DENSITY
vs FREQUENCY
1k
TOTAL HARMONIC DISTORTION + NOISE
vs FREQUENCY
10
Voltage Noise Density (nV/√Hz)
1
THD + Noise (%)
P = 100mW
O
0.1
P = 5W
O
P
O
= 50W
A
V
= –5
100
0.01
10
1
10
100
1k
10k
100k
Frequency (Hz)
0.001
10
100
1k
Frequency (Hz)
10k
100k
4
OPA541
www.ti.com
SBOS153A
Phase (Degrees)
Phase
Z
L
= 2k
0
–45
–90
–135
–180
TYPICAL CHARACTERISTICS
At T
A
= +25°C, V
S
=
±35VDC,
unless otherwise noted.
(Cont)
CURRENT LIMIT
vs RESISTANCE LIMIT
10
Power Plastic
TO-3
10
CURRENT LIMIT vs RESISTANCE LIMIT
vs TEMPERATURE
Power Plastic at –25°C
Power Plastic at +85°C
TO-3 at –25°C
TO-3 at +85°C
I
LIMIT
(A)
I
LIMIT
(A)
1
1
NOTE: These are averaged values.
–I
OUT
is typically 10% higher.
+I
OUT
is typically 10% lower.
0.1
0.01
0.1
0.01
NOTE: These are averaged values.
–I
OUT
is typically 10% higher.
+I
OUT
is typically 10% lower.
0.1
R
CL
(
)
1
10
0.1
R
CL
(
)
1
10
COMMON-MODE REJECTION
vs FREQUENCY
120
110
100
Voltage (2V/division)
DYNAMIC RESPONSE
CMRR (dB)
90
80
70
60
50
10
100
1k
10k
100k
1M
Time (1µs/division)
Frequency (Hz)
OPA541
SBOS153A
www.ti.com
5
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参数对比
与OPA541SM-BI相近的元器件有:OPA541AM-BI。描述及对比如下:
型号 OPA541SM-BI OPA541AM-BI
描述 Operational Amplifier, 1 Func, 1000uV Offset-Max, BIPolar, MBFM8, HERMETIC SEALED, TO-3, 8 PIN Operational Amplifier, 1 Func, 10000uV Offset-Max, BIPolar, MBFM8, HERMETIC SEALED, TO-3, 8 PIN
是否Rohs认证 不符合 不符合
厂商名称 Burr-Brown Burr-Brown
包装说明 TO-3, CAN8/9,.5FL TO-3, CAN8/9,.5FL
Reach Compliance Code unknown unknown
放大器类型 OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
架构 VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
最大平均偏置电流 (IIB) 0.00005 µA 0.00005 µA
25C 时的最大偏置电流 (IIB) 0.00005 µA 0.00005 µA
标称共模抑制比 113 dB 113 dB
频率补偿 YES YES
最大输入失调电压 1000 µV 10000 µV
JESD-30 代码 O-MBFM-P8 O-MBFM-P8
JESD-609代码 e0 e0
低-偏置 YES YES
低-失调 NO NO
微功率 NO NO
负供电电压上限 -40 V -40 V
标称负供电电压 (Vsup) -35 V -35 V
功能数量 1 1
端子数量 8 8
最高工作温度 125 °C 85 °C
最低工作温度 -55 °C -25 °C
封装主体材料 METAL METAL
封装代码 TO-3 TO-3
封装等效代码 CAN8/9,.5FL CAN8/9,.5FL
封装形状 ROUND ROUND
封装形式 FLANGE MOUNT FLANGE MOUNT
功率 YES YES
电源 +-35 V +-35 V
可编程功率 NO NO
认证状态 Not Qualified Not Qualified
最小摆率 6 V/us 6 V/us
标称压摆率 10 V/us 10 V/us
最大压摆率 25 mA 25 mA
供电电压上限 40 V 40 V
标称供电电压 (Vsup) 35 V 35 V
表面贴装 NO NO
技术 BIPOLAR BIPOLAR
温度等级 MILITARY OTHER
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 PIN/PEG PIN/PEG
端子位置 BOTTOM BOTTOM
标称均一增益带宽 1600 kHz 1600 kHz
最小电压增益 32000 32000
宽带 NO NO
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