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OPA676KGQ

Operational Amplifier, 1 Func, 1000uV Offset-Max, BIPolar, CDIP16,

器件类别:模拟混合信号IC    放大器电路   

厂商名称:Burr-Brown

厂商官网:http://www.burr-brown.com/

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
Burr-Brown
Reach Compliance Code
unknown
放大器类型
OPERATIONAL AMPLIFIER
架构
VOLTAGE-FEEDBACK
最大平均偏置电流 (IIB)
50 µA
25C 时的最大偏置电流 (IIB)
30 µA
标称共模抑制比
85 dB
频率补偿
NO
最大输入失调电压
1000 µV
JESD-30 代码
R-CDIP-T16
JESD-609代码
e0
低-失调
NO
负供电电压上限
-7 V
标称负供电电压 (Vsup)
-5 V
功能数量
1
端子数量
16
最高工作温度
70 °C
最低工作温度
封装主体材料
CERAMIC, METAL-SEALED COFIRED
封装代码
DIP
封装等效代码
DIP16,.3
封装形状
RECTANGULAR
封装形式
IN-LINE
电源
+-5 V
认证状态
Not Qualified
最小摆率
240 V/us
标称压摆率
240 V/us
最大压摆率
30 mA
供电电压上限
7 V
标称供电电压 (Vsup)
5 V
表面贴装
NO
技术
BIPOLAR
温度等级
COMMERCIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
THROUGH-HOLE
端子节距
2.54 mm
端子位置
DUAL
最小电压增益
2000
宽带
YES
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参数对比
与OPA676KGQ相近的元器件有:OPA676JGQ、OPA676SGQ、OPA675KGQ、OPA675SGQ、OPA675JGQ、OPA675AD、OPA676AD、OPA675RG、OPA676RG。描述及对比如下:
型号 OPA676KGQ OPA676JGQ OPA676SGQ OPA675KGQ OPA675SGQ OPA675JGQ OPA675AD OPA676AD OPA675RG OPA676RG
描述 Operational Amplifier, 1 Func, 1000uV Offset-Max, BIPolar, CDIP16, Operational Amplifier, 1 Func, 2000uV Offset-Max, BIPolar, CDIP16, Operational Amplifier, 1 Func, 2000uV Offset-Max, BIPolar, CDIP16, Operational Amplifier, 1 Func, 1000uV Offset-Max, BIPolar, CDIP16, Operational Amplifier, 1 Func, 2000uV Offset-Max, BIPolar, CDIP16, Operational Amplifier, 1 Func, 2000uV Offset-Max, BIPolar, CDIP16, Operational Amplifier, 1 Func, BIPolar, Operational Amplifier, 1 Func, BIPolar, Operational Amplifier, 1 Func, BIPolar, CDIP16, Operational Amplifier, 1 Func, BIPolar, CDIP16,
厂商名称 Burr-Brown Burr-Brown Burr-Brown Burr-Brown Burr-Brown Burr-Brown Burr-Brown Burr-Brown Burr-Brown Burr-Brown
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown unknown
放大器类型 OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
架构 VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
频率补偿 NO NO NO NO NO NO NO NO NO NO
低-失调 NO NO NO NO NO NO NO NO NO NO
标称负供电电压 (Vsup) -5 V -5 V -5 V -5 V -5 V -5 V -5 V -5 V -5 V -5 V
功能数量 1 1 1 1 1 1 1 1 1 1
最高工作温度 70 °C 70 °C 125 °C 70 °C 125 °C 70 °C 85 °C 85 °C 125 °C 125 °C
最低工作温度 - - -55 °C - -55 °C - -25 °C -25 °C -55 °C -55 °C
封装等效代码 DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3 DIE OR CHIP DIE OR CHIP DIP16,.3 DIP16,.3
电源 +-5 V +-5 V +-5 V +-5 V +-5 V +-5 V +-5 V +-5 V +-5 V +-5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
最大压摆率 30 mA 30 mA 30 mA 30 mA 30 mA 30 mA 30 mA 30 mA 30 mA 30 mA
供电电压上限 7 V 7 V 7 V 7 V 7 V 7 V 7 V 7 V 7 V 7 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
技术 BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR
温度等级 COMMERCIAL COMMERCIAL MILITARY COMMERCIAL MILITARY COMMERCIAL OTHER OTHER MILITARY MILITARY
最小电压增益 2000 2000 2000 2000 2000 2000 2000 2000 2000 2000
宽带 YES YES YES YES YES YES YES YES YES YES
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 - - 不符合 不符合
最大平均偏置电流 (IIB) 50 µA 50 µA 50 µA 50 µA 50 µA 50 µA - - - -
25C 时的最大偏置电流 (IIB) 30 µA 35 µA 35 µA 30 µA 35 µA 35 µA - - - -
标称共模抑制比 85 dB 100 dB 100 dB 85 dB 100 dB 100 dB - - - -
最大输入失调电压 1000 µV 2000 µV 2000 µV 1000 µV 2000 µV 2000 µV - - - -
JESD-30 代码 R-CDIP-T16 R-CDIP-T16 R-CDIP-T16 R-CDIP-T16 R-CDIP-T16 R-CDIP-T16 - - R-XDIP-T16 R-XDIP-T16
JESD-609代码 e0 e0 e0 e0 e0 e0 - - e0 e0
负供电电压上限 -7 V -7 V -7 V -7 V -7 V -7 V - - - -
端子数量 16 16 16 16 16 16 - - 16 16
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED - - CERAMIC CERAMIC
封装代码 DIP DIP DIP DIP DIP DIP - - DIP DIP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR - - RECTANGULAR RECTANGULAR
封装形式 IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE - - IN-LINE IN-LINE
最小摆率 240 V/us 200 V/us 200 V/us 240 V/us 200 V/us 200 V/us - - - -
标称压摆率 240 V/us 350 V/us 350 V/us 240 V/us 350 V/us 350 V/us - - - -
表面贴装 NO NO NO NO NO NO - - NO NO
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE - - THROUGH-HOLE THROUGH-HOLE
端子节距 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm - - 2.54 mm 2.54 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL - - DUAL DUAL
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